IN2014CN02625A - - Google Patents

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Publication number
IN2014CN02625A
IN2014CN02625A IN2625CHN2014A IN2014CN02625A IN 2014CN02625 A IN2014CN02625 A IN 2014CN02625A IN 2625CHN2014 A IN2625CHN2014 A IN 2625CHN2014A IN 2014CN02625 A IN2014CN02625 A IN 2014CN02625A
Authority
IN
India
Prior art keywords
epoxy
peroxide
molecule
comprised
curing agent
Prior art date
Application number
Inventor
Haiping Wu
Jingfen Zhang
Rainer Schoenfeld
Nigel Fay
Original Assignee
Henkel China Co Ltd
Henkel Ag & Co Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel China Co Ltd, Henkel Ag & Co Kgaa filed Critical Henkel China Co Ltd
Publication of IN2014CN02625A publication Critical patent/IN2014CN02625A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic

Abstract

The present invention provides a gel time controllable epoxy adhesive which includes a first part comprising an epoxy resin containing two or more epoxy groups in one molecule and a second part comprising a thiol curing agent wherein a peroxide is comprised in part A part B and/or a third separate part C.
IN2625CHN2014 2011-10-11 2012-10-11 IN2014CN02625A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/CN2011/080626 WO2013053100A1 (en) 2011-10-11 2011-10-11 Gel time controllable two part epoxy adhesive
PCT/CN2012/082794 WO2013053328A1 (en) 2011-10-11 2012-10-11 Gel time controllable two part epoxy adhesive

Publications (1)

Publication Number Publication Date
IN2014CN02625A true IN2014CN02625A (en) 2015-08-07

Family

ID=48081345

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2625CHN2014 IN2014CN02625A (en) 2011-10-11 2012-10-11

Country Status (7)

Country Link
US (1) US9371475B2 (en)
EP (1) EP2766444B1 (en)
JP (1) JP6095016B2 (en)
KR (1) KR102049224B1 (en)
ES (1) ES2636686T3 (en)
IN (1) IN2014CN02625A (en)
WO (2) WO2013053100A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101693605B1 (en) 2015-02-10 2017-01-17 한국생산기술연구원 A epoxy adhesive composition comprising poly-thiolhardner and manufacturetingmthetod of it
SG11202003707SA (en) 2017-10-31 2020-05-28 Namics Corp Resin composition
CN112703209B (en) 2018-10-05 2022-08-05 纳美仕有限公司 Resin composition
JP7333638B2 (en) 2018-10-09 2023-08-25 ナミックス株式会社 Curing agent composition for curing 2-methylene-1,3-dicarbonyl compound
CN111171284A (en) * 2020-01-07 2020-05-19 南宁珀源能源材料有限公司 Epoxy modified aliphatic amine curing agent and application thereof in silicon ingot cutting fixing glue
CN112375209B (en) * 2020-10-30 2022-07-22 山东益丰生化环保股份有限公司 Curing agent in epoxy resin adhesive with controllable gel time and preparation method thereof

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DE3727847A1 (en) * 1987-08-20 1989-03-02 Fuller H B Co MELT ADHESIVE AND METHOD FOR ITS PRODUCTION AND PROCESSING
JP3038777B2 (en) * 1990-04-05 2000-05-08 大日本インキ化学工業株式会社 Construction method of unsaturated polyester resin flooring material
JPH0676428B2 (en) 1990-05-16 1994-09-28 第一工業製薬株式会社 Method for decolorizing sucrose fatty acid ester
JP2500526B2 (en) 1990-12-25 1996-05-29 凸版印刷株式会社 Photomask blanks and photomasks
JP3584537B2 (en) 1995-03-31 2004-11-04 東レ・ファインケミカル株式会社 Thiol group-containing polyether polymer and method for producing the same
US6653371B1 (en) 1998-01-16 2003-11-25 Barry E. Burns One-part curable composition of polyepoxide, polythiol, latent hardener and solid organic acid
IL136344A0 (en) * 1998-01-16 2001-05-20 Loctite R & D Ltd Curable epoxy-based compositions
CN1133678C (en) 1998-04-17 2004-01-07 三洋化成工业株式会社 Curable composition and cured article thereof
JP3802253B2 (en) * 1998-12-22 2006-07-26 化薬アクゾ株式会社 Resin curing accelerator and curing method
US6313257B1 (en) * 1999-03-23 2001-11-06 Lord Corporation Poly (mercaptopropylaryl) curatives
JP2003231736A (en) * 2002-02-08 2003-08-19 Nagase Chemtex Corp Two-pack type repairable composition and repairable adhesive made by using it
DE10357355A1 (en) * 2003-12-09 2005-07-14 Henkel Kgaa 2 K adhesives for vehicle construction
JP4707981B2 (en) 2004-08-06 2011-06-22 昭和電工株式会社 Manufacturing method of molded product
WO2007042199A1 (en) 2005-10-07 2007-04-19 Dsm Ip Assets B.V. Method for chemical anchoring
JP5076691B2 (en) 2007-07-11 2012-11-21 Ｊｆｅスチール株式会社 Manufacturing method of high-strength cold-rolled steel sheet
WO2009018193A1 (en) * 2007-08-02 2009-02-05 Dow Global Technologies Inc. Amphiphilic block copolymers and inorganic nanofillers to enhance performance of thermosetting polymers
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JP5466368B2 (en) * 2008-02-18 2014-04-09 積水化学工業株式会社 Adhesive for joining electronic components
EP2268696A1 (en) * 2008-04-14 2011-01-05 Dow Global Technologies Inc. Use of filler that undergoes endothermic phase transition to lower the reaction exotherm of epoxy based compositions
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US9181129B2 (en) * 2009-11-30 2015-11-10 Dsm Ip Assets B.V. Resin suitable for construction purposes comprising norbornene functional groups and thiols

Also Published As

Publication number Publication date
EP2766444A1 (en) 2014-08-20
WO2013053100A1 (en) 2013-04-18
JP2014531505A (en) 2014-11-27
EP2766444A4 (en) 2015-06-17
ES2636686T3 (en) 2017-10-06
KR102049224B1 (en) 2019-11-28
US20140221532A1 (en) 2014-08-07
EP2766444B1 (en) 2017-06-28
US9371475B2 (en) 2016-06-21
JP6095016B2 (en) 2017-03-15
WO2013053328A1 (en) 2013-04-18
KR20140074933A (en) 2014-06-18

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