IE810447L - Selective chemical deposition and/or electrodeposition of¹metal coatings - Google Patents
Selective chemical deposition and/or electrodeposition of¹metal coatingsInfo
- Publication number
- IE810447L IE810447L IE810447A IE44781A IE810447L IE 810447 L IE810447 L IE 810447L IE 810447 A IE810447 A IE 810447A IE 44781 A IE44781 A IE 44781A IE 810447 L IE810447 L IE 810447L
- Authority
- IE
- Ireland
- Prior art keywords
- chemical deposition
- electrodeposition
- selective chemical
- of1metal
- coatings
- Prior art date
Links
- 238000005234 chemical deposition Methods 0.000 title abstract 3
- 238000000576 coating method Methods 0.000 title abstract 2
- 238000004070 electrodeposition Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000002161 passivation Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Printing Plates And Materials Therefor (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
In a process for the selective chemical deposition and/or electrodeposition of a metal coating onto an activated non-conducting surface, the part or parts of the surface that are to remain free of metal are anodically passivated. Passivation may be brought about by applying an anodic reverse potential to the surface(s) during chemical deposition. This process is suitable for the production of printed circuits having very fine conductors on a very small area and having optimum electrical characteristics.
[GB2070647A]
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19803008434 DE3008434A1 (en) | 1980-03-03 | 1980-03-03 | METHOD FOR SELECTIVE CHEMICAL AND / OR GALVANIC DEPOSITION OF METAL COATINGS, ESPECIALLY FOR THE PRODUCTION OF PRINTED CIRCUITS |
Publications (2)
Publication Number | Publication Date |
---|---|
IE810447L true IE810447L (en) | 1981-09-03 |
IE50821B1 IE50821B1 (en) | 1986-07-23 |
Family
ID=6096345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IE447/81A IE50821B1 (en) | 1980-03-03 | 1981-03-03 | Process for the selective chemical deposition and/or electrodeposition of metal coatings,especially for the production of printed circuits |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS56135996A (en) |
DE (1) | DE3008434A1 (en) |
FR (1) | FR2477360B1 (en) |
GB (1) | GB2070647B (en) |
IE (1) | IE50821B1 (en) |
IT (1) | IT1135186B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59186390A (en) * | 1983-04-07 | 1984-10-23 | 株式会社サト−セン | Method of producing printed circuit board |
EP0150733A3 (en) * | 1984-01-26 | 1987-01-14 | LeaRonal, Inc. | Process for printed circuit board maufacture |
JPS60176293A (en) * | 1984-02-22 | 1985-09-10 | 新神戸電機株式会社 | Method of producing printed circuit board |
DE3840199C2 (en) * | 1988-11-29 | 1994-12-01 | Heraeus Noblelight Gmbh | Process for structuring metal layers that are catalytically active in electroless metallization by means of UV radiation |
DE4008482A1 (en) * | 1990-03-16 | 1991-09-19 | Asea Brown Boveri | GALVANIZATION PROCEDURE |
JPH0555069U (en) * | 1991-12-25 | 1993-07-23 | 松下電器産業株式会社 | Rotational speed detection device |
US5354583A (en) * | 1992-11-09 | 1994-10-11 | Martin Marietta Energy Systems, Inc. | Apparatus and method for selective area deposition of thin films on electrically biased substrates |
TW369672B (en) | 1997-07-28 | 1999-09-11 | Hitachi Ltd | Wiring board and its manufacturing process, and electrolysis-free electroplating method |
JP5850353B2 (en) * | 2011-08-18 | 2016-02-03 | アップル インコーポレイテッド | Anodizing and plating surface treatment |
US9683305B2 (en) | 2011-12-20 | 2017-06-20 | Apple Inc. | Metal surface and process for treating a metal surface |
US10300658B2 (en) * | 2012-05-03 | 2019-05-28 | Apple Inc. | Crack resistant plastic enclosure structures |
DE102019220458A1 (en) * | 2019-12-20 | 2021-06-24 | Vitesco Technologies Germany Gmbh | Method of manufacturing a printed circuit board and printed circuit board |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB829263A (en) * | 1957-02-08 | 1960-03-02 | Sperry Rand Corp | Method of making printed circuits |
DE1277642B (en) * | 1964-01-14 | 1968-09-12 | Bayer Ag | Process for the protection of metallic surfaces against metal deposition in chemical metallization baths |
US3485665A (en) * | 1967-08-22 | 1969-12-23 | Western Electric Co | Selective chemical deposition of thin-film interconnections and contacts |
DE2920940A1 (en) * | 1979-05-21 | 1980-12-04 | Schering Ag | METHOD FOR PRODUCING PRINTED CIRCUITS |
-
1980
- 1980-03-03 DE DE19803008434 patent/DE3008434A1/en active Granted
-
1981
- 1981-01-27 IT IT19345/81A patent/IT1135186B/en active
- 1981-03-02 GB GB8106533A patent/GB2070647B/en not_active Expired
- 1981-03-02 FR FR8104102A patent/FR2477360B1/en not_active Expired
- 1981-03-03 IE IE447/81A patent/IE50821B1/en unknown
- 1981-03-03 JP JP2945881A patent/JPS56135996A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS56135996A (en) | 1981-10-23 |
JPS6257120B2 (en) | 1987-11-30 |
IT1135186B (en) | 1986-08-20 |
DE3008434C2 (en) | 1988-02-25 |
IE50821B1 (en) | 1986-07-23 |
FR2477360B1 (en) | 1985-06-28 |
IT8119345A0 (en) | 1981-01-27 |
GB2070647A (en) | 1981-09-09 |
GB2070647B (en) | 1984-02-22 |
FR2477360A1 (en) | 1981-09-04 |
DE3008434A1 (en) | 1981-09-17 |
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