IN147651B - - Google Patents
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- Publication number
- IN147651B IN147651B IN427/CAL/77A IN427CA1977A IN147651B IN 147651 B IN147651 B IN 147651B IN 427CA1977 A IN427CA1977 A IN 427CA1977A IN 147651 B IN147651 B IN 147651B
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- IN
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66781176A | 1976-03-16 | 1976-03-16 | |
US05/751,919 US4171477A (en) | 1976-03-16 | 1976-12-17 | Micro-surface welding |
Publications (1)
Publication Number | Publication Date |
---|---|
IN147651B true IN147651B (de) | 1980-05-17 |
Family
ID=27099774
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN427/CAL/77A IN147651B (de) | 1976-03-16 | 1977-03-23 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4171477A (de) |
JP (1) | JPS5824941B2 (de) |
DE (1) | DE2710835C3 (de) |
FR (1) | FR2345053A1 (de) |
GB (1) | GB1530537A (de) |
IN (1) | IN147651B (de) |
IT (1) | IT1115709B (de) |
Families Citing this family (59)
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GB2125720B (en) * | 1982-08-24 | 1986-11-05 | Asm Assembly Automation Ltd | Wire bonding apparatus |
US4597522A (en) * | 1983-12-26 | 1986-07-01 | Kabushiki Kaisha Toshiba | Wire bonding method and device |
JPS60243549A (ja) * | 1984-05-05 | 1985-12-03 | ゲゼルシヤフト、フユール、ゲレーテバウ、ミツト、ベシユレンクテル、ハフツング | ガスの触媒燃焼用のセンサの製造方法 |
US4697058A (en) * | 1986-04-28 | 1987-09-29 | International Business Machines Corporation | Microweld apparatus with an improved electrode tip design and tip support |
US4772498A (en) * | 1986-11-20 | 1988-09-20 | Air Products And Chemicals, Inc. | Silicon carbide capillaries |
US4861533A (en) * | 1986-11-20 | 1989-08-29 | Air Products And Chemicals, Inc. | Method of preparing silicon carbide capillaries |
US4950866A (en) * | 1987-12-08 | 1990-08-21 | Hitachi, Ltd. | Method and apparatus of bonding insulated and coated wire |
DE4007292C1 (de) * | 1990-03-08 | 1991-06-27 | Forschungszentrum Juelich Gmbh, 5170 Juelich, De | |
US5253415A (en) * | 1990-03-20 | 1993-10-19 | Die Tech, Inc. | Method of making an integrated circuit substrate lead assembly |
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US5097100A (en) * | 1991-01-25 | 1992-03-17 | Sundstrand Data Control, Inc. | Noble metal plated wire and terminal assembly, and method of making the same |
JPH0813423B2 (ja) * | 1991-12-27 | 1996-02-14 | 株式会社セイワ製作所 | アルミニウム箔の溶接方法 |
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DE4323149A1 (de) * | 1993-07-10 | 1995-01-12 | Audi Ag | Elektrode zum Widerstandsschweißen |
ATE211667T1 (de) * | 1997-04-22 | 2002-01-15 | F&K Delvotec Bondtechnik Gmbh | Drahtführung für eine bondmaschine |
US5950070A (en) * | 1997-05-15 | 1999-09-07 | Kulicke & Soffa Investments | Method of forming a chip scale package, and a tool used in forming the chip scale package |
US20060071050A1 (en) * | 1999-02-25 | 2006-04-06 | Reiber Steven F | Multi-head tab bonding tool |
US6651864B2 (en) * | 1999-02-25 | 2003-11-25 | Steven Frederick Reiber | Dissipative ceramic bonding tool tip |
