IT1397976B1 - Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio. - Google Patents
Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.Info
- Publication number
- IT1397976B1 IT1397976B1 ITTO2009A001036A ITTO20091036A IT1397976B1 IT 1397976 B1 IT1397976 B1 IT 1397976B1 IT TO2009A001036 A ITTO2009A001036 A IT TO2009A001036A IT TO20091036 A ITTO20091036 A IT TO20091036A IT 1397976 B1 IT1397976 B1 IT 1397976B1
- Authority
- IT
- Italy
- Prior art keywords
- microelettromechanical
- transducer
- assembly procedure
- relative assembly
- relative
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/07—Interconnects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/09—Packages
- B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
- B81B2207/093—Conductive package seal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0172—Seals
- B81C2203/019—Seals characterised by the material or arrangement of seals between parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/033—Thermal bonding
- B81C2203/035—Soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/07—Integrating an electronic processing unit with a micromechanical structure
- B81C2203/0785—Transfer and j oin technology, i.e. forming the electronic processing unit and the micromechanical structure on separate substrates and joining the substrates
- B81C2203/0792—Forming interconnections between the electronic processing unit and the micromechanical structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Micromachines (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO2009A001036A IT1397976B1 (it) | 2009-12-23 | 2009-12-23 | Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio. |
EP10795018.0A EP2517480B1 (en) | 2009-12-23 | 2010-12-22 | Microelectromechanical transducer and corresponding assembly process |
CN201080059021.0A CN102742301B (zh) | 2009-12-23 | 2010-12-22 | 微机电换能器及对应组装工艺 |
PCT/EP2010/070608 WO2011076910A1 (en) | 2009-12-23 | 2010-12-22 | Microelectromechanical transducer and corresponding assembly process |
US13/402,761 US8837754B2 (en) | 2009-12-23 | 2012-02-22 | Microelectromechanical transducer and corresponding assembly process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITTO2009A001036A IT1397976B1 (it) | 2009-12-23 | 2009-12-23 | Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio. |
Publications (2)
Publication Number | Publication Date |
---|---|
ITTO20091036A1 ITTO20091036A1 (it) | 2011-06-24 |
IT1397976B1 true IT1397976B1 (it) | 2013-02-04 |
Family
ID=42244334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITTO2009A001036A IT1397976B1 (it) | 2009-12-23 | 2009-12-23 | Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio. |
Country Status (5)
Country | Link |
---|---|
US (1) | US8837754B2 (it) |
EP (1) | EP2517480B1 (it) |
CN (1) | CN102742301B (it) |
IT (1) | IT1397976B1 (it) |
WO (1) | WO2011076910A1 (it) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
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US9420378B1 (en) * | 2010-07-12 | 2016-08-16 | Amkor Technology, Inc. | Top port MEMS microphone package and method |
ITTO20110577A1 (it) | 2011-06-30 | 2012-12-31 | Stmicroelectronics Malta Ltd | Incapsulamento per un sensore mems e relativo procedimento di fabbricazione |
JP5327299B2 (ja) * | 2011-09-09 | 2013-10-30 | オムロン株式会社 | 半導体装置及びマイクロフォン |
