IL189709A0 - A pipelined inspection system and a method for inspecting a diced wafer
- Google Patents
A pipelined inspection system and a method for inspecting a diced wafer
Info
Publication number
IL189709A0
IL189709A0IL189709AIL18970908AIL189709A0IL 189709 A0IL189709 A0IL 189709A0IL 189709 AIL189709 AIL 189709AIL 18970908 AIL18970908 AIL 18970908AIL 189709 A0IL189709 A0IL 189709A0
Authority
IL
Israel
Prior art keywords
pipelined
inspecting
inspection system
diced wafer
diced
Prior art date
Application number
IL189709A
Original Assignee
Camtek Ltd
Regensburger Menachem
Postolov Yuri
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/IL2006/000994external-prioritypatent/WO2007026349A2/en
Application filed by Camtek Ltd, Regensburger Menachem, Postolov YurifiledCriticalCamtek Ltd
Priority to IL189709ApriorityCriticalpatent/IL189709A0/en
Publication of IL189709A0publicationCriticalpatent/IL189709A0/en