IT7819175A0 - MULTI-LAYER PASSIVATION STRUCTURE AND MANUFACTURING METHOD THEREOF. - Google Patents
MULTI-LAYER PASSIVATION STRUCTURE AND MANUFACTURING METHOD THEREOF.Info
- Publication number
- IT7819175A0 IT7819175A0 IT7819175A IT1917578A IT7819175A0 IT 7819175 A0 IT7819175 A0 IT 7819175A0 IT 7819175 A IT7819175 A IT 7819175A IT 1917578 A IT1917578 A IT 1917578A IT 7819175 A0 IT7819175 A0 IT 7819175A0
- Authority
- IT
- Italy
- Prior art keywords
- manufacturing
- passivation structure
- layer passivation
- layer
- passivation
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000002161 passivation Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/0217—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon nitride not containing oxygen, e.g. SixNy or SixByNz
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02178—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing aluminium, e.g. Al2O3
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Formation Of Insulating Films (AREA)
- Semiconductor Integrated Circuits (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77174977A | 1977-02-24 | 1977-02-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7819175A0 true IT7819175A0 (en) | 1978-01-11 |
IT1092729B IT1092729B (en) | 1985-07-12 |
Family
ID=25092854
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT19175/78A IT1092729B (en) | 1977-02-24 | 1978-01-11 | MULTI-LAYER PASSIVATION STRUCTURE AND METHOD OF MANUFACTURE OF THE SAME |
Country Status (10)
Country | Link |
---|---|
JP (1) | JPS53105979A (en) |
BE (1) | BE864271A (en) |
DE (1) | DE2806492A1 (en) |
FR (1) | FR2382095B1 (en) |
GB (1) | GB1552760A (en) |
IN (1) | IN147578B (en) |
IT (1) | IT1092729B (en) |
PL (1) | PL117841B1 (en) |
SE (1) | SE7801092L (en) |
YU (1) | YU42276B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3021175A1 (en) * | 1980-06-04 | 1981-12-10 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PASSIVATING SILICON COMPONENTS |
FR2487576A1 (en) * | 1980-07-24 | 1982-01-29 | Thomson Csf | Glass passivated mesa diode mfr. - by forming semiconductor layers, forming furrows, depositing sipox, glass, and nickel then dicing |
JPS60208886A (en) * | 1984-03-31 | 1985-10-21 | 株式会社東芝 | Method of producing electronic part |
US4826733A (en) * | 1986-12-03 | 1989-05-02 | Dow Corning Corporation | Sin-containing coatings for electronic devices |
FR2625839B1 (en) * | 1988-01-13 | 1991-04-26 | Sgs Thomson Microelectronics | PROCESS FOR PASSIVATING AN INTEGRATED CIRCUIT |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1250099A (en) * | 1969-04-14 | 1971-10-20 | ||
JPS532552B2 (en) * | 1974-03-30 | 1978-01-28 | ||
US3895127A (en) * | 1974-04-19 | 1975-07-15 | Rca Corp | Method of selectively depositing glass on semiconductor devices |
JPS6022497B2 (en) * | 1974-10-26 | 1985-06-03 | ソニー株式会社 | semiconductor equipment |
NL7500492A (en) * | 1975-01-16 | 1976-07-20 | Philips Nv | PROCESS FOR THE MANUFACTURE OF SEMI-GUIDE DEVICES, IN WHICH A GLASS COVER IS APPLIED, AND SEMI-GUIDE DEVICES MANUFACTURED ACCORDING TO THIS PROCESS. |
JPS6041458B2 (en) * | 1975-04-21 | 1985-09-17 | ソニー株式会社 | Manufacturing method of semiconductor device |
-
1978
- 1978-01-02 IN IN3/CAL/78A patent/IN147578B/en unknown
- 1978-01-11 IT IT19175/78A patent/IT1092729B/en active
- 1978-01-27 YU YU192/78A patent/YU42276B/en unknown
- 1978-01-30 SE SE7801092A patent/SE7801092L/en unknown
- 1978-02-16 GB GB6179/78A patent/GB1552760A/en not_active Expired
- 1978-02-16 DE DE19782806492 patent/DE2806492A1/en not_active Ceased
- 1978-02-17 FR FR7804587A patent/FR2382095B1/en not_active Expired
- 1978-02-21 JP JP1960178A patent/JPS53105979A/en active Granted
- 1978-02-22 PL PL1978204821A patent/PL117841B1/en unknown
- 1978-02-23 BE BE185439A patent/BE864271A/en unknown
Also Published As
Publication number | Publication date |
---|---|
SE7801092L (en) | 1978-08-25 |
FR2382095A1 (en) | 1978-09-22 |
IN147578B (en) | 1980-04-19 |
BE864271A (en) | 1978-06-16 |
JPS53105979A (en) | 1978-09-14 |
DE2806492A1 (en) | 1978-08-31 |
PL117841B1 (en) | 1981-08-31 |
FR2382095B1 (en) | 1985-10-18 |
IT1092729B (en) | 1985-07-12 |
YU42276B (en) | 1988-08-31 |
GB1552760A (en) | 1979-09-19 |
YU19278A (en) | 1982-06-30 |
PL204821A1 (en) | 1978-11-06 |
JPS5626981B2 (en) | 1981-06-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19960129 |