IT1184127B - Dispositivo di montaggio e di connessione per semi-conduttori di potenza - Google Patents

Dispositivo di montaggio e di connessione per semi-conduttori di potenza

Info

Publication number
IT1184127B
IT1184127B IT19191/85A IT1919185A IT1184127B IT 1184127 B IT1184127 B IT 1184127B IT 19191/85 A IT19191/85 A IT 19191/85A IT 1919185 A IT1919185 A IT 1919185A IT 1184127 B IT1184127 B IT 1184127B
Authority
IT
Italy
Prior art keywords
conductors
mounting
connection device
power semi
semi
Prior art date
Application number
IT19191/85A
Other languages
English (en)
Other versions
IT8519191A0 (it
Inventor
Rene Lecomte
Original Assignee
Telemecanique Electrique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR8400983A external-priority patent/FR2558644B1/fr
Priority claimed from FR8400984A external-priority patent/FR2558646B1/fr
Application filed by Telemecanique Electrique filed Critical Telemecanique Electrique
Publication of IT8519191A0 publication Critical patent/IT8519191A0/it
Application granted granted Critical
Publication of IT1184127B publication Critical patent/IT1184127B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
IT19191/85A 1984-01-23 1985-01-23 Dispositivo di montaggio e di connessione per semi-conduttori di potenza IT1184127B (it)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8400983A FR2558644B1 (fr) 1984-01-23 1984-01-23 Bloc de montage pour semi-conducteur de puissance
FR8400984A FR2558646B1 (fr) 1984-01-23 1984-01-23 Dispositif de montage et de connexion pour semi-conducteur de puissance

Publications (2)

Publication Number Publication Date
IT8519191A0 IT8519191A0 (it) 1985-01-23
IT1184127B true IT1184127B (it) 1987-10-22

Family

ID=26223782

Family Applications (1)

Application Number Title Priority Date Filing Date
IT19191/85A IT1184127B (it) 1984-01-23 1985-01-23 Dispositivo di montaggio e di connessione per semi-conduttori di potenza

Country Status (6)

Country Link
US (1) US4739447A (it)
EP (1) EP0168456B1 (it)
BR (1) BR8504783A (it)
DE (1) DE3563284D1 (it)
IT (1) IT1184127B (it)
WO (1) WO1985003385A1 (it)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
WO1991006201A1 (en) * 1989-10-16 1991-05-02 Fmtt, Inc. Integrated structure for a matrix transformer
EP0476136A4 (en) * 1990-01-24 1992-04-22 Nauchno-Proizvodstvenny Tsentr Elektronnoi Mikrotekhnologii Akademii Nauk Ssr Three-dimensional electronic unit and method of construction
GB2242580B (en) * 1990-03-30 1994-06-15 Mitsubishi Electric Corp Inverter unit with improved bus-plate configuration
DE4023687C2 (de) * 1990-07-26 2000-09-07 Abb Schweiz Ag Stromrichteranordnung
US5134545A (en) * 1991-06-04 1992-07-28 Compaq Computer Corporation Insulative cradle isolation structure for electrical components
US5251098A (en) * 1992-01-31 1993-10-05 Motorola, Inc. Multiple transistor clamping device and method
US5477188A (en) * 1994-07-14 1995-12-19 Eni Linear RF power amplifier
FR2732184B1 (fr) * 1995-03-21 1997-04-30 Asulab Sa Module electrique de puissance
US5713690A (en) * 1996-05-28 1998-02-03 International Business Machines Corporation Apparatus for attaching heatsinks
SG71046A1 (en) 1996-10-10 2000-03-21 Connector Systems Tech Nv High density connector and method of manufacture
US5917703A (en) * 1998-04-17 1999-06-29 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
DE19851161A1 (de) * 1998-11-06 2000-05-11 Abb Daimler Benz Transp Stromrichtergerät mit Gleich- und Wechselspannungsverschienung
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
JP4387777B2 (ja) * 2003-11-28 2009-12-24 株式会社東芝 電子機器
CN100433307C (zh) * 2004-01-16 2008-11-12 奇鋐科技股份有限公司 散热器固定结构
JP4564937B2 (ja) 2006-04-27 2010-10-20 日立オートモティブシステムズ株式会社 電気回路装置及び電気回路モジュール並びに電力変換装置
CA2827467C (en) 2011-05-10 2014-09-09 Obzerv Technologies Inc. Low inductance laser diode bar mount
DE102018107094B4 (de) * 2018-03-26 2021-04-15 Infineon Technologies Austria Ag Multi-Package-Oberseitenkühlung und Verfahren zu deren Herstellung

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1501388A (en) * 1974-07-30 1978-02-15 Aei Semiconductors Ltd Mounting assemblies for electronic components
JPS6013243B2 (ja) * 1977-01-24 1985-04-05 日新電機株式会社 コンデンサ
DE2711711C3 (de) * 1977-03-17 1979-11-22 Siemens Ag, 1000 Berlin Und 8000 Muenchen Halbleiteranordnung mit einem scheibenförmigen, zwischen Kühlkörpern eingespanntem Halbleiterbauelement
DE2728313A1 (de) * 1977-06-23 1979-01-04 Siemens Ag Halbleiterbauelement
US4169975A (en) * 1977-07-08 1979-10-02 Merrill Block Two-phase transformer and welding circuit therefor
DE2804348C2 (de) * 1978-02-02 1991-05-29 Brown, Boveri & Cie Ag, 6800 Mannheim Rotierende Gleichrichteranordnung für die Erregung einer Synchronmaschine
US4224663A (en) * 1979-02-01 1980-09-23 Power Control Corporation Mounting assembly for semiconductive controlled rectifiers
US4518982A (en) * 1981-02-27 1985-05-21 Motorola, Inc. High current package with multi-level leads
US4402185A (en) * 1982-01-07 1983-09-06 Ncr Corporation Thermoelectric (peltier effect) hot/cold socket for packaged I.C. microprobing

Also Published As

Publication number Publication date
EP0168456A1 (fr) 1986-01-22
EP0168456B1 (fr) 1988-06-08
BR8504783A (pt) 1985-12-24
WO1985003385A1 (fr) 1985-08-01
US4739447A (en) 1988-04-19
IT8519191A0 (it) 1985-01-23
DE3563284D1 (en) 1988-07-14

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Legal Events

Date Code Title Description
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19950131