IT1399914B1 - Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test. - Google Patents
Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test.Info
- Publication number
- IT1399914B1 IT1399914B1 ITMI2010A000744A ITMI20100744A IT1399914B1 IT 1399914 B1 IT1399914 B1 IT 1399914B1 IT MI2010A000744 A ITMI2010A000744 A IT MI2010A000744A IT MI20100744 A ITMI20100744 A IT MI20100744A IT 1399914 B1 IT1399914 B1 IT 1399914B1
- Authority
- IT
- Italy
- Prior art keywords
- circuit
- integrated
- wafer
- test circuit
- singulation
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/31712—Input or output aspects
- G01R31/31716—Testing of input or output with loop-back
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/3025—Wireless interface with the DUT
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318505—Test of Modular systems, e.g. Wafers, MCM's
- G01R31/318511—Wafer Test
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2010A000744A IT1399914B1 (it) | 2010-04-29 | 2010-04-29 | Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test. |
US13/093,738 US8941401B2 (en) | 2010-04-29 | 2011-04-25 | Test circuit of an integrated circuit on a wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI2010A000744A IT1399914B1 (it) | 2010-04-29 | 2010-04-29 | Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test. |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20100744A1 ITMI20100744A1 (it) | 2011-10-30 |
IT1399914B1 true IT1399914B1 (it) | 2013-05-09 |
Family
ID=43302251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2010A000744A IT1399914B1 (it) | 2010-04-29 | 2010-04-29 | Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test. |
Country Status (2)
Country | Link |
---|---|
US (1) | US8941401B2 (it) |
IT (1) | IT1399914B1 (it) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2600533B1 (en) | 2011-12-02 | 2017-06-21 | Huawei Technologies Co., Ltd. | Transceiver arrangement |
US9632968B2 (en) * | 2011-12-15 | 2017-04-25 | Intel Corporation | Implementing an inter-processor communication in a multi-core system using mmWave radios |
US9070066B1 (en) * | 2013-01-21 | 2015-06-30 | Impinj, Inc. | RFID tags with inductively coupled antennas |
EP2806586B1 (en) * | 2013-05-22 | 2017-09-06 | OCT Circuit Technologies International Limited | Built-in self-testing method of a near field communication device |
US9891266B2 (en) | 2014-02-25 | 2018-02-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Test circuit and method |
US9568541B2 (en) | 2014-10-28 | 2017-02-14 | Infineon Technologies Ag | Testing of semiconductor packages with integrated antennas |
DE102014115886A1 (de) | 2014-10-31 | 2016-05-04 | Infineon Technologies Ag | Halbleitervorrichtung mit einer hochfrequenzbasierten Identifizierungsmarkierung |
KR20160104967A (ko) * | 2015-02-27 | 2016-09-06 | 에스케이하이닉스 주식회사 | 주파수 가변형 프로브 테스트 패드를 갖는 반도체 집적 회로 장치, 이를 포함하는 반도체 시스템, 및 프로브 테스트 방법 |
US10247773B2 (en) * | 2016-07-01 | 2019-04-02 | Intel Corporation | Systems and methods for wireless device testing |
US9985733B1 (en) | 2016-11-22 | 2018-05-29 | Keysight Technologies, Inc. | System and method for performing over-the-air (OTA) testing of a device under test (DUT) having an integrated transmitter-antenna assembly |
US10571487B2 (en) * | 2016-11-30 | 2020-02-25 | Formfactor Beaverton, Inc. | Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test |
US9800355B1 (en) * | 2016-12-18 | 2017-10-24 | Keysight Technologies, Inc. | System and method for performing over-the-air (OTA) testing of a device under test (DUT) having an integrated transmitter-antenna assembly using near field and intermediate field measurements |
US11092643B2 (en) | 2019-07-31 | 2021-08-17 | Infineon Technologies Ag | Antenna-in-package production test |
CN113661396A (zh) * | 2019-08-28 | 2021-11-16 | 爱德万测试公司 | 测试布置、自动化测试设备、和用于测试包括天线的被测装置的方法 |
CN112581892B (zh) * | 2019-09-29 | 2022-03-22 | 昆山国显光电有限公司 | 显示面板及显示装置 |
US11662380B2 (en) * | 2021-05-13 | 2023-05-30 | Apple Inc. | Built-in self-test for die-to-die physical interfaces |
CN113410209B (zh) * | 2021-06-09 | 2023-07-18 | 合肥中感微电子有限公司 | 一种修调电路 |
WO2023198296A1 (en) * | 2022-04-14 | 2023-10-19 | Advantest Corporation | Automated test equipment component, automated test equipment and method for establishing a coupling with a device under test and with a characterizing device using a first and second antenna |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5136247A (en) * | 1991-01-18 | 1992-08-04 | Hansen Wilford N | Apparatus and methods for calibrated work function measurements |
