IT1098670B - Procedimento per la fabbricazione di elementi semiconduttori - Google Patents
Procedimento per la fabbricazione di elementi semiconduttoriInfo
- Publication number
- IT1098670B IT1098670B IT25515/78A IT2551578A IT1098670B IT 1098670 B IT1098670 B IT 1098670B IT 25515/78 A IT25515/78 A IT 25515/78A IT 2551578 A IT2551578 A IT 2551578A IT 1098670 B IT1098670 B IT 1098670B
- Authority
- IT
- Italy
- Prior art keywords
- procedure
- manufacture
- semiconductive elements
- semiconductive
- elements
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
- Formation Of Insulating Films (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19772731221 DE2731221A1 (de) | 1977-07-11 | 1977-07-11 | Verfahren zum herstellen von halbleiterkoerpern |
Publications (2)
Publication Number | Publication Date |
---|---|
IT7825515A0 IT7825515A0 (it) | 1978-07-10 |
IT1098670B true IT1098670B (it) | 1985-09-07 |
Family
ID=6013631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT25515/78A IT1098670B (it) | 1977-07-11 | 1978-07-10 | Procedimento per la fabbricazione di elementi semiconduttori |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS5419358A (it) |
BR (1) | BR7804249A (it) |
CH (1) | CH629336A5 (it) |
DE (1) | DE2731221A1 (it) |
FR (1) | FR2397717A1 (it) |
GB (1) | GB1604308A (it) |
IT (1) | IT1098670B (it) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57184597U (it) * | 1981-05-20 | 1982-11-24 | ||
DE3211391A1 (de) * | 1982-03-27 | 1983-09-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Verfahren zum herstellen einer halbleiteranordnung |
DE3435138A1 (de) * | 1984-09-25 | 1986-04-03 | Siemens AG, 1000 Berlin und 8000 München | Verbesserung zu einem verfahren zum vereinzeln von halbleiter-bauelementen, die durch brechen aus halbleiter-wafern gewonnen sind |
DE3524301A1 (de) * | 1985-07-06 | 1987-01-15 | Semikron Gleichrichterbau | Verfahren zum herstellen von halbleiterelementen |
JPS63108706A (ja) * | 1986-10-27 | 1988-05-13 | Toshiba Corp | 半導体装置の製造方法 |
JP5903287B2 (ja) * | 2012-01-31 | 2016-04-13 | 新電元工業株式会社 | 半導体素子の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4860871A (it) * | 1971-11-30 | 1973-08-25 | ||
JPS4976469A (it) * | 1972-11-27 | 1974-07-23 | ||
US3972113A (en) * | 1973-05-14 | 1976-08-03 | Mitsubishi Denki Kabushiki Kaisha | Process of producing semiconductor devices |
-
1977
- 1977-07-11 DE DE19772731221 patent/DE2731221A1/de not_active Withdrawn
-
1978
- 1978-05-30 GB GB23885/78A patent/GB1604308A/en not_active Expired
- 1978-06-29 BR BR7804249A patent/BR7804249A/pt unknown
- 1978-06-30 CH CH713778A patent/CH629336A5/de not_active IP Right Cessation
- 1978-07-06 FR FR7820232A patent/FR2397717A1/fr not_active Withdrawn
- 1978-07-10 JP JP8311678A patent/JPS5419358A/ja active Pending
- 1978-07-10 IT IT25515/78A patent/IT1098670B/it active
Also Published As
Publication number | Publication date |
---|---|
FR2397717A1 (fr) | 1979-02-09 |
GB1604308A (en) | 1981-12-09 |
DE2731221A1 (de) | 1979-02-01 |
IT7825515A0 (it) | 1978-07-10 |
BR7804249A (pt) | 1979-04-10 |
CH629336A5 (en) | 1982-04-15 |
JPS5419358A (en) | 1979-02-14 |
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