IT201700044301A1 - Sensore di sforzo per il monitoraggio dello stato di salute di strutture fabbricate quali costruzioni, edifici, infrastrutture e simili - Google Patents
Sensore di sforzo per il monitoraggio dello stato di salute di strutture fabbricate quali costruzioni, edifici, infrastrutture e similiInfo
- Publication number
- IT201700044301A1 IT201700044301A1 IT102017000044301A IT201700044301A IT201700044301A1 IT 201700044301 A1 IT201700044301 A1 IT 201700044301A1 IT 102017000044301 A IT102017000044301 A IT 102017000044301A IT 201700044301 A IT201700044301 A IT 201700044301A IT 201700044301 A1 IT201700044301 A1 IT 201700044301A1
- Authority
- IT
- Italy
- Prior art keywords
- infrastructure
- buildings
- monitoring
- construction
- health status
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/005—Measuring force or stress, in general by electrical means and not provided for in G01L1/06 - G01L1/22
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L25/00—Testing or calibrating of apparatus for measuring force, torque, work, mechanical power, or mechanical efficiency
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
- G01L5/162—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of piezoresistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
- G01M5/0041—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
- G01M5/0083—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by measuring variation of impedance, e.g. resistance, capacitance, induction
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Measuring Fluid Pressure (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000044301A IT201700044301A1 (it) | 2017-04-21 | 2017-04-21 | Sensore di sforzo per il monitoraggio dello stato di salute di strutture fabbricate quali costruzioni, edifici, infrastrutture e simili |
EP18163479.1A EP3392637B1 (en) | 2017-04-21 | 2018-03-22 | Stress sensor for monitoring the health state of fabricated structures such as constructions, buildings, infrastructures and the like |
US15/957,819 US10935444B2 (en) | 2017-04-21 | 2018-04-19 | Stress sensor for monitoring the health state of fabricated structures such as constructions, buildings, infrastructures and the like |
CN201820582425.1U CN208847373U (zh) | 2017-04-21 | 2018-04-23 | 应力传感器和负载检测*** |
CN201810369108.6A CN108801503B (zh) | 2017-04-21 | 2018-04-23 | 用于监视装配式结构的健康状况的应力传感器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT102017000044301A IT201700044301A1 (it) | 2017-04-21 | 2017-04-21 | Sensore di sforzo per il monitoraggio dello stato di salute di strutture fabbricate quali costruzioni, edifici, infrastrutture e simili |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201700044301A1 true IT201700044301A1 (it) | 2018-10-21 |
Family
ID=59683986
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102017000044301A IT201700044301A1 (it) | 2017-04-21 | 2017-04-21 | Sensore di sforzo per il monitoraggio dello stato di salute di strutture fabbricate quali costruzioni, edifici, infrastrutture e simili |
Country Status (4)
Country | Link |
---|---|
US (1) | US10935444B2 (it) |
EP (1) | EP3392637B1 (it) |
CN (2) | CN108801503B (it) |
