IL190599A0 - Microelectronic interconnect substrate and packaging techniques
- Google Patents
Microelectronic interconnect substrate and packaging techniques
Info
Publication number
IL190599A0
IL190599A0IL190599AIL19059908AIL190599A0IL 190599 A0IL190599 A0IL 190599A0IL 190599 AIL190599 AIL 190599AIL 19059908 AIL19059908 AIL 19059908AIL 190599 A0IL190599 A0IL 190599A0
Authority
IL
Israel
Prior art keywords
interconnect substrate
packaging techniques
microelectronic interconnect
microelectronic
packaging
Prior art date
Application number
IL190599A
Original Assignee
Micro Components Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/IL2006/001069external-prioritypatent/WO2007039892A2/en
Application filed by Micro Components LtdfiledCriticalMicro Components Ltd
Priority to IL190599ApriorityCriticalpatent/IL190599A0/en
Publication of IL190599A0publicationCriticalpatent/IL190599A0/en