IL43087A - Metal-plastic laminates and their manufacture - Google Patents

Metal-plastic laminates and their manufacture

Info

Publication number
IL43087A
IL43087A IL43087A IL4308773A IL43087A IL 43087 A IL43087 A IL 43087A IL 43087 A IL43087 A IL 43087A IL 4308773 A IL4308773 A IL 4308773A IL 43087 A IL43087 A IL 43087A
Authority
IL
Israel
Prior art keywords
foil
silane
metal
sacrificial
article
Prior art date
Application number
IL43087A
Other versions
IL43087A0 (en
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of IL43087A0 publication Critical patent/IL43087A0/en
Publication of IL43087A publication Critical patent/IL43087A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Claims (1)

1. is claimed The method of producing an improved bond between a plastic substrate and a the steps of a of the plastic substrate and a sacrificial wherein the interface between said ano foil substrata is treated prior to lan to an organic silicon compound at bonding said substrate and sacrificial ogether under hea pressure to initial c stripping said f laminate thus and at least part of surface of said defined claim wherein said sacrificial metal foil prior to with said silicon by contacting said foil h a solution containing said The as in claim wherein said organic silicon is a The as defined in wherein said silane has general wherein is a lower substituted a of producing a plastic substrate having surface characteristics for the bonding thereto of a which the of the surface of an Kctal foil with silane having the is lower alky substituted and a metal foil te and and dissolving said treated said said is as said foil phosphoric The claim wherein said foil acid d said in solution of a silaiie selected the of propyltrietho y in said contains about per f said in said of foil in said solution is 30 t 5 at the foil is for at The in wherein said foil is alcohol solution of a consisting of and a silane The defined in claim the concentration of silane is from about ml to ml liter of A manufacture when prepared in accordance with the method of claim comprising a plastic substrate having improved properties for m talizing a sur said substrate of a molded resin member ha ing a topography characterized by a complex but uniform of microscopic cracks and An article of as in claim 14 wherein th sacrificial foil article of manu as in claim wherein the silane is a member of the group consisting of aminopropyltriethoxy silane and aminoethylaminopropyl trimethoxy An article of manufacture as defined in claim which further includes a metal film on at leas a of its An article of manu ctur as defined in claim 17 wherein said metal film is an electroless of a metal of the group consisting o copper and insufficientOCRQuality
IL43087A 1972-11-03 1973-08-27 Metal-plastic laminates and their manufacture IL43087A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30336972A 1972-11-03 1972-11-03

Publications (2)

Publication Number Publication Date
IL43087A0 IL43087A0 (en) 1973-11-28
IL43087A true IL43087A (en) 1976-11-30

Family

ID=23171773

Family Applications (1)

Application Number Title Priority Date Filing Date
IL43087A IL43087A (en) 1972-11-03 1973-08-27 Metal-plastic laminates and their manufacture

Country Status (9)

Country Link
JP (1) JPS532183B2 (en)
BE (1) BE806513A (en)
DE (1) DE2351672A1 (en)
ES (1) ES420191A1 (en)
FR (1) FR2205415B1 (en)
GB (1) GB1432218A (en)
IL (1) IL43087A (en)
IT (1) IT994788B (en)
NL (1) NL7314645A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL43636A (en) * 1973-03-23 1977-05-31 Macdermid Inc Plastic-metal laminate and a method for its manufacture
US4400100A (en) * 1981-03-02 1983-08-23 International Business Machines Corp. Four layered ribbon for electrothermal printing
DE4238242C2 (en) * 1992-09-17 2003-04-24 Rieger Franz Metallveredelung Process for pretreating light metals according to patent DE 4231052 C2

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article

Also Published As

Publication number Publication date
IT994788B (en) 1975-10-20
AU5972173A (en) 1975-03-06
ES420191A1 (en) 1976-07-01
JPS4977979A (en) 1974-07-26
NL7314645A (en) 1974-05-07
BE806513A (en) 1974-04-25
FR2205415A1 (en) 1974-05-31
GB1432218A (en) 1976-04-14
IL43087A0 (en) 1973-11-28
FR2205415B1 (en) 1977-05-27
DE2351672A1 (en) 1974-05-16
JPS532183B2 (en) 1978-01-26

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