IL69209A - Thermoplastic polyimide-modified epoxy resin compositions - Google Patents

Thermoplastic polyimide-modified epoxy resin compositions

Info

Publication number: IL69209A
Authority: IL; Israel
Prior art keywords: epoxy resin; resin compositions; modified epoxy; thermoplastic polyimide; polyimide
Prior art date: 1982-07-14

Application number

IL69209A

Other versions

IL69209A0 (en

Original Assignee

Ciba Geigy

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1982-07-14

Filing date

1983-07-12

Publication date

1986-12-31

Family has litigation

First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23573423&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IL69209(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

1983-07-12 Application filed by Ciba Geigy filed Critical Ciba Geigy

1983-11-30 Publication of IL69209A0 publication Critical patent/IL69209A0/en

1986-12-31 Publication of IL69209A publication Critical patent/IL69209A/en

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

IL69209A 1982-07-14 1983-07-12 Thermoplastic polyimide-modified epoxy resin compositions IL69209A (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US39796382A	1982-07-14	1982-07-14

Publications (2)

Publication Number	Publication Date
IL69209A0 IL69209A0 (en)	1983-11-30
IL69209A true IL69209A (en)	1986-12-31

Family

ID=23573423

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL69209A IL69209A (en)	1982-07-14	1983-07-12	Thermoplastic polyimide-modified epoxy resin compositions

Country Status (7)

Country	Link
EP (1)	EP0099338B1 (en)
JP (1)	JPS5927916A (en)
AU (1)	AU1680683A (en)
BR (1)	BR8303755A (en)
DE (1)	DE3363507D1 (en)
IL (1)	IL69209A (en)
ZA (1)	ZA835093B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5936156A (en) *	1982-08-23	1984-02-28	Toray Ind Inc	Thermoplastic resin composition
EP0159482A3 (en) *	1984-03-28	1987-02-25	American Cyanamid Company	Resin matrix composites with controlled flow and tack
US4892901A (en) *	1987-12-31	1990-01-09	General Electric Company	Polyetherimide ester elastomer
JPH0234656A (en) *	1988-07-23	1990-02-05	Matsushita Electric Works Ltd	Molding resin material for sealing
US5242748A (en) *	1989-01-04	1993-09-07	Basf Aktiengesellschaft	Toughened thermosetting structural materials
JP2643518B2 (en) *	1989-02-10	1997-08-20	東レ株式会社	Prepreg
EP0455755B1 (en) *	1989-08-10	1997-04-02	Fiberite Inc.	Epoxy matrix toughened with polyimide thermoplastic resin
US5108825A (en) *	1989-12-21	1992-04-28	General Electric Company	Epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it
JP3415144B2 (en) *	1989-12-21	2003-06-09	ロックヒードマーティンコーポレーション	Epoxy / polyimide copolymer blend dielectric and multilayer circuit using the same
JP2689709B2 (en) *	1990-09-17	1997-12-10	ヤマハ株式会社	Electronic musical instrument
DE69323129T2 (en) *	1992-08-11	1999-08-19	Hexcel Corp	Thermosetting resins toughened with sulfone polymers
JPH06202628A (en) *	1993-06-01	1994-07-22	Casio Comput Co Ltd	Acoustic signal modulating device
KR100412080B1 (en) *	1996-07-08	2004-05-24	삼성에스디아이 주식회사	Compound for forming orientation film of lcd
DE19932274A1 (en)	1999-07-05	2001-01-18	Inst Polymerforschung Dresden	Fiber composite material and process for its manufacture
JP4732001B2 (en) *	2005-05-26	2011-07-27	株式会社タムラ製作所	Thermosetting resin composition for buildup substrate interlayer insulation material, resin film, product with film, and interlayer insulation material for buildup substrate
JP7176551B2 (en) *	2020-07-28	2022-11-22	味の素株式会社	Resin composition, adhesive film, prepreg, printed wiring board and semiconductor device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3856752A (en) *	1973-10-01	1974-12-24	Ciba Geigy Corp	Soluble polyimides derived from phenylindane diamines and dianhydrides
US4118535A (en) *	1975-11-03	1978-10-03	General Electric Company	Novel polyetheramide-imide epoxy resin blends
DE2900560A1 (en) *	1979-01-09	1980-07-17	Bayer Ag	MIXTURES OF POLYAMIDIMIDE RESINS AND EPOXY COMPOUNDS
US4277583A (en) *	1979-12-03	1981-07-07	Plastics Engineering Company	Oxirane polyimide copolymers

1983
- 1983-07-08 DE DE8383810313T patent/DE3363507D1/en not_active Expired
- 1983-07-08 EP EP83810313A patent/EP0099338B1/en not_active Expired
- 1983-07-12 IL IL69209A patent/IL69209A/en unknown
- 1983-07-13 BR BR8303755A patent/BR8303755A/en unknown
- 1983-07-13 ZA ZA835093A patent/ZA835093B/en unknown
- 1983-07-13 AU AU16806/83A patent/AU1680683A/en not_active Abandoned
- 1983-07-14 JP JP58128698A patent/JPS5927916A/en active Pending

Also Published As

Publication number	Publication date
BR8303755A (en)	1984-02-21
EP0099338A1 (en)	1984-01-25
JPS5927916A (en)	1984-02-14
DE3363507D1 (en)	1986-06-19
EP0099338B1 (en)	1986-05-14
AU1680683A (en)	1984-01-19
ZA835093B (en)	1984-04-25
IL69209A0 (en)	1983-11-30

Publication	Publication Date	Title
GB2121045B (en)	1985-08-07	Epoxy resin composition
DE3363689D1 (en)	1986-07-03	Thermoplastic resin composition
DE3371090D1 (en)	1987-05-27	Resin composition
GB8329747D0 (en)	1983-12-14	Thermoplastic resin composition
GB2075989B (en)	1984-04-26	Stabilized thermoplastic resin compositions
DE3377430D1 (en)	1988-08-25	Photo-curable epoxy resin composition
SG51189G (en)	1990-03-02	Synthetic resin compositions
DE3470050D1 (en)	1988-04-28	Thermosetting epoxy resin compositions
DE3372625D1 (en)	1987-08-27	Photo-curable epoxy resin composition
DE3367399D1 (en)	1986-12-11	Epoxy resin composition
DE3361844D1 (en)	1986-02-27	Thermoplastic resin composition
JPS56115315A (en)	1981-09-10	Epoxy resin composition
GB8301930D0 (en)	1983-02-23	Epoxy resin
GB8326782D0 (en)	1983-11-09	Thermoplastic resin composition
EP0089206A3 (en)	1984-12-27	Resin composition
IL69209A (en)	1986-12-31	Thermoplastic polyimide-modified epoxy resin compositions
GB8306758D0 (en)	1983-04-20	Thermosetting resin composition
EP0138209A3 (en)	1986-09-17	Epoxy resin composition
DE3362453D1 (en)	1986-04-10	Heat-curable epoxy resin mixtures
IL72598A0 (en)	1984-11-30	Curable epoxy resin composition
DE3364191D1 (en)	1986-07-24	Epoxy resin composition
DE3175759D1 (en)	1987-02-05	Thermoplastic resin compositions
GB2128194B (en)	1986-06-04	Curable resin compositions
GB2115424B (en)	1986-01-02	Adhesive epoxy resin composition
GB8306014D0 (en)	1983-04-07	Epoxy resin derivatives