IT1235830B - Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore - Google Patents
Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di caloreInfo
- Publication number
- IT1235830B IT1235830B IT8983629A IT8362989A IT1235830B IT 1235830 B IT1235830 B IT 1235830B IT 8983629 A IT8983629 A IT 8983629A IT 8362989 A IT8362989 A IT 8362989A IT 1235830 B IT1235830 B IT 1235830B
- Authority
- IT
- Italy
- Prior art keywords
- emerged
- feet
- face
- heat sink
- external heat
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8983629A IT1235830B (it) | 1989-07-11 | 1989-07-11 | Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore |
DE69023295T DE69023295T2 (de) | 1989-07-11 | 1990-07-06 | Verfahren zum Montieren einer Wärmesenke auf einer Pluralität von Halbleiterbauelementgehäuse. |
EP90830312A EP0412943B1 (en) | 1989-07-11 | 1990-07-06 | Method of mounting a heatsink onto a plurality of semiconductor device packages |
US07/548,710 US5031023A (en) | 1989-07-11 | 1990-07-06 | Single-In-Line plastic package with open ended slots for slidingly accommodating fasteners' stems prearranged on an external heat sink |
JP2183864A JPH0353552A (ja) | 1989-07-11 | 1990-07-11 | 外部ヒートシンクの表面上に予備配置された締着部材のステムをスライド可能に収容するためのピンサイドの反対サイド上に開口端スロットを有するシングルインラインプラスチックパッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT8983629A IT1235830B (it) | 1989-07-11 | 1989-07-11 | Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8983629A0 IT8983629A0 (it) | 1989-07-11 |
IT1235830B true IT1235830B (it) | 1992-11-03 |
Family
ID=11323387
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT8983629A IT1235830B (it) | 1989-07-11 | 1989-07-11 | Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore |
Country Status (5)
Country | Link |
---|---|
US (1) | US5031023A (it) |
EP (1) | EP0412943B1 (it) |
JP (1) | JPH0353552A (it) |
DE (1) | DE69023295T2 (it) |
IT (1) | IT1235830B (it) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3307506B2 (ja) * | 1994-07-13 | 2002-07-24 | 三菱電機株式会社 | 車両用交流発電機の制御装置および車両用交流発電機 |
SG80077A1 (en) | 1998-10-19 | 2001-04-17 | Sony Corp | Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
WO2000062340A1 (en) * | 1999-04-09 | 2000-10-19 | Ericsson, Inc. | Cantilevered clamp for securing electronic components to a base plate |
US20050264998A1 (en) * | 2004-05-25 | 2005-12-01 | 3M Innovative Properties Company | Heat sink assembly |
JP2006332247A (ja) * | 2005-05-25 | 2006-12-07 | Sansha Electric Mfg Co Ltd | 電源装置および電気装置の放熱構造 |
US8295049B2 (en) * | 2011-05-27 | 2012-10-23 | Renewable Power Conversion, Inc. | Power converter with linear distribution of heat sources |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1914442C3 (de) * | 1969-03-21 | 1978-05-11 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Halbleiteranordnung |
JPS5266376A (en) * | 1975-11-29 | 1977-06-01 | Hitachi Ltd | Device and manufacture of resin body type semiconductor |
DE2712543C2 (de) * | 1976-03-24 | 1982-11-11 | Hitachi, Ltd., Tokyo | Anordnung eines Halbleiterbauelements auf einer Montageplatte |
US4204248A (en) * | 1978-11-20 | 1980-05-20 | General Electric Company | Heat transfer mounting arrangement for a solid state device connected to a circuit board |
GB2042803B (en) * | 1979-03-05 | 1984-08-08 | Alsthom Atlantique | Support housing for a semiconductor power wafer for immersion in a fluorinated hydrocarbon |
US4387413A (en) * | 1980-12-24 | 1983-06-07 | Rca Corporation | Semiconductor apparatus with integral heat sink tab |
JPS5811355A (ja) * | 1981-07-10 | 1983-01-22 | 恋淵 一郎 | 冷凍機の除霜装置 |
DE3307704C2 (de) * | 1983-03-04 | 1986-10-23 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichtermodul mit Befestigungslaschen |
JPS63107159A (ja) * | 1986-10-24 | 1988-05-12 | Toshiba Corp | 半導体装置 |
-
1989
- 1989-07-11 IT IT8983629A patent/IT1235830B/it active
-
1990
- 1990-07-06 US US07/548,710 patent/US5031023A/en not_active Expired - Lifetime
- 1990-07-06 DE DE69023295T patent/DE69023295T2/de not_active Expired - Fee Related
- 1990-07-06 EP EP90830312A patent/EP0412943B1/en not_active Expired - Lifetime
- 1990-07-11 JP JP2183864A patent/JPH0353552A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE69023295T2 (de) | 1996-05-15 |
JPH0353552A (ja) | 1991-03-07 |
IT8983629A0 (it) | 1989-07-11 |
DE69023295D1 (de) | 1995-12-07 |
EP0412943A1 (en) | 1991-02-13 |
EP0412943B1 (en) | 1995-11-02 |
US5031023A (en) | 1991-07-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970730 |