IL262491B - High speed communication jack - Google Patents

High speed communication jack

Info

Publication number
IL262491B
IL262491B IL262491A IL26249118A IL262491B IL 262491 B IL262491 B IL 262491B IL 262491 A IL262491 A IL 262491A IL 26249118 A IL26249118 A IL 26249118A IL 262491 B IL262491 B IL 262491B
Authority
IL
Israel
Prior art keywords
high speed
speed communication
communication jack
jack
speed
Prior art date
Application number
IL262491A
Other languages
Hebrew (he)
Other versions
IL262491A (en
Original Assignee
Sentinel Connector Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/146,019 external-priority patent/US9627816B2/en
Application filed by Sentinel Connector Systems Inc filed Critical Sentinel Connector Systems Inc
Publication of IL262491A publication Critical patent/IL262491A/en
Publication of IL262491B publication Critical patent/IL262491B/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581Shield structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461Means for preventing cross-talk
    • H01R13/6464Means for preventing cross-talk by adding capacitive elements
    • H01R13/6466Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473Impedance matching
    • H01R13/6474Impedance matching by variation of conductive properties, e.g. by dimension variations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6658Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/60Contacts spaced along planar side wall transverse to longitudinal axis of engagement
    • H01R24/62Sliding engagements with one side only, e.g. modular jack coupling devices
    • H01R24/64Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2107/00Four or more poles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05Flexible printed circuits [FPCs]
    • H05K2201/056Folded around rigid support or component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09336Signal conductors in same plane as power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303Pin-in-hole mounted pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IL262491A 2016-05-04 2018-10-21 High speed communication jack IL262491B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/146,019 US9627816B2 (en) 2012-02-13 2016-05-04 High speed grounded communication jack
PCT/US2017/030968 WO2017192800A1 (en) 2016-05-04 2017-05-04 High speed grounded communication jack

Publications (2)

Publication Number Publication Date
IL262491A IL262491A (en) 2018-12-31
IL262491B true IL262491B (en) 2022-04-01

Family

ID=60203392

Family Applications (1)

Application Number Title Priority Date Filing Date
IL262491A IL262491B (en) 2016-05-04 2018-10-21 High speed communication jack

Country Status (13)

Country Link
EP (1) EP3453081A4 (en)
JP (1) JP7339734B2 (en)
KR (1) KR102318866B1 (en)
CN (1) CN109478747B (en)
AU (1) AU2017260462B2 (en)
BR (1) BR112018071868A2 (en)
CA (1) CA3022689A1 (en)
IL (1) IL262491B (en)
MX (1) MX2018013320A (en)
PH (1) PH12018502285A1 (en)
RU (1) RU2713644C1 (en)
TW (1) TWI743118B (en)
WO (1) WO2017192800A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023028712A (en) * 2021-08-20 2023-03-03 日本航空電子工業株式会社 connector assembly

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69421798T2 (en) * 1994-03-26 2004-07-15 Molex Inc., Lisle Modular Jack connector
JP2003224408A (en) * 2002-01-30 2003-08-08 Kyocera Corp High-frequency wiring board
US6769937B1 (en) * 2003-05-13 2004-08-03 Molex Incorporated Modular jack assembly for jack plugs with varying numbers of wires
US7182649B2 (en) * 2003-12-22 2007-02-27 Panduit Corp. Inductive and capacitive coupling balancing electrical connector
JP4777984B2 (en) * 2004-07-13 2011-09-21 パンドウィット・コーポレーション Communication connector with flexible printed circuit board
US7601034B1 (en) * 2008-05-07 2009-10-13 Ortronics, Inc. Modular insert and jack including moveable reactance section
AU2009248414B2 (en) * 2008-05-15 2014-05-29 Tyco Electronics Services Gmbh Circuit board for electrical connector and electrical connector
US8167661B2 (en) * 2008-12-02 2012-05-01 Panduit Corp. Method and system for improving crosstalk attenuation within a plug/jack connection and between nearby plug/jack combinations
US8660424B2 (en) * 2010-08-26 2014-02-25 Cisco Technology, Inc. Scalable high speed gigabit active bundle link and tester
US8637987B2 (en) * 2011-08-09 2014-01-28 Micron Technology, Inc. Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
US9337592B2 (en) * 2012-02-13 2016-05-10 Sentinel Connector Systems, Inc. High speed communication jack
US8858266B2 (en) * 2012-02-13 2014-10-14 Sentinel Connector Systems, Inc. High speed communication jack
TWM445286U (en) * 2012-09-03 2013-01-11 Simula Technology Inc Signal connector
US8915756B2 (en) * 2013-01-23 2014-12-23 Commscope, Inc. Of North Carolina Communication connector having a printed circuit board with thin conductive layers
CN103390818B (en) * 2013-08-09 2015-08-12 浙江一舟电子科技股份有限公司 A kind of ultrahigh speed communication resistance to crosstalk interface circuit and comprise the socket of this interface circuit

Also Published As

Publication number Publication date
WO2017192800A1 (en) 2017-11-09
PH12018502285A1 (en) 2019-07-15
JP2019519068A (en) 2019-07-04
AU2017260462A1 (en) 2018-11-15
RU2713644C1 (en) 2020-02-05
CA3022689A1 (en) 2017-11-09
MX2018013320A (en) 2019-03-01
EP3453081A1 (en) 2019-03-13
KR20190000888A (en) 2019-01-03
TWI743118B (en) 2021-10-21
TW201813215A (en) 2018-04-01
IL262491A (en) 2018-12-31
JP7339734B2 (en) 2023-09-06
BR112018071868A2 (en) 2019-02-19
KR102318866B1 (en) 2021-10-28
CN109478747A (en) 2019-03-15
AU2017260462B2 (en) 2021-05-20
CN109478747B (en) 2021-03-05
EP3453081A4 (en) 2020-01-22

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