IE840713L - Support for electronic components - Google Patents
Support for electronic componentsInfo
- Publication number
- IE840713L IE840713L IE840713A IE71384A IE840713L IE 840713 L IE840713 L IE 840713L IE 840713 A IE840713 A IE 840713A IE 71384 A IE71384 A IE 71384A IE 840713 L IE840713 L IE 840713L
- Authority
- IE
- Ireland
- Prior art keywords
- support
- electronic components
- pack
- metal materials
- corrugated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Credit Cards Or The Like (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Photoreceptors In Electrophotography (AREA)
Abstract
1. Light-weight support intende to received electronic components in leadless chipcarrier and formed from pack-rolled metal materials to adjust the coefficient of thermal expansion of the support to that the housings, characterized in that the support is composed of a corrugated metal sheet (12) fixed between two smooth sheets (10, 11), of which at least one receive the electronic components, and in that the two smooth sheets and the corrugated sheet are of pack-rolled metal materials.
[EP0124428A1]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8306544A FR2544917B1 (en) | 1983-04-21 | 1983-04-21 | LIGHT SUPPORT FOR ELECTRONIC COMPONENTS |
Publications (2)
Publication Number | Publication Date |
---|---|
IE840713L true IE840713L (en) | 1984-10-21 |
IE55621B1 IE55621B1 (en) | 1990-11-21 |
Family
ID=9288078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IE713/84A IE55621B1 (en) | 1983-04-21 | 1984-03-23 | Light-weight support for electronic components |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0124428B1 (en) |
JP (1) | JPS59201492A (en) |
CA (1) | CA1218739A (en) |
DE (1) | DE3474082D1 (en) |
FR (1) | FR2544917B1 (en) |
IE (1) | IE55621B1 (en) |
IL (1) | IL71393A (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61201397U (en) * | 1985-06-07 | 1986-12-17 | ||
JPH0423356Y2 (en) * | 1986-12-12 | 1992-05-29 | ||
US4839227A (en) * | 1987-03-12 | 1989-06-13 | Minnesota Mining And Manufacturing Company | Resilient electrically and thermally conductive flexible composite |
US4858072A (en) * | 1987-11-06 | 1989-08-15 | Ford Aerospace & Communications Corporation | Interconnection system for integrated circuit chips |
US4871623A (en) * | 1988-02-19 | 1989-10-03 | Minnesota Mining And Manufacturing Company | Sheet-member containing a plurality of elongated enclosed electrodeposited channels and method |
US5070606A (en) * | 1988-07-25 | 1991-12-10 | Minnesota Mining And Manufacturing Company | Method for producing a sheet member containing at least one enclosed channel |
US5249358A (en) * | 1992-04-28 | 1993-10-05 | Minnesota Mining And Manufacturing Company | Jet impingment plate and method of making |
US5317805A (en) * | 1992-04-28 | 1994-06-07 | Minnesota Mining And Manufacturing Company | Method of making microchanneled heat exchangers utilizing sacrificial cores |
US5375655A (en) * | 1993-03-31 | 1994-12-27 | Lee; Yong N. | Heat sink apparatus |
DE4334127C1 (en) * | 1993-10-07 | 1995-03-23 | Mtu Muenchen Gmbh | Metal core circuit board for insertion into the housing of an electronic device |
GB2324200A (en) * | 1997-04-08 | 1998-10-14 | Option Technologies Int Limite | Strengthening and venting of multi-layer printed circuit boards |
US6854181B2 (en) | 2001-05-30 | 2005-02-15 | Tyco Electronics Canada Ltd. | Folded-fin heat sink assembly and method of manufacturing same |
FR2861894B1 (en) * | 2003-10-31 | 2008-01-18 | Valeo Equip Electr Moteur | DEVICE FOR COOLING A POWER ELECTRONIC |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1481645A (en) * | 1966-05-31 | 1967-05-19 | Trane Co | heat exchanger |
FR2511193A1 (en) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Laminated support for cooling semiconductor - has three metal layers including one rigid layer to avoid bi-metallic bending with changing temp. |
-
1983
- 1983-04-21 FR FR8306544A patent/FR2544917B1/en not_active Expired
-
1984
- 1984-03-23 IE IE713/84A patent/IE55621B1/en not_active IP Right Cessation
- 1984-03-28 CA CA000450690A patent/CA1218739A/en not_active Expired
- 1984-03-29 IL IL71393A patent/IL71393A/en not_active IP Right Cessation
- 1984-04-12 JP JP59073834A patent/JPS59201492A/en active Pending
- 1984-04-20 EP EP84400811A patent/EP0124428B1/en not_active Expired
- 1984-04-20 DE DE8484400811T patent/DE3474082D1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
IE55621B1 (en) | 1990-11-21 |
DE3474082D1 (en) | 1988-10-20 |
CA1218739A (en) | 1987-03-03 |
IL71393A0 (en) | 1984-06-29 |
FR2544917B1 (en) | 1986-09-26 |
EP0124428B1 (en) | 1988-09-14 |
IL71393A (en) | 1988-08-31 |
EP0124428A1 (en) | 1984-11-07 |
JPS59201492A (en) | 1984-11-15 |
FR2544917A1 (en) | 1984-10-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Patent lapsed |