IT201600086345A1 - Sensore di gas - Google Patents
Sensore di gasInfo
- Publication number
- IT201600086345A1 IT201600086345A1 IT102016000086345A IT201600086345A IT201600086345A1 IT 201600086345 A1 IT201600086345 A1 IT 201600086345A1 IT 102016000086345 A IT102016000086345 A IT 102016000086345A IT 201600086345 A IT201600086345 A IT 201600086345A IT 201600086345 A1 IT201600086345 A1 IT 201600086345A1
- Authority
- IT
- Italy
- Prior art keywords
- gas sensor
- sensor
- gas
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015216462.4A DE102015216462A1 (de) | 2015-08-28 | 2015-08-28 | Gassensor |
Publications (1)
Publication Number | Publication Date |
---|---|
IT201600086345A1 true IT201600086345A1 (it) | 2018-02-22 |
Family
ID=58010933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT102016000086345A IT201600086345A1 (it) | 2015-08-28 | 2016-08-22 | Sensore di gas |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE102015216462A1 (it) |
FR (1) | FR3040488A1 (it) |
IT (1) | IT201600086345A1 (it) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111732069A (zh) * | 2020-06-18 | 2020-10-02 | 南通智通达微电子物联网有限公司 | 气敏传感器及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19845112C2 (de) | 1998-09-30 | 2000-12-21 | Tyco Electronics Logistics Ag | Gassensor |
KR20090124011A (ko) * | 2008-05-29 | 2009-12-03 | (주)엠투엔 | 패키징 기판과 이를 포함하는 가스 센싱 장치 및 그 제조방법 |
US8169070B2 (en) * | 2009-05-15 | 2012-05-01 | Infineon Technologies Ag | Semiconductor device |
US8669655B2 (en) * | 2012-08-02 | 2014-03-11 | Infineon Technologies Ag | Chip package and a method for manufacturing a chip package |
-
2015
- 2015-08-28 DE DE102015216462.4A patent/DE102015216462A1/de not_active Withdrawn
-
2016
- 2016-08-10 FR FR1657689A patent/FR3040488A1/fr active Pending
- 2016-08-22 IT IT102016000086345A patent/IT201600086345A1/it unknown
Also Published As
Publication number | Publication date |
---|---|
DE102015216462A1 (de) | 2017-03-02 |
FR3040488A1 (fr) | 2017-03-03 |
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