IT (1) | IT201700044301A1 (it) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117553700A (zh) * | 2023-12-28 | 2024-02-13 | 成都电科星拓科技有限公司 | 一种基于力致发光材料检测滑杆弯曲变形、应力的方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT201700044301A1 (it) * | 2017-04-21 | 2018-10-21 | St Microelectronics Srl | Sensore di sforzo per il monitoraggio dello stato di salute di strutture fabbricate quali costruzioni, edifici, infrastrutture e simili |
IT201700045285A1 (it) * | 2017-04-26 | 2018-10-26 | St Microelectronics Srl | Trasduttore microelettromeccanico basato su trincea e metodo di fabbricazione del trasduttore microelettromeccanico |
US10910500B2 (en) | 2018-02-13 | 2021-02-02 | Stmicroelectronics S.R.L. | Load sensing devices, packages, and systems |
CN113242965B (zh) * | 2018-12-20 | 2022-10-14 | 深圳纽迪瑞科技开发有限公司 | 压力传感器及电子终端 |
CN112824843A (zh) * | 2019-11-21 | 2021-05-21 | 上海微创电生理医疗科技股份有限公司 | 一种应变片、压力传感器以及介入医疗导管 |
CN111397788B (zh) * | 2020-04-30 | 2021-07-16 | 大连理工大学 | 一种集成式五维力测量方法 |
JP2022100447A (ja) * | 2020-12-24 | 2022-07-06 | 横河電機株式会社 | 力検出器及び力検出システム |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110239784A1 (en) * | 2010-03-30 | 2011-10-06 | Honda Motor Co., Ltd. | Force sensor chip and acceleration sensor chip |
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JP3317084B2 (ja) | 1995-03-31 | 2002-08-19 | 株式会社豊田中央研究所 | 力検知素子およびその製造方法 |
CN101268350B (zh) * | 2005-07-22 | 2012-11-28 | 意法半导体股份有限公司 | 带有双测量刻度和高满刻度值的集成式压力传感器 |
DE602005027072D1 (de) | 2005-09-16 | 2011-05-05 | St Microelectronics Srl | Druckwandler mit akoustischen Oberflächenwellen |
US8636461B2 (en) | 2006-10-13 | 2014-01-28 | Carl L. Hammonds | Omni-directional aircraft transporter with hinged gate for moving aircraft |
KR101411416B1 (ko) | 2007-12-14 | 2014-06-26 | 삼성전자주식회사 | 마이크로 스피커 제조방법 및 이 방법에 의해 제조된마이크로 스피커 |
EP2166330A1 (en) * | 2008-09-22 | 2010-03-24 | GE Infrastructure Sensing, Inc. | Miniature pressure transducer with elongate base wafer and operable at high temperatures |
US8381596B2 (en) | 2009-12-21 | 2013-02-26 | Silicon Microstructures, Inc. | CMOS compatible pressure sensor for low pressures |
CN101832831B (zh) * | 2010-04-22 | 2015-01-28 | 无锡市纳微电子有限公司 | 一种压阻传感器芯片及其制作方法 |
US8316718B2 (en) | 2010-08-23 | 2012-11-27 | Freescale Semiconductor, Inc. | MEMS pressure sensor device and method of fabricating same |
CN102175305B (zh) * | 2011-01-24 | 2013-05-15 | 中北大学 | 一种单片集成三维矢量振动传感器 |
US9550669B2 (en) | 2012-02-08 | 2017-01-24 | Infineon Technologies Ag | Vertical pressure sensitive structure |
WO2013192539A1 (en) * | 2012-06-21 | 2013-12-27 | Nextinput, Inc. | Wafer level mems force dies |
CN202974521U (zh) | 2012-12-18 | 2013-06-05 | 无锡莱顿电子有限公司 | 基于陶瓷基底应变片的力敏传感器 |
US9676614B2 (en) | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
CN103398807B (zh) | 2013-08-12 | 2016-04-20 | 中交一公局土木工程建筑研究院有限公司 | 一种新型三维应力测量传感器 |
CN103575446B (zh) | 2013-10-11 | 2016-04-27 | 南京神源生智能科技有限公司 | 一种中等量程三维力传感器 |
CN103954382B (zh) * | 2014-05-14 | 2016-02-24 | 合肥工业大学 | 一种变介质式电容柔性三维力触觉传感器 |
US10167189B2 (en) | 2014-09-30 | 2019-01-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
US20180074090A1 (en) | 2015-03-18 | 2018-03-15 | Motion Engine Inc. | Multiple degree of freedom mems sensor chip and method for fabricating the same |