US20060261132A1 (en) * | 1999-02-25 | 2006-11-23 | Reiber Steven F | Low range bonding tool |
US6354479B1 (en) * | 1999-02-25 | 2002-03-12 | Sjm Technologies | Dissipative ceramic bonding tip |
US7032802B2 (en) * | 1999-02-25 | 2006-04-25 | Reiber Steven F | Bonding tool with resistance |
US20080197172A1 (en) * | 1999-02-25 | 2008-08-21 | Reiber Steven F | Bonding Tool |
US7124927B2 (en) * | 1999-02-25 | 2006-10-24 | Reiber Steven F | Flip chip bonding tool and ball placement capillary |
US7389905B2 (en) | 1999-02-25 | 2008-06-24 | Reiber Steven F | Flip chip bonding tool tip |
US20070131661A1 (en) * | 1999-02-25 | 2007-06-14 | Reiber Steven F | Solder ball placement system |
US6396080B2 (en) * | 1999-05-18 | 2002-05-28 | Cree, Inc | Semi-insulating silicon carbide without vanadium domination |
US6646228B2 (en) * | 1999-08-18 | 2003-11-11 | Hyperion Innovations, Inc. | Cordless soldering iron |
US20040149713A1 (en) * | 1999-08-18 | 2004-08-05 | Hyperion Innovations, Inc. | Cordless soldering iron |
DE10006764C1 (de) * | 2000-02-15 | 2002-04-18 | Heraeus Electro Nite Int | Elektrische Verbindung |
JP3548509B2 (ja) * | 2000-06-07 | 2004-07-28 | 諏訪熱工業株式会社 | パルス通電接合方法及び接合装置並びに接合体 |
US6699265B1 (en) | 2000-11-03 | 2004-03-02 | Cardiac Pacemakers, Inc. | Flat capacitor for an implantable medical device |
US6522525B1 (en) | 2000-11-03 | 2003-02-18 | Cardiac Pacemakers, Inc. | Implantable heart monitors having flat capacitors with curved profiles |
US7107099B1 (en) | 2000-11-03 | 2006-09-12 | Cardiac Pacemakers, Inc. | Capacitor having a feedthrough assembly with a coupling member |
US6684102B1 (en) | 2000-11-03 | 2004-01-27 | Cardiac Pacemakers, Inc. | Implantable heart monitors having capacitors with endcap headers |
US6833987B1 (en) | 2000-11-03 | 2004-12-21 | Cardiac Pacemakers, Inc. | Flat capacitor having an active case |
US7456077B2 (en) | 2000-11-03 | 2008-11-25 | Cardiac Pacemakers, Inc. | Method for interconnecting anodes and cathodes in a flat capacitor |
US7355841B1 (en) | 2000-11-03 | 2008-04-08 | Cardiac Pacemakers, Inc. | Configurations and methods for making capacitor connections |
US6687118B1 (en) | 2000-11-03 | 2004-02-03 | Cardiac Pacemakers, Inc. | Flat capacitor having staked foils and edge-connected connection members |
US6509588B1 (en) | 2000-11-03 | 2003-01-21 | Cardiac Pacemakers, Inc. | Method for interconnecting anodes and cathodes in a flat capacitor |
DE10114355A1 (de) * | 2001-03-22 | 2002-10-17 | Intec Holding Gmbh | Verfahren zur Herstellung einer kontaktlosen multifunktionalen Chipkarte sowie entsprechend hergestellte Chipkarte |
CN1139453C (zh) * | 2001-06-12 | 2004-02-25 | 杨仕桐 | 点电焊焊头 |
US6520399B1 (en) * | 2001-09-14 | 2003-02-18 | Raytheon Company | Thermosonic bonding apparatus, tool, and method |
JP2005511322A (ja) * | 2001-12-14 | 2005-04-28 | ハイペリオン イノベーションズ インコーポレイテッド | コードレスはんだごて |
US20060178019A1 (en) * | 2002-08-18 | 2006-08-10 | Aviza Technology, Inc. | Low temperature deposition of silicon oxides and oxynitrides |
US6857552B2 (en) * | 2003-04-17 | 2005-02-22 | Intercard Limited | Method and apparatus for making smart card solder contacts |
