IT8323707A0 - WIRING SUBSTRATE, PROCEDURE FOR ITS MANUFACTURE, AND SEMICONDUCTOR DEVICE USING THE SUBSTRATE ITSELF. - Google Patents

WIRING SUBSTRATE, PROCEDURE FOR ITS MANUFACTURE, AND SEMICONDUCTOR DEVICE USING THE SUBSTRATE ITSELF.

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Publication number
IT8323707A0
IT8323707A0 IT8323707A IT2370783A IT8323707A0 IT 8323707 A0 IT8323707 A0 IT 8323707A0 IT 8323707 A IT8323707 A IT 8323707A IT 2370783 A IT2370783 A IT 2370783A IT 8323707 A0 IT8323707 A0 IT 8323707A0
Authority
IT
Italy
Prior art keywords
substrate
procedure
manufacture
semiconductor device
wiring substrate
Prior art date
Application number
IT8323707A
Other languages
Italian (it)
Other versions
IT1166544B (en
Inventor
Kanji Otsuka
Tamotsu Usami
Kousuke Nakamura
Masatoshi Seki
Kunizo Sahara
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of IT8323707A0 publication Critical patent/IT8323707A0/en
Application granted granted Critical
Publication of IT1166544B publication Critical patent/IT1166544B/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
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    • H01L2924/013—Alloys
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1028—Thin metal strips as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0235—Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
IT2370783A 1982-11-12 1983-11-14 WIRING SUBSTRATE, PROCEDURE FOR ITS MANUFACTURE, AND A SEMICONDUCTOR DEVICE USING THE SAME SUBSTRATE IT1166544B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197519A JPS5987893A (en) 1982-11-12 1982-11-12 Circuit board, method of producing same and semiconductor device using same

Publications (2)

Publication Number Publication Date
IT8323707A0 true IT8323707A0 (en) 1983-11-14
IT1166544B IT1166544B (en) 1987-05-06

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IT2370783A IT1166544B (en) 1982-11-12 1983-11-14 WIRING SUBSTRATE, PROCEDURE FOR ITS MANUFACTURE, AND A SEMICONDUCTOR DEVICE USING THE SAME SUBSTRATE

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Country Link
JP (1) JPS5987893A (en)
KR (1) KR840006747A (en)
DE (1) DE3340926A1 (en)
FR (1) FR2536209A1 (en)
GB (1) GB2132411B (en)
HK (1) HK688A (en)
IT (1) IT1166544B (en)
MY (1) MY8700803A (en)
SG (1) SG88987G (en)

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FR2561456A1 (en) * 1984-03-16 1985-09-20 Thomson Csf Method of fabricating substrates with transverse electrical connection studs
US4665468A (en) * 1984-07-10 1987-05-12 Nec Corporation Module having a ceramic multi-layer substrate and a multi-layer circuit thereupon, and process for manufacturing the same
US4617730A (en) * 1984-08-13 1986-10-21 International Business Machines Corporation Method of fabricating a chip interposer
FR2575331B1 (en) * 1984-12-21 1987-06-05 Labo Electronique Physique HOUSING FOR ELECTRONIC COMPONENT
US4866507A (en) * 1986-05-19 1989-09-12 International Business Machines Corporation Module for packaging semiconductor integrated circuit chips on a base substrate
DE3630066C1 (en) * 1986-09-04 1988-02-04 Heraeus Gmbh W C Process for the production of sintered metallized aluminum nitride ceramic bodies
GB2209867B (en) * 1987-09-16 1990-12-19 Advanced Semiconductor Package Method of forming an integrated circuit chip carrier
US4880684A (en) * 1988-03-11 1989-11-14 International Business Machines Corporation Sealing and stress relief layers and use thereof
US5038252A (en) * 1989-01-26 1991-08-06 Teradyne, Inc. Printed circuit boards with improved electrical current control
JP3442895B2 (en) * 1994-07-04 2003-09-02 新光電気工業株式会社 Sintered body for substrate production, substrate and method for producing the same
JPH10308565A (en) * 1997-05-02 1998-11-17 Shinko Electric Ind Co Ltd Wiring board
US6563210B2 (en) 2000-12-19 2003-05-13 Intel Corporation Parallel plane substrate
US7026223B2 (en) * 2002-03-28 2006-04-11 M/A-Com, Inc Hermetic electric component package
FR2976720A1 (en) * 2011-06-15 2012-12-21 St Microelectronics Sa METHOD FOR ELECTRICAL CONNECTION BETWEEN ELEMENTS OF A THREE DIMENSIONAL INTEGRATED STRUCTURE, AND CORRESPONDING DEVICE

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DE1141029B (en) * 1960-06-23 1962-12-13 Siemens Ag Semiconductor device and method for its manufacture
GB1163785A (en) * 1965-12-22 1969-09-10 Texas Instruments Inc Composite Header for a Semiconductor Device
US3566208A (en) * 1968-02-02 1971-02-23 Fairchild Camera Instr Co Pin socket
DE1764262A1 (en) * 1968-05-06 1971-07-01 Siemens Ag Semiconductor arrangement that is firmly attached to a base
US3577037A (en) * 1968-07-05 1971-05-04 Ibm Diffused electrical connector apparatus and method of making same
JPS5128829B1 (en) * 1968-10-21 1976-08-21
US3872583A (en) * 1972-07-10 1975-03-25 Amdahl Corp LSI chip package and method
US4109377A (en) * 1976-02-03 1978-08-29 International Business Machines Corporation Method for preparing a multilayer ceramic
CA1079309A (en) * 1976-11-26 1980-06-10 The Carborundum Company Beryllium containing silicon carbide powder composition
US4123286A (en) * 1976-12-27 1978-10-31 The Carborundum Company Silicon carbide powder compositions
JPS55143042A (en) * 1979-04-25 1980-11-08 Hitachi Ltd Semiconductor device
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
DE3064598D1 (en) * 1979-11-05 1983-09-22 Hitachi Ltd Electrically insulating substrate and a method of making such a substrate
US4322778A (en) * 1980-01-25 1982-03-30 International Business Machines Corp. High performance semiconductor package assembly
US4256792A (en) * 1980-01-25 1981-03-17 Honeywell Inc. Composite electronic substrate of alumina uniformly needled through with aluminum nitride

Also Published As

Publication number Publication date
JPS5987893A (en) 1984-05-21
MY8700803A (en) 1987-12-31
GB2132411B (en) 1986-08-20
GB2132411A (en) 1984-07-04
IT1166544B (en) 1987-05-06
SG88987G (en) 1988-06-03
DE3340926A1 (en) 1984-07-12
FR2536209A1 (en) 1984-05-18
HK688A (en) 1988-01-15
KR840006747A (en) 1984-12-01
GB8329757D0 (en) 1983-12-14

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