IL157827A0 - Reinforced polishing pad with a shaped or flexible window structure - Google Patents
Reinforced polishing pad with a shaped or flexible window structureInfo
- Publication number
- IL157827A0 IL157827A0 IL15782702A IL15782702A IL157827A0 IL 157827 A0 IL157827 A0 IL 157827A0 IL 15782702 A IL15782702 A IL 15782702A IL 15782702 A IL15782702 A IL 15782702A IL 157827 A0 IL157827 A0 IL 157827A0
- Authority
- IL
- Israel
- Prior art keywords
- shaped
- polishing pad
- window structure
- flexible window
- reinforced
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/823,685 US6641470B1 (en) | 2001-03-30 | 2001-03-30 | Apparatus for accurate endpoint detection in supported polishing pads |
PCT/US2002/009675 WO2002078902A1 (fr) | 2001-03-30 | 2002-03-29 | Tampon a polir renforce a structure de fenetre en saillie ou flexible |
Publications (1)
Publication Number | Publication Date |
---|---|
IL157827A0 true IL157827A0 (en) | 2004-03-28 |
Family
ID=25239411
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL15782702A IL157827A0 (en) | 2001-03-30 | 2002-03-29 | Reinforced polishing pad with a shaped or flexible window structure |
IL157827A IL157827A (en) | 2001-03-30 | 2003-09-09 | Reinforced polishing pad with a shaped or flexible window structure |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IL157827A IL157827A (en) | 2001-03-30 | 2003-09-09 | Reinforced polishing pad with a shaped or flexible window structure |
Country Status (8)
Country | Link |
---|---|
US (1) | US6641470B1 (fr) |
EP (1) | EP1372908A1 (fr) |
JP (1) | JP2005506682A (fr) |
KR (1) | KR20030090697A (fr) |
CN (1) | CN1543387A (fr) |
IL (2) | IL157827A0 (fr) |
TW (1) | TW548734B (fr) |
WO (1) | WO2002078902A1 (fr) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
US7040957B2 (en) * | 2002-08-14 | 2006-05-09 | Novellus Systems Inc. | Platen and manifold for polishing workpieces |
US6806100B1 (en) * | 2002-12-24 | 2004-10-19 | Lam Research Corporation | Molded end point detection window for chemical mechanical planarization |
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
JP2005019669A (ja) * | 2003-06-26 | 2005-01-20 | Matsushita Electric Ind Co Ltd | 研磨パッド、研磨装置、及びウェハの研磨方法 |
US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
US7258602B2 (en) * | 2003-10-22 | 2007-08-21 | Iv Technologies Co., Ltd. | Polishing pad having grooved window therein and method of forming the same |
TWI385050B (zh) | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
CN101058169A (zh) * | 2006-02-15 | 2007-10-24 | 应用材料股份有限公司 | 抛光表面 |
WO2007104063A1 (fr) * | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Tampon a polir composite |
US7942724B2 (en) * | 2006-07-03 | 2011-05-17 | Applied Materials, Inc. | Polishing pad with window having multiple portions |
DE102008021569A1 (de) * | 2008-04-30 | 2009-11-05 | Advanced Micro Devices, Inc., Sunnyvale | System und Verfahren zur optischen Endpunkterkennung während des CMP unter Anwendung eines substratüberspannenenden Signals |
US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
US20110281510A1 (en) * | 2010-05-12 | 2011-11-17 | Applied Materials, Inc. | Pad Window Insert |
US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
CN101957486B (zh) * | 2010-08-25 | 2012-01-04 | 哈尔滨工业大学 | 耐高低温光学窗口支撑部件 |
US8257545B2 (en) | 2010-09-29 | 2012-09-04 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with light stable polymeric endpoint detection window and method of polishing therewith |
CN102554809B (zh) * | 2010-12-30 | 2015-02-04 | 圣戈班磨料磨具(上海)有限公司 | 具有检视窗口的砂轮 |