DE102015104410B4 (de) | 2015-03-24 | 2018-09-13 | Tdk-Micronas Gmbh | Drucksensor |
CN106197776B (zh) | 2015-05-27 | 2019-11-05 | 意法半导体股份有限公司 | 压力传感器、压力测量设备、制动***和测量压力的方法 |
CN106257254B (zh) | 2015-06-22 | 2020-03-20 | 意法半导体股份有限公司 | 生成具有降低的环境温度依赖性的换能信号的压力传感器及其制造方法 |
CN105241600B (zh) | 2015-08-17 | 2017-12-29 | 中国科学院地质与地球物理研究所 | 一种mems压力计芯片及其制造工艺 |
CN205449351U (zh) * | 2015-12-30 | 2016-08-10 | 陕西电器研究所 | 一种小型三维力传感器 |
US10549982B2 (en) * | 2016-02-15 | 2020-02-04 | Stmicroelectronics S.R.L. | Pressure sensor encapsulated in elastomeric material, and system including the pressure sensor |
CN105973521B (zh) * | 2016-07-08 | 2019-03-08 | 中国电子科技集团公司第二十一研究所 | 三维压力传感器 |
CN205826188U (zh) | 2016-07-08 | 2016-12-21 | 中国电子科技集团公司第二十一研究所 | 三维压力传感器 |
WO2018025434A1 (ja) * | 2016-08-01 | 2018-02-08 | アルプス電気株式会社 | 圧力センサおよび圧力センサモジュール |
IT201700019426A1 (it) | 2017-02-21 | 2018-08-21 | St Microelectronics Srl | Sensore di forza/pressione microelettromeccanico scalabile piezoresistivo di tipo bulk |
IT201700044301A1 (it) | 2017-04-21 | 2018-10-21 | St Microelectronics Srl | Sensore di sforzo per il monitoraggio dello stato di salute di strutture fabbricate quali costruzioni, edifici, infrastrutture e simili |
IT201700045285A1 (it) | 2017-04-26 | 2018-10-26 | St Microelectronics Srl | Trasduttore microelettromeccanico basato su trincea e metodo di fabbricazione del trasduttore microelettromeccanico |
IT201700071798A1 (it) | 2017-06-27 | 2018-12-27 | St Microelectronics Srl | Sensore di forza multiassiale, metodo di fabbricazione del sensore di forza multiassiale, e metodo di funzionamento del sensore di forza multiassiale |
EP3450947B1 (en) * | 2017-09-05 | 2024-01-17 | IMEC vzw | Stress sensor for semiconductor components |
-
2017
- 2017-04-21 IT IT102017000044301A patent/IT201700044301A1/it unknown
-
2018
- 2018-03-22 EP EP18163479.1A patent/EP3392637B1/en active Active
- 2018-04-19 US US15/957,819 patent/US10935444B2/en active Active
- 2018-04-23 CN CN201810369108.6A patent/CN108801503B/zh active Active
- 2018-04-23 CN CN201820582425.1U patent/CN208847373U/zh not_active Withdrawn - After Issue
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110239784A1 (en) * | 2010-03-30 | 2011-10-06 | Honda Motor Co., Ltd. | Force sensor chip and acceleration sensor chip |
Non-Patent Citations (1)
Title |
---|
EUN-SOO HWANG ET AL: "A Polymer-Based Flexible Tactile Sensor for Both Normal and Shear Load Detections and Its Application for Robotics", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE SERVICE CENTER, US, vol. 16, no. 3, 1 June 2007 (2007-06-01), pages 556 - 563, XP011187750, ISSN: 1057-7157, DOI: 10.1109/JMEMS.2007.896716 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117553700A (zh) * | 2023-12-28 | 2024-02-13 | 成都电科星拓科技有限公司 | 一种基于力致发光材料检测滑杆弯曲变形、应力的方法 |
CN117553700B (zh) * | 2023-12-28 | 2024-04-02 | 成都电科星拓科技有限公司 | 一种基于力致发光材料检测滑杆弯曲变形、应力的方法 |
Also Published As
Publication number | Publication date |
---|---|
CN108801503B (zh) | 2021-05-25 |
EP3392637B1 (en) | 2019-11-27 |
US10935444B2 (en) | 2021-03-02 |
US20180306656A1 (en) | 2018-10-25 |
CN208847373U (zh) | 2019-05-10 |
CN108801503A (zh) | 2018-11-13 |
EP3392637A1 (en) | 2018-10-24 |
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