US7180727B2 (en) | 2004-07-16 | 2007-02-20 | Cardiac Pacemakers, Inc. | Capacitor with single sided partial etch and stake |
US7120008B2 (en) * | 2004-07-16 | 2006-10-10 | Cardiac Pacemakers, Inc. | Method and apparatus for capacitor interconnection using a metal spray |
US7327552B2 (en) * | 2005-05-09 | 2008-02-05 | Cardiac Pacemakers, Inc. | Method and apparatus for electrically connecting capacitor electrodes using a spray |
US20070085085A1 (en) * | 2005-08-08 | 2007-04-19 | Reiber Steven F | Dissipative pick and place tools for light wire and LED displays |
CN100360270C (zh) * | 2005-12-23 | 2008-01-09 | 杨仕桐 | 连体电极的电阻焊焊头及其制备方法 |
TWI343611B (en) * | 2007-06-08 | 2011-06-11 | Orient Semiconductor Elect Ltd | Semiconductor package and method for discharging electronic devices on a substrate |
JP5804644B2 (ja) * | 2012-02-21 | 2015-11-04 | 超音波工業株式会社 | 超音波ワイヤボンディング装置および超音波ワイヤボンディング方法 |
US8952292B2 (en) * | 2012-04-17 | 2015-02-10 | Caterpillar Inc. | Adjustable welding head for multiple electrode cladding |
DE102013104207A1 (de) * | 2013-04-25 | 2014-11-13 | Epcos Ag | Vorrichtung und Verfahren zur Herstellung einer elektrisch leitfähigen und mechanischen Verbindung |
HK1193540A2 (en) * | 2013-07-26 | 2014-09-19 | Cardmatix Co Ltd | A method of manufacturing a smart card |
WO2020208850A1 (ja) * | 2019-04-09 | 2020-10-15 | 株式会社カイジョー | 絶縁被覆線の接合方法、接続構造、絶縁被覆線の剥離方法及びボンディング装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US2160659A (en) * | 1937-10-05 | 1939-05-30 | Mallory & Co Inc P R | High resistance electrode |
US3263057A (en) * | 1963-05-09 | 1966-07-26 | North American Aviation Inc | Thermocompression bonder |
US3320401A (en) * | 1963-05-24 | 1967-05-16 | North American Aviation Inc | Diffusion bonder |
US3263059A (en) * | 1963-11-19 | 1966-07-26 | Ibm | Fine insulated wire welder |
US3342972A (en) * | 1964-01-22 | 1967-09-19 | Aerojet General Co | Welding electrode assembly |
US3297855A (en) * | 1964-06-26 | 1967-01-10 | Ibm | Method of bonding |
US3435184A (en) * | 1965-07-12 | 1969-03-25 | Gen Time Corp | Parallel gap welding |
JPS4837221A (de) * | 1971-09-10 | 1973-06-01 |
-
1976
- 1976-12-17 US US05/751,919 patent/US4171477A/en not_active Expired - Lifetime
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1977
- 1977-02-28 FR FR7706669A patent/FR2345053A1/fr active Granted
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- 1977-03-08 GB GB965177A patent/GB1530537A/en not_active Expired
- 1977-03-11 JP JP52026168A patent/JPS5824941B2/ja not_active Expired
- 1977-03-12 DE DE2710835A patent/DE2710835C3/de not_active Expired
- 1977-03-23 IN IN427/CAL/77A patent/IN147651B/en unknown
Also Published As
Publication number | Publication date |
---|---|
GB1530537A (en) | 1978-11-01 |
IT1115709B (it) | 1986-02-03 |
DE2710835C3 (de) | 1981-05-27 |
DE2710835A1 (de) | 1977-09-29 |
US4171477A (en) | 1979-10-16 |
DE2710835B2 (de) | 1980-09-04 |
JPS5824941B2 (ja) | 1983-05-24 |
JPS52112277A (en) | 1977-09-20 |
FR2345053A1 (fr) | 1977-10-14 |
FR2345053B1 (de) | 1980-12-19 |