JP5633493B2 (ja) * | 2011-09-16 | 2014-12-03 | オムロン株式会社 | 半導体装置及びマイクロフォン |
US8502327B1 (en) * | 2012-01-26 | 2013-08-06 | Honeywell International Inc. | Systems and methods for conductive pillars |
US8995694B2 (en) | 2012-02-01 | 2015-03-31 | Knowles Electronics, Llc | Embedded circuit in a MEMS device |
US9485560B2 (en) | 2012-02-01 | 2016-11-01 | Knowles Electronics, Llc | Embedded circuit in a MEMS device |
DE102012101505B4 (de) * | 2012-02-24 | 2016-03-03 | Epcos Ag | Verfahren zur Herstellung eines Sensors |
ITTO20120515A1 (it) | 2012-06-14 | 2013-12-15 | St Microelectronics Nv | Assemblaggio di un dispositivo integrato a semiconduttori e relativo procedimento di fabbricazione |
EP2893713B1 (en) * | 2012-09-10 | 2020-08-12 | Robert Bosch GmbH | Mems microphone package with molded interconnect device |
FR2995721B1 (fr) * | 2012-09-17 | 2014-11-21 | Commissariat Energie Atomique | Capot pour dispositif a rainure et a puce, dispositif equipe du capot, assemblage du dispositif avec un element filaire et procede de fabrication |
ITTO20120827A1 (it) * | 2012-09-24 | 2014-03-25 | St Microelectronics Srl | Incapsulamento a livello di fetta di un dispositivo integrato mems e relativo procedimento di fabbricazione |
ITTO20120976A1 (it) * | 2012-11-09 | 2014-05-10 | St Microelectronics Srl | Procedimento per la fabbricazione di un cappuccio per una struttura di incapsulamento di dispositivi elettronici e cappuccio per una struttura di incapsulamento di dispositivi elettronici |
US20140133686A1 (en) * | 2012-11-14 | 2014-05-15 | Knowles Electronics, Llc | Apparatus to prevent excess movement of mems components |
CN203120151U (zh) * | 2012-12-12 | 2013-08-07 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
US9082883B2 (en) | 2013-03-04 | 2015-07-14 | Unisem (M) Berhad | Top port MEMS cavity package and method of manufacture thereof |
ITTO20130350A1 (it) | 2013-04-30 | 2014-10-31 | St Microelectronics Srl | Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems |
CN104517944A (zh) * | 2013-09-30 | 2015-04-15 | 日月光半导体制造股份有限公司 | 封装结构及其制造方法 |
US20150117681A1 (en) * | 2013-10-30 | 2015-04-30 | Knowles Electronics, Llc | Acoustic Assembly and Method of Manufacturing The Same |
US20160100256A1 (en) * | 2013-10-30 | 2016-04-07 | Knowles Electronics, Llc | Acoustic Assembly and Method of Manufacturing The Same |
CN203708484U (zh) * | 2013-12-30 | 2014-07-09 | 瑞声声学科技(深圳)有限公司 | 麦克风 |
US9307328B2 (en) | 2014-01-09 | 2016-04-05 | Knowles Electronics, Llc | Interposer for MEMS-on-lid microphone |
US9532125B2 (en) * | 2014-06-06 | 2016-12-27 | Cirrus Logic, Inc. | Noise cancellation microphones with shared back volume |
US10138115B2 (en) * | 2014-08-06 | 2018-11-27 | Infineon Technologies Ag | Low profile transducer module |
NL2013706B1 (en) | 2014-10-29 | 2016-10-04 | Univ Delft Tech | Improved microreactor for use in microscopy. |
KR101953089B1 (ko) * | 2014-11-06 | 2019-05-23 | 로베르트 보쉬 게엠베하 | Mems 트랜스듀서 패키지들의 제조시 사용된 리드 프레임 기반 칩 캐리어 |
WO2016075113A1 (de) * | 2014-11-10 | 2016-05-19 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Mems package |
EP3018092A1 (en) * | 2014-11-10 | 2016-05-11 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | MEMS package |
KR101554364B1 (ko) * | 2014-12-30 | 2015-09-21 | (주)이미지스테크놀로지 | 리드프레임을 이용한 멤스 마이크로폰 패키지 |
KR101672620B1 (ko) * | 2015-01-30 | 2016-11-04 | 앰코 테크놀로지 코리아 주식회사 | 폴리머 기판를 이용한 반도체 패키지 |
