IT1392752B1 - Sistema di stampa serigrafica di nuova generazione - Google Patents

Sistema di stampa serigrafica di nuova generazione

Info

Publication number
IT1392752B1
IT1392752B1 ITUD2008A000262A ITUD20080262A IT1392752B1 IT 1392752 B1 IT1392752 B1 IT 1392752B1 IT UD2008A000262 A ITUD2008A000262 A IT UD2008A000262A IT UD20080262 A ITUD20080262 A IT UD20080262A IT 1392752 B1 IT1392752 B1 IT 1392752B1
Authority
IT
Italy
Prior art keywords
printing system
new generation
serigraphic printing
serigraphic
generation
Prior art date
Application number
ITUD2008A000262A
Other languages
English (en)
Inventor
Marco Galiazzo
Daniele Andreola
Santi Luigi De
Tommaso Vercesi
Christian Zorzi
Andrea Baccini
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to ITUD2008A000262A priority Critical patent/IT1392752B1/it
Priority to US12/418,912 priority patent/US8215473B2/en
Priority to EP09749809A priority patent/EP2297777A1/en
Priority to KR1020107028737A priority patent/KR20110020272A/ko
Priority to CN2009801195714A priority patent/CN102037555B/zh
Priority to PCT/EP2009/056024 priority patent/WO2009141319A1/en
Priority to JP2011509948A priority patent/JP2011523910A/ja
Priority to TW098116884A priority patent/TWI397146B/zh
Publication of ITUD20080262A1 publication Critical patent/ITUD20080262A1/it
Application granted granted Critical
Publication of IT1392752B1 publication Critical patent/IT1392752B1/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fax Reproducing Arrangements (AREA)
ITUD2008A000262A 2008-05-21 2008-12-18 Sistema di stampa serigrafica di nuova generazione IT1392752B1 (it)

Priority Applications (8)

Application Number Priority Date Filing Date Title
ITUD2008A000262A IT1392752B1 (it) 2008-12-18 2008-12-18 Sistema di stampa serigrafica di nuova generazione
US12/418,912 US8215473B2 (en) 2008-05-21 2009-04-06 Next generation screen printing system
EP09749809A EP2297777A1 (en) 2008-05-21 2009-05-18 Next generation screen printing system
KR1020107028737A KR20110020272A (ko) 2008-05-21 2009-05-18 차세대 스크린 프린팅 시스템
CN2009801195714A CN102037555B (zh) 2008-05-21 2009-05-18 下一代丝网印刷***
PCT/EP2009/056024 WO2009141319A1 (en) 2008-05-21 2009-05-18 Next generation screen printing system
JP2011509948A JP2011523910A (ja) 2008-05-21 2009-05-18 次世代型スクリーン印刷システム
TW098116884A TWI397146B (zh) 2008-05-21 2009-05-21 下一代網印系統

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITUD2008A000262A IT1392752B1 (it) 2008-12-18 2008-12-18 Sistema di stampa serigrafica di nuova generazione

Publications (2)

Publication Number Publication Date
ITUD20080262A1 ITUD20080262A1 (it) 2010-06-19
IT1392752B1 true IT1392752B1 (it) 2012-03-16

Family

ID=40750977

Family Applications (1)

Application Number Title Priority Date Filing Date
ITUD2008A000262A IT1392752B1 (it) 2008-05-21 2008-12-18 Sistema di stampa serigrafica di nuova generazione

Country Status (1)

Country Link
IT (1) IT1392752B1 (it)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61113766A (ja) * 1984-11-09 1986-05-31 Nissin Electric Co Ltd エンドステ−シヨン
EP0582017B1 (en) * 1992-08-04 1995-10-18 International Business Machines Corporation Dispatching apparatus with a gas supply distribution system for handling and storing pressurized sealable transportable containers
US5518599A (en) * 1994-12-14 1996-05-21 Reflekt Technology, Inc. Cross flow metalizing of compact discs
DE19945648C2 (de) * 1999-09-23 2001-08-02 Steag Hamatech Ag Vorrichtung zum Be- und Entladen von Substraten
US7021450B2 (en) * 2002-04-17 2006-04-04 Kraft Foods Holdings, Inc. Device and method to correct uneven spacing of successive articles
JP4096359B2 (ja) * 2003-03-10 2008-06-04 セイコーエプソン株式会社 製造対象物の製造装置
TWI271367B (en) * 2005-11-24 2007-01-21 Chunghwa Picture Tubes Ltd Cassette and mechanical arm and process apparatus
JP4593461B2 (ja) * 2005-12-27 2010-12-08 東京エレクトロン株式会社 基板搬送システム
ITUD20070198A1 (it) * 2007-10-24 2009-04-25 Baccini S P A Dispositivo di posizionamento per posizionare una o piu' piastre di circuiti elettronici, in un'unita' di deposizione del metallo, e relativo procedimento

Also Published As

Publication number Publication date
ITUD20080262A1 (it) 2010-06-19

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