IT1397976B1 - Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio. - Google Patents

Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.

Info

Publication number
IT1397976B1
IT1397976B1 ITTO2009A001036A ITTO20091036A IT1397976B1 IT 1397976 B1 IT1397976 B1 IT 1397976B1 IT TO2009A001036 A ITTO2009A001036 A IT TO2009A001036A IT TO20091036 A ITTO20091036 A IT TO20091036A IT 1397976 B1 IT1397976 B1 IT 1397976B1
Authority
IT
Italy
Prior art keywords
microelettromechanical
transducer
assembly procedure
relative assembly
relative
Prior art date
Application number
ITTO2009A001036A
Other languages
English (en)
Inventor
Mario Francesco Cortese
Mark Anthony Azzopardi
Kevin Formosa
Original Assignee
St Microelectronics Rousset
Stmicroelectronics Malta Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Rousset, Stmicroelectronics Malta Ltd filed Critical St Microelectronics Rousset
Priority to ITTO2009A001036A priority Critical patent/IT1397976B1/it
Priority to EP10795018.0A priority patent/EP2517480B1/en
Priority to CN201080059021.0A priority patent/CN102742301B/zh
Priority to PCT/EP2010/070608 priority patent/WO2011076910A1/en
Publication of ITTO20091036A1 publication Critical patent/ITTO20091036A1/it
Priority to US13/402,761 priority patent/US8837754B2/en
Application granted granted Critical
Publication of IT1397976B1 publication Critical patent/IT1397976B1/it

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/093—Conductive package seal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
    • B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
    • B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
ITTO2009A001036A 2009-12-23 2009-12-23 Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio. IT1397976B1 (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
ITTO2009A001036A IT1397976B1 (it) 2009-12-23 2009-12-23 Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.
EP10795018.0A EP2517480B1 (en) 2009-12-23 2010-12-22 Microelectromechanical transducer and corresponding assembly process
CN201080059021.0A CN102742301B (zh) 2009-12-23 2010-12-22 微机电换能器及对应组装工艺
PCT/EP2010/070608 WO2011076910A1 (en) 2009-12-23 2010-12-22 Microelectromechanical transducer and corresponding assembly process
US13/402,761 US8837754B2 (en) 2009-12-23 2012-02-22 Microelectromechanical transducer and corresponding assembly process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO2009A001036A IT1397976B1 (it) 2009-12-23 2009-12-23 Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.

Publications (2)

Publication Number Publication Date
ITTO20091036A1 ITTO20091036A1 (it) 2011-06-24
IT1397976B1 true IT1397976B1 (it) 2013-02-04

Family

ID=42244334

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO2009A001036A IT1397976B1 (it) 2009-12-23 2009-12-23 Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.

Country Status (5)

Country Link
US (1) US8837754B2 (it)
EP (1) EP2517480B1 (it)
CN (1) CN102742301B (it)
IT (1) IT1397976B1 (it)
WO (1) WO2011076910A1 (it)

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JP5327299B2 (ja) * 2011-09-09 2013-10-30 オムロン株式会社 半導体装置及びマイクロフォン
JP5633493B2 (ja) * 2011-09-16 2014-12-03 オムロン株式会社 半導体装置及びマイクロフォン
US8502327B1 (en) * 2012-01-26 2013-08-06 Honeywell International Inc. Systems and methods for conductive pillars
US8995694B2 (en) 2012-02-01 2015-03-31 Knowles Electronics, Llc Embedded circuit in a MEMS device
US9485560B2 (en) 2012-02-01 2016-11-01 Knowles Electronics, Llc Embedded circuit in a MEMS device
DE102012101505B4 (de) * 2012-02-24 2016-03-03 Epcos Ag Verfahren zur Herstellung eines Sensors
ITTO20120515A1 (it) 2012-06-14 2013-12-15 St Microelectronics Nv Assemblaggio di un dispositivo integrato a semiconduttori e relativo procedimento di fabbricazione
EP2893713B1 (en) * 2012-09-10 2020-08-12 Robert Bosch GmbH Mems microphone package with molded interconnect device
FR2995721B1 (fr) * 2012-09-17 2014-11-21 Commissariat Energie Atomique Capot pour dispositif a rainure et a puce, dispositif equipe du capot, assemblage du dispositif avec un element filaire et procede de fabrication
ITTO20120827A1 (it) * 2012-09-24 2014-03-25 St Microelectronics Srl Incapsulamento a livello di fetta di un dispositivo integrato mems e relativo procedimento di fabbricazione
ITTO20120976A1 (it) * 2012-11-09 2014-05-10 St Microelectronics Srl Procedimento per la fabbricazione di un cappuccio per una struttura di incapsulamento di dispositivi elettronici e cappuccio per una struttura di incapsulamento di dispositivi elettronici
US20140133686A1 (en) * 2012-11-14 2014-05-15 Knowles Electronics, Llc Apparatus to prevent excess movement of mems components
CN203120151U (zh) * 2012-12-12 2013-08-07 瑞声声学科技(深圳)有限公司 Mems麦克风
US9082883B2 (en) 2013-03-04 2015-07-14 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
ITTO20130350A1 (it) 2013-04-30 2014-10-31 St Microelectronics Srl Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems
CN104517944A (zh) * 2013-09-30 2015-04-15 日月光半导体制造股份有限公司 封装结构及其制造方法
US20150117681A1 (en) * 2013-10-30 2015-04-30 Knowles Electronics, Llc Acoustic Assembly and Method of Manufacturing The Same
US20160100256A1 (en) * 2013-10-30 2016-04-07 Knowles Electronics, Llc Acoustic Assembly and Method of Manufacturing The Same
CN203708484U (zh) * 2013-12-30 2014-07-09 瑞声声学科技(深圳)有限公司 麦克风
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EP3654053A1 (en) * 2018-11-14 2020-05-20 Infineon Technologies AG Package with acoustic sensing device(s) and millimeter wave sensing elements
EP3680211B1 (en) * 2019-01-10 2024-03-06 TE Connectivity Solutions GmbH Sensor unit and method of interconnecting a substrate and a carrier
CN110054144A (zh) * 2019-04-22 2019-07-26 武汉耐普登科技有限公司 微机电传感器封装结构及制造方法
CN212324360U (zh) * 2020-06-30 2021-01-08 瑞声声学科技(深圳)有限公司 麦克风
CN114873557A (zh) * 2022-05-31 2022-08-09 广州市意芯微电子有限公司 一种微机电传感器互联封装方法
CN117712057B (zh) * 2024-02-06 2024-05-10 成都汉芯国科集成技术有限公司 一种多级金刚石抗辐射过载的芯片封装结构及封装方法

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DE102005053767B4 (de) * 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
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US8199939B2 (en) * 2009-01-21 2012-06-12 Nokia Corporation Microphone package

Also Published As

Publication number Publication date
ITTO20091036A1 (it) 2011-06-24
CN102742301B (zh) 2015-09-02
CN102742301A (zh) 2012-10-17
US20120153771A1 (en) 2012-06-21
WO2011076910A1 (en) 2011-06-30
EP2517480B1 (en) 2015-08-19
EP2517480A1 (en) 2012-10-31
US8837754B2 (en) 2014-09-16

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