IT1399914B1 - Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test. - Google Patents

Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test.

Info

Publication number
IT1399914B1
IT1399914B1 ITMI2010A000744A ITMI20100744A IT1399914B1 IT 1399914 B1 IT1399914 B1 IT 1399914B1 IT MI2010A000744 A ITMI2010A000744 A IT MI2010A000744A IT MI20100744 A ITMI20100744 A IT MI20100744A IT 1399914 B1 IT1399914 B1 IT 1399914B1
Authority
IT
Italy
Prior art keywords
circuit
integrated
wafer
test circuit
singulation
Prior art date
Application number
ITMI2010A000744A
Other languages
English (en)
Inventor
Alberto Pagani
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to ITMI2010A000744A priority Critical patent/IT1399914B1/it
Priority to US13/093,738 priority patent/US8941401B2/en
Publication of ITMI20100744A1 publication Critical patent/ITMI20100744A1/it
Application granted granted Critical
Publication of IT1399914B1 publication Critical patent/IT1399914B1/it

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/31712—Input or output aspects
    • G01R31/31716—Testing of input or output with loop-back
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/3025—Wireless interface with the DUT
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
    • G01R31/318511—Wafer Test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
ITMI2010A000744A 2010-04-29 2010-04-29 Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test. IT1399914B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITMI2010A000744A IT1399914B1 (it) 2010-04-29 2010-04-29 Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test.
US13/093,738 US8941401B2 (en) 2010-04-29 2011-04-25 Test circuit of an integrated circuit on a wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITMI2010A000744A IT1399914B1 (it) 2010-04-29 2010-04-29 Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test.

Publications (2)

Publication Number Publication Date
ITMI20100744A1 ITMI20100744A1 (it) 2011-10-30
IT1399914B1 true IT1399914B1 (it) 2013-05-09

Family

ID=43302251

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2010A000744A IT1399914B1 (it) 2010-04-29 2010-04-29 Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test.

Country Status (2)

Country Link
US (1) US8941401B2 (it)
IT (1) IT1399914B1 (it)

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US9632968B2 (en) * 2011-12-15 2017-04-25 Intel Corporation Implementing an inter-processor communication in a multi-core system using mmWave radios
US9070066B1 (en) * 2013-01-21 2015-06-30 Impinj, Inc. RFID tags with inductively coupled antennas
EP2806586B1 (en) * 2013-05-22 2017-09-06 OCT Circuit Technologies International Limited Built-in self-testing method of a near field communication device
US9891266B2 (en) 2014-02-25 2018-02-13 Taiwan Semiconductor Manufacturing Co., Ltd. Test circuit and method
US9568541B2 (en) 2014-10-28 2017-02-14 Infineon Technologies Ag Testing of semiconductor packages with integrated antennas
DE102014115886A1 (de) 2014-10-31 2016-05-04 Infineon Technologies Ag Halbleitervorrichtung mit einer hochfrequenzbasierten Identifizierungsmarkierung
KR20160104967A (ko) * 2015-02-27 2016-09-06 에스케이하이닉스 주식회사 주파수 가변형 프로브 테스트 패드를 갖는 반도체 집적 회로 장치, 이를 포함하는 반도체 시스템, 및 프로브 테스트 방법
US10247773B2 (en) * 2016-07-01 2019-04-02 Intel Corporation Systems and methods for wireless device testing
US9985733B1 (en) 2016-11-22 2018-05-29 Keysight Technologies, Inc. System and method for performing over-the-air (OTA) testing of a device under test (DUT) having an integrated transmitter-antenna assembly
US10571487B2 (en) * 2016-11-30 2020-02-25 Formfactor Beaverton, Inc. Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test
US9800355B1 (en) * 2016-12-18 2017-10-24 Keysight Technologies, Inc. System and method for performing over-the-air (OTA) testing of a device under test (DUT) having an integrated transmitter-antenna assembly using near field and intermediate field measurements
US11092643B2 (en) 2019-07-31 2021-08-17 Infineon Technologies Ag Antenna-in-package production test
CN113661396A (zh) * 2019-08-28 2021-11-16 爱德万测试公司 测试布置、自动化测试设备、和用于测试包括天线的被测装置的方法
CN112581892B (zh) * 2019-09-29 2022-03-22 昆山国显光电有限公司 显示面板及显示装置
US11662380B2 (en) * 2021-05-13 2023-05-30 Apple Inc. Built-in self-test for die-to-die physical interfaces
CN113410209B (zh) * 2021-06-09 2023-07-18 合肥中感微电子有限公司 一种修调电路
WO2023198296A1 (en) * 2022-04-14 2023-10-19 Advantest Corporation Automated test equipment component, automated test equipment and method for establishing a coupling with a device under test and with a characterizing device using a first and second antenna

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US5136247A (en) * 1991-01-18 1992-08-04 Hansen Wilford N Apparatus and methods for calibrated work function measurements
US6232790B1 (en) * 1999-03-08 2001-05-15 Honeywell Inc. Method and apparatus for amplifying electrical test signals from a micromechanical device
CA2308820A1 (en) * 2000-05-15 2001-11-15 The Governors Of The University Of Alberta Wireless radio frequency technique design and method for testing of integrated circuits and wafers
US7031669B2 (en) * 2002-09-10 2006-04-18 Cognio, Inc. Techniques for correcting for phase and amplitude offsets in a MIMO radio device
US7325180B2 (en) * 2003-11-26 2008-01-29 Carnegie Mellon University System and method to test integrated circuits on a wafer
US7279920B2 (en) * 2005-04-06 2007-10-09 Texas Instruments Incoporated Expeditious and low cost testing of RFID ICs
KR20080051180A (ko) * 2005-09-23 2008-06-10 캘리포니아 인스티튜트 오브 테크놀로지 칩 안테나 상 ㎜-파 완전 집적 위상 어레이 수신기 및송신기
ITTO20070563A1 (it) * 2007-07-30 2009-01-31 St Microelectronics Srl Dispositivo di identificazione a radiofrequenza con antenna accoppiata in near field
KR101388674B1 (ko) * 2007-09-07 2014-04-25 삼성전자주식회사 고속 원 샷 웨이퍼 테스트를 위한 무선 인터페이스 프로브카드 및 이를 구비한 반도체 테스트 장치
WO2009034496A2 (en) * 2007-09-12 2009-03-19 Nxp B.V. Wafer, method of manufacturing integrated circuits on a wafer, and method of storing data about said circuits
US7795895B2 (en) * 2007-11-28 2010-09-14 Mstar Semiconductor, Inc. Loop-back testing method and apparatus for IC
CA2623257A1 (en) * 2008-02-29 2009-08-29 Scanimetrics Inc. Method and apparatus for interrogating an electronic component
JP2010028623A (ja) * 2008-07-23 2010-02-04 Yokogawa Electric Corp 無線装置

Also Published As

Publication number Publication date
US8941401B2 (en) 2015-01-27
ITMI20100744A1 (it) 2011-10-30
US20110267086A1 (en) 2011-11-03

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