US6232790B1 (en) * | 1999-03-08 | 2001-05-15 | Honeywell Inc. | Method and apparatus for amplifying electrical test signals from a micromechanical device |
CA2308820A1 (en) * | 2000-05-15 | 2001-11-15 | The Governors Of The University Of Alberta | Wireless radio frequency technique design and method for testing of integrated circuits and wafers |
US7031669B2 (en) * | 2002-09-10 | 2006-04-18 | Cognio, Inc. | Techniques for correcting for phase and amplitude offsets in a MIMO radio device |
US7325180B2 (en) * | 2003-11-26 | 2008-01-29 | Carnegie Mellon University | System and method to test integrated circuits on a wafer |
US7279920B2 (en) * | 2005-04-06 | 2007-10-09 | Texas Instruments Incoporated | Expeditious and low cost testing of RFID ICs |
KR20080051180A (ko) * | 2005-09-23 | 2008-06-10 | 캘리포니아 인스티튜트 오브 테크놀로지 | 칩 안테나 상 ㎜-파 완전 집적 위상 어레이 수신기 및송신기 |
ITTO20070563A1 (it) * | 2007-07-30 | 2009-01-31 | St Microelectronics Srl | Dispositivo di identificazione a radiofrequenza con antenna accoppiata in near field |
KR101388674B1 (ko) * | 2007-09-07 | 2014-04-25 | 삼성전자주식회사 | 고속 원 샷 웨이퍼 테스트를 위한 무선 인터페이스 프로브카드 및 이를 구비한 반도체 테스트 장치 |
WO2009034496A2 (en) * | 2007-09-12 | 2009-03-19 | Nxp B.V. | Wafer, method of manufacturing integrated circuits on a wafer, and method of storing data about said circuits |
US7795895B2 (en) * | 2007-11-28 | 2010-09-14 | Mstar Semiconductor, Inc. | Loop-back testing method and apparatus for IC |
CA2623257A1 (en) * | 2008-02-29 | 2009-08-29 | Scanimetrics Inc. | Method and apparatus for interrogating an electronic component |
JP2010028623A (ja) * | 2008-07-23 | 2010-02-04 | Yokogawa Electric Corp | 無線装置 |
-
2010
- 2010-04-29 IT ITMI2010A000744A patent/IT1399914B1/it active
-
2011
- 2011-04-25 US US13/093,738 patent/US8941401B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8941401B2 (en) | 2015-01-27 |
ITMI20100744A1 (it) | 2011-10-30 |
US20110267086A1 (en) | 2011-11-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
IT1399914B1 (it) | Circuito di test di un circuito integrato su wafer del tipo comprendente almeno una antenna di tipo embedded e relativo circuito integrato ottenuto mediante singolazione a partire da una porzione di wafer dotata di un tale circuito di test. | |
IT1404038B1 (it) | Dispositivo elettronico a semiconduttore provvisto di un elemento isolatore galvanico integrato, e relativo procedimento di assemblaggio | |
BR112015029177A2 (pt) | antena omnidirecional para um corpo cilíndrico | |
GB2521752B (en) | Integrated circuit package with embedded bridge | |
BR112013015117A2 (pt) | conjunto microeletrônico, e, sistema | |
EP2955763A4 (en) | SEMICONDUCTOR LIGHT-EMITTING ELEMENT BASED ON NITRIDE | |
BR112015001743A2 (pt) | encapsulamento de implante | |
ITMI20120590A1 (it) | Girante e turbomacchinario includente la girante. | |
WO2012037536A3 (en) | Packaging to reduce stress on microelectromechanical systems | |
IT1398142B1 (it) | Sistema singolo con compressore e pompa integrati e metodo. | |
EP2452942A4 (en) | SUBSTITUTED BENZOCHALCOGENACEN COMPOUND, THIN LAYER WITH THE CONNECTION AND ORGANIC SEMICONDUCTOR COMPONENT WITH THE THIN LAYER | |
ITUB20161081A1 (it) | Dispositivo a semiconduttore con regione conduttiva sepolta, e metodo di fabbricazione del dispositivo a semiconduttore | |
EP3688798A4 (en) | SEMI-CONDUCTOR ENCLOSURE WITH EMBEDDED CONNECTIONS | |
CL2019001759A1 (es) | Dispositivos y sensores para la cosecha de energía, métodos para fabricarlos, y su uso. | |
BR112016001171A2 (pt) | módulo semicondutor. | |
EP3195355A4 (en) | Semiconductor packages with embedded bridge interconnects | |
DE112014005323A5 (de) | Optoelektronischer Halbleiterchip mit integriertem ESD-Schutz | |
IT1399907B1 (it) | Apparato di protezione contro scariche elettrostatiche per un circuito integrato e relativo circuito integrato. | |
FR3041470B1 (fr) | Structure semi-conductrice a tenue en tension amelioree | |
ITMI20110153A1 (it) | Transistore ad effetto di campo, sensibile al gas, e procedimento per lasua fabbricazione | |
IT201700082176A1 (it) | Sistema di elaborazione, relativo circuito integrato e procedimento | |
IT201700113926A1 (it) | Dispositivo mosfet di potenza e relativo procedimento di fabbricazione | |
IT1400565B1 (it) | Cassaforma per la fabbricazione di un elemento di protezione e di immobilizzazione del tipo a materasso, e relativo procedimento. | |
IT1402530B1 (it) | Circuiti integrati con retro-metallizzazione e relativo metodo di produzione. | |
IT1393346B1 (it) | Dispositivo con componente semiconduttore, e procedimento di fabbricazione |