IL263805A - Laminated microchannel heat exchangers - Google Patents
Laminated microchannel heat exchangersInfo
- Publication number
- IL263805A IL263805A IL263805A IL26380518A IL263805A IL 263805 A IL263805 A IL 263805A IL 263805 A IL263805 A IL 263805A IL 26380518 A IL26380518 A IL 26380518A IL 263805 A IL263805 A IL 263805A
- Authority
- IL
- Israel
- Prior art keywords
- heat exchangers
- microchannel heat
- laminated microchannel
- laminated
- exchangers
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
- F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662324327P | 2016-04-18 | 2016-04-18 | |
US201715402511A | 2017-01-10 | 2017-01-10 | |
PCT/US2017/028183 WO2017184635A1 (en) | 2016-04-18 | 2017-04-18 | Laminated microchannel heat exchangers |
Publications (1)
Publication Number | Publication Date |
---|---|
IL263805A true IL263805A (en) | 2019-03-31 |
Family
ID=60116305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL263805A IL263805A (en) | 2016-04-18 | 2018-12-18 | Laminated microchannel heat exchangers |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP3446059B1 (en) |
KR (1) | KR102494649B1 (en) |
CN (1) | CN109416224B (en) |
IL (1) | IL263805A (en) |
WO (1) | WO2017184635A1 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11732978B2 (en) | 2016-04-18 | 2023-08-22 | Qcip Holdings, Llc | Laminated microchannel heat exchangers |
CN113446883B (en) * | 2021-06-25 | 2022-10-25 | 西安交通大学 | Double-fluid loop staggered wave type micro-channel radiator based on elastic turbulence |
TWI827117B (en) * | 2022-06-29 | 2023-12-21 | 國立勤益科技大學 | Heat dissipator using three dimensional(3d) printed microfluidic heat sinks applied on flexible electronic device |
US20240186218A1 (en) * | 2022-10-21 | 2024-06-06 | Semiconductor Components Industries, Llc | Molded power modules with fluidic-channel cooled substrates |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2701554B1 (en) * | 1993-02-12 | 1995-05-12 | Transcal | Heat exchanger for electronic components and electro-technical equipment. |
CN1057424C (en) * | 1996-02-29 | 2000-10-11 | 中国科学院上海光学精密机械研究所 | micro-channel cooling heat sink |
FR2763204A1 (en) * | 1997-05-12 | 1998-11-13 | Ferraz | HEAT EXCHANGER FOR ELECTRONIC COMPONENTS AND ELECTROTECHNICAL APPARATUS |
US6446442B1 (en) * | 1999-10-07 | 2002-09-10 | Hydrocool Pty Limited | Heat exchanger for an electronic heat pump |
US20050189342A1 (en) * | 2004-02-23 | 2005-09-01 | Samer Kabbani | Miniature fluid-cooled heat sink with integral heater |
KR100594185B1 (en) * | 2004-12-02 | 2006-06-28 | 주식회사 이노윌 | Plate with three-dimensional microchannel and heat exchanger using the same |
JP2007127398A (en) * | 2005-10-05 | 2007-05-24 | Seiko Epson Corp | Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic apparatus |
CN1946278A (en) * | 2005-10-05 | 2007-04-11 | 精工爱普生株式会社 | Heat exchanger, method of manufacturing heat exchanger, liquid cooling system, light source device, projector, electronic device unit, and electronic equipment |
CN100584169C (en) * | 2006-04-21 | 2010-01-20 | 富准精密工业(深圳)有限公司 | Liquid-cooled heat radiator |
US8418751B2 (en) * | 2008-05-13 | 2013-04-16 | International Business Machines Corporation | Stacked and redundant chip coolers |
US9310135B1 (en) * | 2010-05-28 | 2016-04-12 | Cool Energy, Inc. | Configureable heat exchanger |
CN201830605U (en) * | 2010-10-12 | 2011-05-11 | 讯凯国际股份有限公司 | Liquid-cooling radiator and heat exchanger thereof |
CN201897410U (en) * | 2010-12-01 | 2011-07-13 | 杭州沈氏换热器有限公司 | Micro-channel heat exchanger |
CN102003899B (en) * | 2010-12-01 | 2012-05-02 | 杭州沈氏换热器有限公司 | Microchannel heat exchanger |
JP5944104B2 (en) * | 2011-03-15 | 2016-07-05 | 株式会社東芝 | Heat exchanger |
ES2725228T3 (en) * | 2012-11-07 | 2019-09-20 | Alfa Laval Corp Ab | Plate package and method of manufacturing a plate package |
-
2017
- 2017-04-18 WO PCT/US2017/028183 patent/WO2017184635A1/en active Application Filing
- 2017-04-18 CN CN201780037866.1A patent/CN109416224B/en active Active
- 2017-04-18 KR KR1020187033234A patent/KR102494649B1/en active IP Right Grant
- 2017-04-18 EP EP17786489.9A patent/EP3446059B1/en active Active
-
2018
- 2018-12-18 IL IL263805A patent/IL263805A/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP3446059A4 (en) | 2020-01-01 |
KR102494649B1 (en) | 2023-01-31 |
WO2017184635A1 (en) | 2017-10-26 |
EP3446059B1 (en) | 2024-06-26 |
KR20190016489A (en) | 2019-02-18 |
CN109416224B (en) | 2022-05-06 |
EP3446059A1 (en) | 2019-02-27 |
CN109416224A (en) | 2019-03-01 |
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