US20130217306A1 (en) * | 2012-02-16 | 2013-08-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | CMP Groove Depth and Conditioning Disk Monitoring |
US9108293B2 (en) * | 2012-07-30 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing layer pretexturing |
JP2014104521A (ja) * | 2012-11-26 | 2014-06-09 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
JP6105371B2 (ja) * | 2013-04-25 | 2017-03-29 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
CN103465154B (zh) * | 2013-09-07 | 2016-05-25 | 南通春光自控设备工程有限公司 | 软质研磨抛光盘 |
US10160089B2 (en) * | 2015-10-01 | 2018-12-25 | Ebara Corporation | Polishing apparatus |
US11133231B2 (en) * | 2017-11-20 | 2021-09-28 | Taiwan Semiconductor Manufacturing Company Ltd. | CMP apparatus and method for estimating film thickness |
CN110962001B (zh) * | 2019-11-27 | 2021-04-27 | 广东博智林机器人有限公司 | 打磨装置及打磨机器人 |
US20210299816A1 (en) * | 2020-03-25 | 2021-09-30 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Cmp polishing pad with protruding structures having engineered open void space |
WO2022202008A1 (fr) * | 2021-03-26 | 2022-09-29 | 富士紡ホールディングス株式会社 | Tampon de polissage |
CN113246015B (zh) * | 2021-05-25 | 2022-09-20 | 万华化学集团电子材料有限公司 | 具有终点检测窗的抛光垫及其应用 |
CN113478382B (zh) * | 2021-07-20 | 2022-11-04 | 湖北鼎汇微电子材料有限公司 | 检测窗口、化学机械抛光垫及抛光*** |
KR20240006369A (ko) * | 2022-07-06 | 2024-01-15 | 케이피엑스케미칼 주식회사 | 윈도우가 장착된 연마패드 및 이의 제조방법 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
JP3313505B2 (ja) * | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
US5964643A (en) * | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
DE19720623C1 (de) | 1997-05-16 | 1998-11-05 | Siemens Ag | Poliervorrichtung und Poliertuch |
US6146248A (en) | 1997-05-28 | 2000-11-14 | Lam Research Corporation | Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher |
US6068539A (en) * | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
US6186865B1 (en) * | 1998-10-29 | 2001-02-13 | Lam Research Corporation | Apparatus and method for performing end point detection on a linear planarization tool |
EP1176630B1 (fr) | 1999-03-31 | 2007-06-27 | Nikon Corporation | Corps de polissage, dispositif de polissage, procede de reglage du dispositif de polissage, dispositif de mesure de l'epaisseur du film poli ou du point terminal de polissage, procede de fabrication d'un dispositif a semi-conducteur |
JP2002001652A (ja) * | 2000-06-22 | 2002-01-08 | Nikon Corp | 研磨パッド及び研磨装置及び素子製造方法 |
-
2001
- 2001-03-30 US US09/823,685 patent/US6641470B1/en not_active Expired - Fee Related
-
2002
- 2002-03-29 CN CNA028074831A patent/CN1543387A/zh active Pending
- 2002-03-29 TW TW091106455A patent/TW548734B/zh not_active IP Right Cessation
- 2002-03-29 WO PCT/US2002/009675 patent/WO2002078902A1/fr not_active Application Discontinuation
- 2002-03-29 JP JP2002577151A patent/JP2005506682A/ja active Pending
- 2002-03-29 IL IL15782702A patent/IL157827A0/xx active IP Right Grant
- 2002-03-29 EP EP02733910A patent/EP1372908A1/fr not_active Withdrawn
- 2002-03-29 KR KR10-2003-7012784A patent/KR20030090697A/ko not_active Application Discontinuation
-
2003
- 2003-09-09 IL IL157827A patent/IL157827A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
IL157827A (en) | 2008-06-05 |
TW548734B (en) | 2003-08-21 |
KR20030090697A (ko) | 2003-11-28 |
US6641470B1 (en) | 2003-11-04 |
EP1372908A1 (fr) | 2004-01-02 |
CN1543387A (zh) | 2004-11-03 |
WO2002078902A1 (fr) | 2002-10-10 |
JP2005506682A (ja) | 2005-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FF | Patent granted | ||
FF | Patent granted |