CN104581511A (zh) * | 2015-02-04 | 2015-04-29 | 邓瑞瑞 | 一种电磁屏蔽扬声器 |
WO2016153871A1 (en) * | 2015-03-23 | 2016-09-29 | Knowles Electronics, Llc | Embedded circuit in a mems device |
USD789181S1 (en) * | 2015-12-23 | 2017-06-13 | Roger Webb | Modular furniture part |
US9828237B2 (en) * | 2016-03-10 | 2017-11-28 | Infineon Technologies Ag | MEMS device and MEMS vacuum microphone |
US10773949B2 (en) | 2016-03-14 | 2020-09-15 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Method of manufacturing an electronic device |
US20180134546A1 (en) * | 2016-11-14 | 2018-05-17 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
IT201600121003A1 (it) * | 2016-11-29 | 2018-05-29 | St Microelectronics Srl | Dispositivo integrato a semiconduttore con contatti elettrici tra piastrine impilate e relativo procedimento di realizzazione |
US10179730B2 (en) * | 2016-12-08 | 2019-01-15 | Texas Instruments Incorporated | Electronic sensors with sensor die in package structure cavity |
US10501312B2 (en) * | 2017-07-18 | 2019-12-10 | Infineon Technologies Ag | Over-under sensor packaging with sensor spaced apart from control chip |
US10517184B2 (en) * | 2018-02-09 | 2019-12-24 | Eaton Intelligent Power Limited | Configurable electronics packages |
US10672715B2 (en) | 2018-04-16 | 2020-06-02 | Amkor Technology, Inc. | Semiconductor package using cavity substrate and manufacturing methods |
EP3654053A1 (en) * | 2018-11-14 | 2020-05-20 | Infineon Technologies AG | Package with acoustic sensing device(s) and millimeter wave sensing elements |
EP3680211B1 (en) * | 2019-01-10 | 2024-03-06 | TE Connectivity Solutions GmbH | Sensor unit and method of interconnecting a substrate and a carrier |
CN110054144A (zh) * | 2019-04-22 | 2019-07-26 | 武汉耐普登科技有限公司 | 微机电传感器封装结构及制造方法 |
CN212324360U (zh) * | 2020-06-30 | 2021-01-08 | 瑞声声学科技(深圳)有限公司 | 麦克风 |
CN114873557A (zh) * | 2022-05-31 | 2022-08-09 | 广州市意芯微电子有限公司 | 一种微机电传感器互联封装方法 |
CN117712057B (zh) * | 2024-02-06 | 2024-05-10 | 成都汉芯国科集成技术有限公司 | 一种多级金刚石抗辐射过载的芯片封装结构及封装方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4459498B2 (ja) * | 1999-09-06 | 2010-04-28 | パルス・エムイーエムエス・アンパルトセルスカブ | シリコンベースのセンサーシステム |
US20070071268A1 (en) * | 2005-08-16 | 2007-03-29 | Analog Devices, Inc. | Packaged microphone with electrically coupled lid |
DE102005053767B4 (de) * | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
TWI370101B (en) * | 2007-05-15 | 2012-08-11 | Ind Tech Res Inst | Package and packaging assembly of microelectromechanical sysyem microphone |
US8199939B2 (en) * | 2009-01-21 | 2012-06-12 | Nokia Corporation | Microphone package |
-
2009
- 2009-12-23 IT ITTO2009A001036A patent/IT1397976B1/it active
-
2010
- 2010-12-22 WO PCT/EP2010/070608 patent/WO2011076910A1/en active Application Filing
- 2010-12-22 EP EP10795018.0A patent/EP2517480B1/en active Active
- 2010-12-22 CN CN201080059021.0A patent/CN102742301B/zh active Active
-
2012
- 2012-02-22 US US13/402,761 patent/US8837754B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
ITTO20091036A1 (it) | 2011-06-24 |
CN102742301B (zh) | 2015-09-02 |
CN102742301A (zh) | 2012-10-17 |
US20120153771A1 (en) | 2012-06-21 |
WO2011076910A1 (en) | 2011-06-30 |
EP2517480B1 (en) | 2015-08-19 |
EP2517480A1 (en) | 2012-10-31 |
US8837754B2 (en) | 2014-09-16 |
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