IT1028204B - Metodo di deposizione da fase vapore - Google Patents
Metodo di deposizione da fase vaporeInfo
- Publication number
- IT1028204B IT1028204B IT19051/75A IT1905175A IT1028204B IT 1028204 B IT1028204 B IT 1028204B IT 19051/75 A IT19051/75 A IT 19051/75A IT 1905175 A IT1905175 A IT 1905175A IT 1028204 B IT1028204 B IT 1028204B
- Authority
- IT
- Italy
- Prior art keywords
- deposition method
- phase deposition
- steam phase
- steam
- phase
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/439,581 US3934059A (en) | 1974-02-04 | 1974-02-04 | Method of vapor deposition |
Publications (1)
Publication Number | Publication Date |
---|---|
IT1028204B true IT1028204B (it) | 1979-01-30 |
Family
ID=23745290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT19051/75A IT1028204B (it) | 1974-02-04 | 1975-01-03 | Metodo di deposizione da fase vapore |
Country Status (9)
Country | Link |
---|---|
US (1) | US3934059A (it) |
JP (1) | JPS5519313B2 (it) |
BE (1) | BE825126A (it) |
CA (1) | CA1056658A (it) |
DE (1) | DE2503109A1 (it) |
FR (1) | FR2259915B1 (it) |
GB (1) | GB1461034A (it) |
IT (1) | IT1028204B (it) |
SE (1) | SE419103B (it) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4407871A (en) * | 1980-03-25 | 1983-10-04 | Ex-Cell-O Corporation | Vacuum metallized dielectric substrates and method of making same |
US4431711A (en) * | 1980-03-25 | 1984-02-14 | Ex-Cell-O Corporation | Vacuum metallizing a dielectric substrate with indium and products thereof |
JPS5948873B2 (ja) * | 1980-05-14 | 1984-11-29 | ペルメレック電極株式会社 | 耐食性被覆を設けた電極基体又は電極の製造方法 |
GB2128636B (en) * | 1982-10-19 | 1986-01-08 | Motorola Ltd | Silicon-aluminium alloy metallization of semiconductor substrate |
US4495221A (en) * | 1982-10-26 | 1985-01-22 | Signetics Corporation | Variable rate semiconductor deposition process |
DE3730644A1 (de) * | 1987-09-11 | 1989-03-30 | Baeuerle Dieter | Verfahren zur vorgegeben strukturierten abscheidung von mikrostrukturen mit laserlicht |
US4876114A (en) * | 1987-09-23 | 1989-10-24 | International Business Machines Corporation | Process for the self fractionation deposition of a metallic layer on a workpiece |
US5201215A (en) * | 1991-10-17 | 1993-04-13 | The United States Of America As Represented By The United States Department Of Energy | Method for simultaneous measurement of mass loading and fluid property changes using a quartz crystal microbalance |
US6716740B2 (en) * | 2001-10-09 | 2004-04-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for depositing silicon oxide incorporating an outgassing step |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2812411A (en) * | 1955-09-30 | 1957-11-05 | Hughes Aircraft Co | Means for vapor deposition of metals |
NL272593A (it) * | 1960-12-16 | |||
US3382568A (en) * | 1965-07-22 | 1968-05-14 | Ibm | Method for providing electrical connections to semiconductor devices |
US3556837A (en) * | 1967-11-22 | 1971-01-19 | Gulf Energy & Environ Systems | Composite and method of making same |
US3518506A (en) * | 1967-12-06 | 1970-06-30 | Ibm | Semiconductor device with contact metallurgy thereon,and method for making same |
US3498818A (en) * | 1968-01-23 | 1970-03-03 | Gen Electric | Method of making highly reflective aluminum films |
US3620837A (en) * | 1968-09-16 | 1971-11-16 | Ibm | Reliability of aluminum and aluminum alloy lands |
US3594214A (en) * | 1969-04-04 | 1971-07-20 | United States Steel Corp | Method of applying a zinc coating to a sheet-steel base |
-
1974
- 1974-02-04 US US05/439,581 patent/US3934059A/en not_active Expired - Lifetime
-
1975
- 1975-01-03 IT IT19051/75A patent/IT1028204B/it active
- 1975-01-23 CA CA218,545A patent/CA1056658A/en not_active Expired
- 1975-01-25 DE DE19752503109 patent/DE2503109A1/de not_active Withdrawn
- 1975-01-28 FR FR7502580A patent/FR2259915B1/fr not_active Expired
- 1975-01-28 GB GB373475A patent/GB1461034A/en not_active Expired
- 1975-01-30 JP JP1330175A patent/JPS5519313B2/ja not_active Expired
- 1975-02-03 SE SE7501153A patent/SE419103B/xx unknown
- 1975-02-03 BE BE153009A patent/BE825126A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
SE419103B (sv) | 1981-07-13 |
JPS50123534A (it) | 1975-09-29 |
JPS5519313B2 (it) | 1980-05-24 |
BE825126A (fr) | 1975-05-29 |
GB1461034A (en) | 1977-01-13 |
DE2503109A1 (de) | 1975-08-07 |
CA1056658A (en) | 1979-06-19 |
FR2259915A1 (it) | 1975-08-29 |
US3934059A (en) | 1976-01-20 |
FR2259915B1 (it) | 1981-06-19 |
SE7501153L (it) | 1975-08-05 |
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