IT1397894B1 - MICROMECHANICAL DEVICE AND PROCEDURE FOR THE PRODUCTION OF THE SAME - Google Patents
MICROMECHANICAL DEVICE AND PROCEDURE FOR THE PRODUCTION OF THE SAMEInfo
- Publication number
- IT1397894B1 IT1397894B1 ITMI2010A000069A ITMI20100069A IT1397894B1 IT 1397894 B1 IT1397894 B1 IT 1397894B1 IT MI2010A000069 A ITMI2010A000069 A IT MI2010A000069A IT MI20100069 A ITMI20100069 A IT MI20100069A IT 1397894 B1 IT1397894 B1 IT 1397894B1
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- production
- same
- micromechanical device
- micromechanical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
- B81B3/001—Structures having a reduced contact area, e.g. with bumps or with a textured surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
- B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/01—Electrostatic transducers characterised by the use of electrets
- H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009000429.7A DE102009000429B4 (en) | 2009-01-27 | 2009-01-27 | Micromechanical device and manufacturing process therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
ITMI20100069A1 ITMI20100069A1 (en) | 2010-07-28 |
IT1397894B1 true IT1397894B1 (en) | 2013-02-04 |
Family
ID=42282422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI2010A000069A IT1397894B1 (en) | 2009-01-27 | 2010-01-21 | MICROMECHANICAL DEVICE AND PROCEDURE FOR THE PRODUCTION OF THE SAME |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN101786591B (en) |
DE (1) | DE102009000429B4 (en) |
IT (1) | IT1397894B1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6343994B2 (en) | 2014-03-25 | 2018-06-20 | セイコーエプソン株式会社 | Optical scanner, image display device, and head mounted display |
CN107328954B (en) * | 2017-07-25 | 2019-12-31 | 西安交通大学 | Multistage step high overload resonant accelerometer chip |
CN112551474B (en) * | 2020-12-09 | 2022-05-24 | 北京航天控制仪器研究所 | MEMS movable structure with in-plane stop |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19539049A1 (en) * | 1995-10-20 | 1997-04-24 | Bosch Gmbh Robert | Process for the production of a Coriolis rotation rate sensor |
DE19930779B4 (en) * | 1999-07-03 | 2010-05-06 | Robert Bosch Gmbh | Micromechanical component |
DE19949605A1 (en) * | 1999-10-15 | 2001-04-19 | Bosch Gmbh Robert | Acceleration sensor for car air bag control has micromachined stop bars prevents misfunction due to perpendicular acceleration |
DE102005054143A1 (en) * | 2005-11-14 | 2007-05-16 | Bosch Gmbh Robert | Acceleration sensor, has projection that limits deflection of seismic mass under effect of acceleration force in direction and is formed at seismic mass and/or crystal substrate, where epitaxy layer is applied on front side of substrate |
DE102007002273A1 (en) * | 2007-01-16 | 2008-07-17 | Robert Bosch Gmbh | Method for producing a component and sensor element |
CN101279713B (en) * | 2008-03-31 | 2011-09-14 | 清华大学 | Manufacturing method for floating type micro-silicon electrostatic gyro/accelerometer sensitive structure |
-
2009
- 2009-01-27 DE DE102009000429.7A patent/DE102009000429B4/en not_active Expired - Fee Related
-
2010
- 2010-01-21 IT ITMI2010A000069A patent/IT1397894B1/en active
- 2010-01-27 CN CN201010103994.1A patent/CN101786591B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN101786591A (en) | 2010-07-28 |
ITMI20100069A1 (en) | 2010-07-28 |
DE102009000429B4 (en) | 2021-01-28 |
DE102009000429A1 (en) | 2010-07-29 |
CN101786591B (en) | 2016-01-27 |
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