IT1049081B - Soluzione per placcatura metallica - Google Patents
Soluzione per placcatura metallicaInfo
- Publication number
- IT1049081B IT1049081B IT7529274A IT2927475A IT1049081B IT 1049081 B IT1049081 B IT 1049081B IT 7529274 A IT7529274 A IT 7529274A IT 2927475 A IT2927475 A IT 2927475A IT 1049081 B IT1049081 B IT 1049081B
- Authority
- IT
- Italy
- Prior art keywords
- plating solution
- metal plating
- metal
- solution
- plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/538,125 US3977884A (en) | 1975-01-02 | 1975-01-02 | Metal plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1049081B true IT1049081B (it) | 1981-01-20 |
Family
ID=24145605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT7529274A IT1049081B (it) | 1975-01-02 | 1975-11-13 | Soluzione per placcatura metallica |
Country Status (8)
Country | Link |
---|---|
US (1) | US3977884A (it) |
JP (1) | JPS5192738A (it) |
CA (1) | CA1051606A (it) |
DE (1) | DE2559059C3 (it) |
FR (1) | FR2296699A1 (it) |
GB (1) | GB1507730A (it) |
IT (1) | IT1049081B (it) |
SE (1) | SE7512496L (it) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0164083B1 (de) * | 1984-06-07 | 1991-05-02 | Hoechst Aktiengesellschaft | Positiv arbeitende strahlungsempfindliche Beschichtungslösung |
US5306334A (en) * | 1992-07-20 | 1994-04-26 | Monsanto Company | Electroless nickel plating solution |
WO1994012686A1 (en) * | 1992-11-25 | 1994-06-09 | Kanto Kagaku Kabushiki Kaisha | Electroless gold plating bath |
US5338343A (en) * | 1993-07-23 | 1994-08-16 | Technic Incorporated | Catalytic electroless gold plating baths |
MY144574A (en) * | 1998-09-14 | 2011-10-14 | Ibiden Co Ltd | Printed circuit board and method for its production |
US6265301B1 (en) * | 1999-05-12 | 2001-07-24 | Taiwan Semiconductor Manufacturing Company | Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures |
US6277180B1 (en) * | 1999-07-12 | 2001-08-21 | Oliver Sales Company | Method of replacing evaporation losses from colloidal catalyst baths |
US6902605B2 (en) * | 2003-03-06 | 2005-06-07 | Blue29, Llc | Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper |
WO2007043333A1 (ja) * | 2005-10-07 | 2007-04-19 | Nippon Mining & Metals Co., Ltd. | 無電解ニッケルめっき液 |
US20070175359A1 (en) * | 2006-02-01 | 2007-08-02 | Kilnam Hwang | Electroless gold plating solution and method |
US10731258B2 (en) | 2014-10-27 | 2020-08-04 | Surface Technology, Inc. | Plating bath solutions |
US10006126B2 (en) * | 2014-10-27 | 2018-06-26 | Surface Technology, Inc. | Plating bath solutions |
US10655227B2 (en) * | 2017-10-06 | 2020-05-19 | Rohm And Haas Electronic Materials Llc | Stable electroless copper plating compositions and methods for electroless plating copper on substrates |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2762723A (en) * | 1953-06-03 | 1956-09-11 | Gen American Transporation Cor | Processes of chemical nickel plating and baths therefor |
US3738849A (en) * | 1971-12-22 | 1973-06-12 | Du Pont | Chemical plating solutions |
US3764352A (en) * | 1972-06-13 | 1973-10-09 | Shipley Co | Metal finishing alloy |
JPS5347770B2 (it) * | 1973-01-11 | 1978-12-23 |
-
1975
- 1975-01-02 US US05/538,125 patent/US3977884A/en not_active Expired - Lifetime
- 1975-10-31 GB GB45434/75A patent/GB1507730A/en not_active Expired
- 1975-11-03 CA CA238,933A patent/CA1051606A/en not_active Expired
- 1975-11-07 SE SE7512496A patent/SE7512496L/xx unknown
- 1975-11-13 IT IT7529274A patent/IT1049081B/it active
- 1975-11-21 FR FR7535660A patent/FR2296699A1/fr active Granted
- 1975-12-30 DE DE2559059A patent/DE2559059C3/de not_active Expired
-
1976
- 1976-01-05 JP JP51000577A patent/JPS5192738A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2559059C3 (de) | 1978-05-11 |
JPS5192738A (it) | 1976-08-14 |
DE2559059B2 (de) | 1977-09-15 |
GB1507730A (en) | 1978-04-19 |
SE7512496L (sv) | 1976-07-05 |
FR2296699B1 (it) | 1978-09-22 |
CA1051606A (en) | 1979-04-03 |
US3977884A (en) | 1976-08-31 |
DE2559059A1 (de) | 1976-07-08 |
FR2296699A1 (fr) | 1976-07-30 |
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