IT1235830B - Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore - Google Patents

Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore

Info

Publication number
IT1235830B
IT1235830B IT8983629A IT8362989A IT1235830B IT 1235830 B IT1235830 B IT 1235830B IT 8983629 A IT8983629 A IT 8983629A IT 8362989 A IT8362989 A IT 8362989A IT 1235830 B IT1235830 B IT 1235830B
Authority
IT
Italy
Prior art keywords
emerged
feet
face
heat sink
external heat
Prior art date
Application number
IT8983629A
Other languages
English (en)
Other versions
IT8983629A0 (it
Inventor
Bruno Murari
Giordano Seragnoli
Original Assignee
Sgs Thomson Microelectronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Thomson Microelectronics filed Critical Sgs Thomson Microelectronics
Priority to IT8983629A priority Critical patent/IT1235830B/it
Publication of IT8983629A0 publication Critical patent/IT8983629A0/it
Priority to DE69023295T priority patent/DE69023295T2/de
Priority to EP90830312A priority patent/EP0412943B1/en
Priority to US07/548,710 priority patent/US5031023A/en
Priority to JP2183864A priority patent/JPH0353552A/ja
Application granted granted Critical
Publication of IT1235830B publication Critical patent/IT1235830B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT8983629A 1989-07-11 1989-07-11 Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore IT1235830B (it)

Priority Applications (5)

Application Number Priority Date Filing Date Title
IT8983629A IT1235830B (it) 1989-07-11 1989-07-11 Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore
DE69023295T DE69023295T2 (de) 1989-07-11 1990-07-06 Verfahren zum Montieren einer Wärmesenke auf einer Pluralität von Halbleiterbauelementgehäuse.
EP90830312A EP0412943B1 (en) 1989-07-11 1990-07-06 Method of mounting a heatsink onto a plurality of semiconductor device packages
US07/548,710 US5031023A (en) 1989-07-11 1990-07-06 Single-In-Line plastic package with open ended slots for slidingly accommodating fasteners' stems prearranged on an external heat sink
JP2183864A JPH0353552A (ja) 1989-07-11 1990-07-11 外部ヒートシンクの表面上に予備配置された締着部材のステムをスライド可能に収容するためのピンサイドの反対サイド上に開口端スロットを有するシングルインラインプラスチックパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8983629A IT1235830B (it) 1989-07-11 1989-07-11 Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore

Publications (2)

Publication Number Publication Date
IT8983629A0 IT8983629A0 (it) 1989-07-11
IT1235830B true IT1235830B (it) 1992-11-03

Family

ID=11323387

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8983629A IT1235830B (it) 1989-07-11 1989-07-11 Contenitore plastico single in line fornito di asole aperte sul lato opposto alla faccia dalla quale emergono i piedini per ricevere scorrevolmente altrettanti gambi di organi di fissaggio predisposti suun dissipatore esterno di calore

Country Status (5)

Country Link
US (1) US5031023A (it)
EP (1) EP0412943B1 (it)
JP (1) JPH0353552A (it)
DE (1) DE69023295T2 (it)
IT (1) IT1235830B (it)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3307506B2 (ja) * 1994-07-13 2002-07-24 三菱電機株式会社 車両用交流発電機の制御装置および車両用交流発電機
SG80077A1 (en) 1998-10-19 2001-04-17 Sony Corp Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card
WO2000062340A1 (en) * 1999-04-09 2000-10-19 Ericsson, Inc. Cantilevered clamp for securing electronic components to a base plate
US20050264998A1 (en) * 2004-05-25 2005-12-01 3M Innovative Properties Company Heat sink assembly
JP2006332247A (ja) * 2005-05-25 2006-12-07 Sansha Electric Mfg Co Ltd 電源装置および電気装置の放熱構造
US8295049B2 (en) * 2011-05-27 2012-10-23 Renewable Power Conversion, Inc. Power converter with linear distribution of heat sources

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1914442C3 (de) * 1969-03-21 1978-05-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Halbleiteranordnung
JPS5266376A (en) * 1975-11-29 1977-06-01 Hitachi Ltd Device and manufacture of resin body type semiconductor
DE2712543C2 (de) * 1976-03-24 1982-11-11 Hitachi, Ltd., Tokyo Anordnung eines Halbleiterbauelements auf einer Montageplatte
US4204248A (en) * 1978-11-20 1980-05-20 General Electric Company Heat transfer mounting arrangement for a solid state device connected to a circuit board
GB2042803B (en) * 1979-03-05 1984-08-08 Alsthom Atlantique Support housing for a semiconductor power wafer for immersion in a fluorinated hydrocarbon
US4387413A (en) * 1980-12-24 1983-06-07 Rca Corporation Semiconductor apparatus with integral heat sink tab
JPS5811355A (ja) * 1981-07-10 1983-01-22 恋淵　一郎 冷凍機の除霜装置
DE3307704C2 (de) * 1983-03-04 1986-10-23 Brown, Boveri & Cie Ag, 6800 Mannheim Stromrichtermodul mit Befestigungslaschen
JPS63107159A (ja) * 1986-10-24 1988-05-12 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
DE69023295T2 (de) 1996-05-15
JPH0353552A (ja) 1991-03-07
IT8983629A0 (it) 1989-07-11
DE69023295D1 (de) 1995-12-07
EP0412943A1 (en) 1991-02-13
EP0412943B1 (en) 1995-11-02
US5031023A (en) 1991-07-09

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Legal Events

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970730