IT1397180B1 - MICROMECHANICAL COMPONENT - Google Patents

MICROMECHANICAL COMPONENT

Info

Publication number
IT1397180B1
IT1397180B1 ITMI2009A001976A ITMI20091976A IT1397180B1 IT 1397180 B1 IT1397180 B1 IT 1397180B1 IT MI2009A001976 A ITMI2009A001976 A IT MI2009A001976A IT MI20091976 A ITMI20091976 A IT MI20091976A IT 1397180 B1 IT1397180 B1 IT 1397180B1
Authority
IT
Italy
Prior art keywords
micromechanical component
micromechanical
component
Prior art date
Application number
ITMI2009A001976A
Other languages
Italian (it)
Inventor
Arnd Kaelberer
Dietrich Schubert
Ralf Schellin
Lars Tebje
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of ITMI20091976A1 publication Critical patent/ITMI20091976A1/en
Application granted granted Critical
Publication of IT1397180B1 publication Critical patent/IT1397180B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
    • B81B3/0086—Electrical characteristics, e.g. reducing driving voltage, improving resistance to peak voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
    • G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
ITMI2009A001976A 2008-11-17 2009-11-12 MICROMECHANICAL COMPONENT IT1397180B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008043790.5A DE102008043790B4 (en) 2008-11-17 2008-11-17 Micromechanical component

Publications (2)

Publication Number Publication Date
ITMI20091976A1 ITMI20091976A1 (en) 2010-05-18
IT1397180B1 true IT1397180B1 (en) 2013-01-04

Family

ID=42104818

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI2009A001976A IT1397180B1 (en) 2008-11-17 2009-11-12 MICROMECHANICAL COMPONENT

Country Status (2)

Country Link
DE (1) DE102008043790B4 (en)
IT (1) IT1397180B1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039293B4 (en) 2010-08-13 2018-05-24 Robert Bosch Gmbh Micromechanical component and production method for a micromechanical component
DE102011006422B4 (en) 2011-03-30 2019-02-28 Robert Bosch Gmbh Micromechanical component and sensor device
DE102011081014B4 (en) 2011-08-16 2020-01-23 Robert Bosch Gmbh Micromechanical component and manufacturing method for a micromechanical component
JP6002481B2 (en) 2012-07-06 2016-10-05 日立オートモティブシステムズ株式会社 Inertial sensor
DE102013210512B4 (en) * 2013-06-06 2016-01-07 Robert Bosch Gmbh Sensor with membrane and manufacturing process
JP6464608B2 (en) * 2014-08-19 2019-02-06 セイコーエプソン株式会社 Physical quantity sensor, electronic device and mobile object
US9810712B2 (en) 2014-08-15 2017-11-07 Seiko Epson Corporation Physical quantity sensor, physical quantity sensor device, electronic equipment, and moving body
JP6464613B2 (en) 2014-08-27 2019-02-06 セイコーエプソン株式会社 Physical quantity sensor, electronic device and mobile object
US11268976B2 (en) * 2017-02-23 2022-03-08 Invensense, Inc. Electrode layer partitioning
JP2021071394A (en) * 2019-10-31 2021-05-06 セイコーエプソン株式会社 Physical quantity sensor, electronic apparatus, and mobile body

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3611360A1 (en) 1986-04-04 1987-10-08 Bosch Gmbh Robert SENSOR FOR AUTOMATIC TRIGGERING OF PASSENGER PROTECTION DEVICES
DE19541388A1 (en) 1995-11-07 1997-05-15 Telefunken Microelectron Micromechanical acceleration sensor
US6105427A (en) * 1998-07-31 2000-08-22 Litton Systems, Inc. Micro-mechanical semiconductor accelerometer
JP2001076605A (en) * 1999-07-01 2001-03-23 Advantest Corp Integrated microswitch and its manufacture
AU2003258020A1 (en) * 2002-08-03 2004-02-23 Siverta, Inc. Sealed integral mems switch
JP2005069852A (en) * 2003-08-25 2005-03-17 Seiko Instruments Inc Capacitance type dynamic quantity sensor
WO2006127777A1 (en) * 2005-05-25 2006-11-30 Northrop Grumman Corporation Silicon accelerometer chip design for size and thermal distortion reduction and process simplification
US7610809B2 (en) * 2007-01-18 2009-11-03 Freescale Semiconductor, Inc. Differential capacitive sensor and method of making same

Also Published As

Publication number Publication date
DE102008043790A1 (en) 2010-05-20
ITMI20091976A1 (en) 2010-05-18
DE102008043790B4 (en) 2017-04-06

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