IN2012DE00814A - - Google Patents
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- Publication number
- IN2012DE00814A IN2012DE00814A IN814DE2012A IN2012DE00814A IN 2012DE00814 A IN2012DE00814 A IN 2012DE00814A IN 814DE2012 A IN814DE2012 A IN 814DE2012A IN 2012DE00814 A IN2012DE00814 A IN 2012DE00814A
- Authority
- IN
- India
- Prior art keywords
- electronic components
- controlling
- present
- internal temperature
- maintaining
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Control Of Temperature (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/IB2013/000418 WO2013140226A2 (en) | 2012-03-20 | 2013-03-19 | System and method for controlling internal temperature of electronic components |
| IN814DE2012 IN2012DE00814A (sr) | 2012-03-20 | 2013-03-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IN814DE2012 IN2012DE00814A (sr) | 2012-03-20 | 2013-03-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2012DE00814A true IN2012DE00814A (sr) | 2015-08-21 |
Family
ID=48446402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN814DE2012 IN2012DE00814A (sr) | 2012-03-20 | 2013-03-19 |
Country Status (2)
| Country | Link |
|---|---|
| IN (1) | IN2012DE00814A (sr) |
| WO (1) | WO2013140226A2 (sr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11450585B2 (en) * | 2020-11-02 | 2022-09-20 | Innogrit Technologies Co., Ltd. | On-die thermal management for VLSI applications |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005055395A (ja) * | 2003-08-07 | 2005-03-03 | Denso Corp | ガス濃度センサのヒータ制御装置 |
| US7852098B2 (en) * | 2005-08-01 | 2010-12-14 | Marvell World Trade Ltd. | On-die heating circuit and control loop for rapid heating of the die |
| US8086358B2 (en) * | 2007-07-11 | 2011-12-27 | International Business Machines Corporation | Method for pre-heating high power devices to enable low temperature start-up and operation |
| US8785823B2 (en) * | 2007-07-11 | 2014-07-22 | International Business Machines Corporation | Extending the operating temperature range of high power devices |
| DE102008026135B4 (de) * | 2008-05-30 | 2012-02-16 | GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG | Steuerung für tiefe Temperaturen in einem Halbleiterbauelement |
-
2013
- 2013-03-19 IN IN814DE2012 patent/IN2012DE00814A/en unknown
- 2013-03-19 WO PCT/IB2013/000418 patent/WO2013140226A2/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013140226A3 (en) | 2013-12-12 |
| WO2013140226A2 (en) | 2013-09-26 |
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