IT1180736B - Dispositivo a circuito ibrido - Google Patents

Dispositivo a circuito ibrido

Info

Publication number
IT1180736B
IT1180736B IT8547722A IT4772285A IT1180736B IT 1180736 B IT1180736 B IT 1180736B IT 8547722 A IT8547722 A IT 8547722A IT 4772285 A IT4772285 A IT 4772285A IT 1180736 B IT1180736 B IT 1180736B
Authority
IT
Italy
Prior art keywords
circuit device
hybrid circuit
hybrid
circuit
Prior art date
Application number
IT8547722A
Other languages
English (en)
Other versions
IT8547722A0 (it
IT8547722A1 (it
Inventor
Yasumitsu Kayakawa
Original Assignee
Toko Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1984027083U external-priority patent/JPS60141155U/ja
Priority claimed from JP1984027082U external-priority patent/JPS60141154U/ja
Priority claimed from JP1984027081U external-priority patent/JPS60141153U/ja
Application filed by Toko Inc filed Critical Toko Inc
Publication of IT8547722A0 publication Critical patent/IT8547722A0/it
Publication of IT8547722A1 publication Critical patent/IT8547722A1/it
Application granted granted Critical
Publication of IT1180736B publication Critical patent/IT1180736B/it

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405Edge mounted components, e.g. terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/30Time-delay networks
    • H03H7/32Time-delay networks with lumped inductance and capacitance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/1034Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
IT8547722A 1984-02-27 1985-02-25 Dispositivo a circuito ibrido IT1180736B (it)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1984027083U JPS60141155U (ja) 1984-02-27 1984-02-27 混成回路
JP1984027082U JPS60141154U (ja) 1984-02-27 1984-02-27 混成回路
JP1984027081U JPS60141153U (ja) 1984-02-27 1984-02-27 混成回路

Publications (3)

Publication Number Publication Date
IT8547722A0 IT8547722A0 (it) 1985-02-25
IT8547722A1 IT8547722A1 (it) 1986-08-25
IT1180736B true IT1180736B (it) 1987-09-23

Family

ID=27285655

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8547722A IT1180736B (it) 1984-02-27 1985-02-25 Dispositivo a circuito ibrido

Country Status (2)

Country Link
US (1) US4656442A (it)
IT (1) IT1180736B (it)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4743868A (en) * 1985-04-03 1988-05-10 Nippondenso Co., Ltd. High frequency filter for electric instruments
JPS63129652A (ja) * 1986-11-20 1988-06-02 Toshiba Corp 半導体装置
US4763223A (en) * 1986-12-05 1988-08-09 Babcock Display Products, Inc. Non-soldered lead apparatus
JPH01112681A (ja) * 1987-07-31 1989-05-01 Toshiba Corp ハイブリッド化プリント基板
US4791075A (en) * 1987-10-05 1988-12-13 Motorola, Inc. Process for making a hermetic low cost pin grid array package
JPH0620731A (ja) * 1992-07-01 1994-01-28 Mitsubishi Electric Corp リード、集積回路装置の組立方法、集積回路装置、導電路提供用リードおよび導電路提供方法
US6079332A (en) * 1996-11-01 2000-06-27 The Ensign-Bickford Company Shock-resistant electronic circuit assembly
US6311621B1 (en) 1996-11-01 2001-11-06 The Ensign-Bickford Company Shock-resistant electronic circuit assembly
US7723993B2 (en) * 2002-09-05 2010-05-25 Midtronics, Inc. Electronic battery tester configured to predict a load test result based on open circuit voltage, temperature, cranking size rating, and a dynamic parameter
CN106298713A (zh) * 2015-06-09 2017-01-04 台达电子工业股份有限公司 一种垂直连接的功率模块及其堆叠连接的引脚

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2607821A (en) * 1949-02-05 1952-08-19 Erie Resistor Corp Electric circuit assembly
US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
CA970882A (en) * 1972-06-09 1975-07-08 Kenneth J. Moyle Semiconductor device packaging
DE3021289A1 (de) * 1980-06-06 1981-12-17 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Elektrischer baustein in schichtschaltungstechnik
US4423468A (en) * 1980-10-01 1983-12-27 Motorola, Inc. Dual electronic component assembly
US4506238A (en) * 1981-12-14 1985-03-19 Toko, Inc. Hybrid circuit device
US4521828A (en) * 1982-12-23 1985-06-04 At&T Technologies, Inc. Component module for piggyback mounting on a circuit package having dual-in-line leads

Also Published As

Publication number Publication date
IT8547722A0 (it) 1985-02-25
IT8547722A1 (it) 1986-08-25
US4656442A (en) 1987-04-07

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