IT8349397A0 - Bagno di placcatura chimica d'oro esuo metodo d'impiego - Google Patents

Bagno di placcatura chimica d'oro esuo metodo d'impiego

Info

Publication number
IT8349397A0
IT8349397A0 IT8349397A IT4939783A IT8349397A0 IT 8349397 A0 IT8349397 A0 IT 8349397A0 IT 8349397 A IT8349397 A IT 8349397A IT 4939783 A IT4939783 A IT 4939783A IT 8349397 A0 IT8349397 A0 IT 8349397A0
Authority
IT
Italy
Prior art keywords
plating bath
gold plating
chemical gold
chemical
bath
Prior art date
Application number
IT8349397A
Other languages
English (en)
Other versions
IT1221490B (it
Inventor
Alan A Halecky
El-Shazly Mohamedf
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of IT8349397A0 publication Critical patent/IT8349397A0/it
Application granted granted Critical
Publication of IT1221490B publication Critical patent/IT1221490B/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
IT49397/83A 1982-12-01 1983-11-29 Bagno di placcatura chimica d' oro e suo metodo d' impiego IT1221490B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/445,126 US4474838A (en) 1982-12-01 1982-12-01 Electroless direct deposition of gold on metallized ceramics

Publications (2)

Publication Number Publication Date
IT8349397A0 true IT8349397A0 (it) 1983-11-29
IT1221490B IT1221490B (it) 1990-07-06

Family

ID=23767702

Family Applications (1)

Application Number Title Priority Date Filing Date
IT49397/83A IT1221490B (it) 1982-12-01 1983-11-29 Bagno di placcatura chimica d' oro e suo metodo d' impiego

Country Status (12)

Country Link
US (1) US4474838A (it)
JP (1) JPS59107069A (it)
AU (1) AU551152B2 (it)
BR (1) BR8306600A (it)
CA (1) CA1205604A (it)
DE (1) DE3343052C2 (it)
FR (1) FR2537162B1 (it)
GB (1) GB2133046B (it)
HK (1) HK85686A (it)
IT (1) IT1221490B (it)
MX (1) MX159989A (it)
NL (1) NL8304104A (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4590095A (en) * 1985-06-03 1986-05-20 General Electric Company Nickel coating diffusion bonded to metallized ceramic body and coating method
US5202151A (en) * 1985-10-14 1993-04-13 Hitachi, Ltd. Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
US5178918A (en) * 1986-07-14 1993-01-12 Robert Duva Electroless plating process
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
US4832743A (en) * 1986-12-19 1989-05-23 Lamerie, N.V. Gold plating solutions, creams and baths
DE4024764C1 (it) * 1990-08-02 1991-10-10 Schering Ag Berlin-Bergkamen, 1000 Berlin, De
US5194295A (en) * 1991-06-21 1993-03-16 General Electric Company Ceramic articles having heat-sealable metallic coatings and method of preparation
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
JP4887583B2 (ja) * 2001-08-09 2012-02-29 Ｄｏｗａメタルテック株式会社 セラミックス回路基板の製造方法
JP7457537B2 (ja) * 2020-03-06 2024-03-28 関東化学株式会社 無電解金めっき用組成物

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2654702A (en) * 1948-09-03 1953-10-06 Dow Chemical Co Electrodepostion of metal from alkaline cyanide bath
US3214292A (en) * 1962-09-12 1965-10-26 Western Electric Co Gold plating
US3862850A (en) * 1973-06-08 1975-01-28 Ceramic Systems Electroless gold plating on refractory metals
US3917885A (en) * 1974-04-26 1975-11-04 Engelhard Min & Chem Electroless gold plating process
US4082908A (en) * 1976-05-05 1978-04-04 Burr-Brown Research Corporation Gold plating process and product produced thereby
FR2441666A1 (fr) * 1978-11-16 1980-06-13 Prost Tournier Patrick Procede de depot chimique d'or par reduction autocatalytique
JPS5729545A (en) * 1980-07-30 1982-02-17 Sumitomo Chem Co Ltd Fiber reinforced metallic composite material
DE3029785A1 (de) * 1980-08-04 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures goldbad zur stromlosen abscheidung von gold
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
JPS5817256A (ja) * 1981-07-24 1983-02-01 Hitachi Ltd 圧力容器

Also Published As

Publication number Publication date
BR8306600A (pt) 1984-07-10
GB8332076D0 (en) 1984-01-11
IT1221490B (it) 1990-07-06
MX159989A (es) 1989-10-20
NL8304104A (nl) 1984-07-02
GB2133046B (en) 1985-11-20
DE3343052C2 (de) 1985-10-03
FR2537162B1 (fr) 1986-12-19
FR2537162A1 (fr) 1984-06-08
JPH0356310B2 (it) 1991-08-27
US4474838A (en) 1984-10-02
AU2186683A (en) 1984-06-07
AU551152B2 (en) 1986-04-17
DE3343052A1 (de) 1984-06-07
CA1205604A (en) 1986-06-10
HK85686A (en) 1986-11-21
GB2133046A (en) 1984-07-18
JPS59107069A (ja) 1984-06-21

Similar Documents

Publication Publication Date Title
IT1189239B (it) Bagno e procedimento per placcatura d'oro autocatalitica
IT8248548A0 (it) Bagno e procedimento per il deposito anelettrolitico di oro su sostrati
IT8448693A0 (it) Bagno e procedimento per elettroplaccature zinco e lega di zinco
IT1196672B (it) Apparecchiatura e metodo di elettro placcatura
FR2577942B1 (fr) Traitement d'alliages de cuivre
FR2502642B1 (fr) Nouvel alliage au magnesium contenant de l'yttrium et du neodyme
IT8448694A0 (it) Bagno e procedimento di elettroplaccatura di lega di zinco/ferro
IT1171818B (it) Bagno di placcatura chimica di oro e metodo di placcatura chimica di oro
IT8248133A0 (it) Bagno di elettroplaccatura di stagno e leghe di stagno e relativo impiego
IT8349397A0 (it) Bagno di placcatura chimica d'oro esuo metodo d'impiego
BR8605811A (pt) Banho de passivacao e emprego
IT8348009A0 (it) Procedimento e bagno per l'elettroplaccatura di nickel con impiego di cumarina
IT8122983A0 (it) Bagno d'oro acido per la deposizione non elettrolitica dell'oro.
BE891319A (fr) Electrodeposition du palladium et d'alliages de palladium
FR2566431B1 (fr) Traitement d'alliages de cuivre
BE895268A (fr) Traitement des bains d'electrodeposition
JPS5534697A (en) Electroplating bath of gold alloy and method
IT1205633B (it) Procedimento e bagno per il fissaggio dell' alluminio e leghe d'alluminio a seguito del trattamento di anodizzazione
IT1189337B (it) Bagno e procedimento per l'elettrodeposizione di leghe di stagno-piombo
IT8247798A0 (it) Bagno e procedimento per elettrodepositare oro
IT1160454B (it) Metodo e bagno per la deposizione dell'oro per riduzione
GB8625720D0 (en) Magnetic treatment of flowing liquid
FR2639654B1 (fr) Bain de dorure autocatalytique et son procede d'utilisation
IT1171598B (it) Bagno e procedimento per elettro placcatura al nickel a elevata velocita'
IT8447502A0 (it) Bagno e metodo di elettroplaccatura di leghe d'oro