ID26034A - Helai serat kaca yang dilapisi dengan pelumas anorganik - Google Patents

Helai serat kaca yang dilapisi dengan pelumas anorganik

Info

Publication number
ID26034A
ID26034A IDW20001973A ID20001973A ID26034A ID 26034 A ID26034 A ID 26034A ID W20001973 A IDW20001973 A ID W20001973A ID 20001973 A ID20001973 A ID 20001973A ID 26034 A ID26034 A ID 26034A
Authority
ID
Indonesia
Prior art keywords
glass fiber
anorganic
lubricants
fiber coated
coated
Prior art date
Application number
IDW20001973A
Other languages
English (en)
Inventor
Bruce E Novich
Walter J Robertson
Vedagiri Velpari
Xiang Wu
Original Assignee
Ppg Ind Ohio Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ppg Ind Ohio Inc filed Critical Ppg Ind Ohio Inc
Publication of ID26034A publication Critical patent/ID26034A/id

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/32—Macromolecular compounds or prepolymers obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/24—Coatings containing organic materials
    • C03C25/26—Macromolecular compounds or prepolymers
    • C03C25/28—Macromolecular compounds or prepolymers obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
    • C03C25/10—Coating
    • C03C25/42—Coatings containing inorganic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
  • Surface Treatment Of Glass Fibres Or Filaments (AREA)
  • Reinforced Plastic Materials (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Lubricants (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Glass Compositions (AREA)
IDW20001973A 1998-03-03 1999-02-25 Helai serat kaca yang dilapisi dengan pelumas anorganik ID26034A (id)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US3452598A 1998-03-03 1998-03-03
US17078098A 1998-10-13 1998-10-13

Publications (1)

Publication Number Publication Date
ID26034A true ID26034A (id) 2000-11-16

Family

ID=26711081

Family Applications (1)

Application Number Title Priority Date Filing Date
IDW20001973A ID26034A (id) 1998-03-03 1999-02-25 Helai serat kaca yang dilapisi dengan pelumas anorganik

Country Status (18)

Country Link
EP (1) EP1060145B1 (id)
JP (2) JP2002505389A (id)
KR (1) KR100398177B1 (id)
CN (1) CN1295542A (id)
AT (1) ATE218121T1 (id)
AU (1) AU2789099A (id)
BR (1) BR9908621A (id)
CA (1) CA2321722A1 (id)
DE (1) DE69901602T2 (id)
HK (1) HK1032384A1 (id)
HU (1) HUP0101142A3 (id)
ID (1) ID26034A (id)
IL (1) IL137975A0 (id)
MY (1) MY133478A (id)
NO (1) NO20004333L (id)
PL (1) PL342752A1 (id)
TR (1) TR200003047T2 (id)
WO (1) WO1999044960A1 (id)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8105690B2 (en) * 1998-03-03 2012-01-31 Ppg Industries Ohio, Inc Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding
US20020051882A1 (en) * 2000-02-18 2002-05-02 Lawton Ernest L. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
CA2400787A1 (en) * 2000-02-22 2001-08-30 Ppg Industries Ohio, Inc. Electronic supports and methods and apparatus for forming apertures in electronic supports
US20020123285A1 (en) * 2000-02-22 2002-09-05 Dana David E. Electronic supports and methods and apparatus for forming apertures in electronic supports
US20020085888A1 (en) * 2000-02-22 2002-07-04 Vedagiri Velpari Electronic supports and methods and apparatus for forming apertures in electronic supports
FR2826359B1 (fr) * 2001-06-21 2004-05-07 Saint Gobain Vetrotex Fils de verre ensimes, composition d'ensimage et composites comprenant lesdits fils
US7354641B2 (en) * 2004-10-12 2008-04-08 Ppg Industries Ohio, Inc. Resin compatible yarn binder and uses thereof
FR2877001B1 (fr) * 2004-10-21 2006-12-15 Saint Gobain Vetrotex Fils de verre ensimes electro-conducteurs.
CN102173026B (zh) * 2010-12-16 2015-01-14 施汉林 一种新型导热复合材料与led壳体的复合注塑工艺
JP5772194B2 (ja) * 2011-05-02 2015-09-02 日産自動車株式会社 熱的異方性を備えた熱伝導部材及びそれを用いた磁気冷凍機
CN102618014B (zh) * 2012-04-06 2014-01-01 沈阳航空航天大学 含酚酞侧基的聚芳醚酮(砜)树脂基混杂多尺度复合材料的制备方法
AU2014287532A1 (en) 2013-07-10 2016-02-04 Boron Nitride Power, Llc Functionalized boron nitride materials as electroactive species in electrochemical energy storage devices
JP5512030B1 (ja) * 2013-10-15 2014-06-04 ユニチカ株式会社 水系サイズ剤、ならびにそれを用いたガラス繊維およびガラス繊維クロス
KR101976255B1 (ko) * 2017-03-06 2019-05-07 한양대학교 산학협력단 보호 필름 및 그 제조 방법
MX2019010952A (es) 2017-03-13 2019-12-18 Basf Se Fibra recubierta y metodo.
CN113880316B (zh) * 2021-11-17 2022-05-27 青岛延晖环保科技有限公司 一种利用生物膜淡化海水的方法
CN115010383B (zh) * 2022-06-30 2023-12-15 天津斯坦利新型材料有限公司 具有至少两层涂覆层的玻璃纤维、制备方法及其应用
CN115012213B (zh) * 2022-07-08 2024-05-07 陈宗良 芳纶上浆液及制备方法与芳纶复合材料及制备方法
CN115449957B (zh) * 2022-10-01 2024-05-28 佛山市顺德区丽轩纺织实业有限公司 一种家用纺织面料及其制备方法
CN115609791B (zh) * 2022-12-20 2023-05-02 中国电子科技集团公司第四十六研究所 一种高填料量胶液多次浸渍玻纤布均匀性控制方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3312569A (en) * 1965-05-07 1967-04-04 Owens Corning Fiberglass Corp Compatible fibrous glass reinforcements of superior bonding and wetting characteristics
US5217778A (en) * 1982-10-21 1993-06-08 Raymark Industries, Inc. Composite fiber friction facing
JP2545957B2 (ja) * 1988-12-15 1996-10-23 日東紡績株式会社 プリント配線基板及び同基板用織物
JP3520604B2 (ja) * 1995-05-23 2004-04-19 日立化成工業株式会社 コンポジット積層板
US5773146A (en) * 1995-06-05 1998-06-30 Ppg Industries, Inc. Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers
JP3151397B2 (ja) * 1995-10-26 2001-04-03 松下電工株式会社 プリプレグ及び金属箔張り積層板

Also Published As

Publication number Publication date
CN1295542A (zh) 2001-05-16
KR20010041479A (ko) 2001-05-25
EP1060145B1 (en) 2002-05-29
DE69901602T2 (de) 2003-01-02
WO1999044960A1 (en) 1999-09-10
BR9908621A (pt) 2000-10-31
TR200003047T2 (tr) 2001-01-22
HUP0101142A3 (en) 2002-06-28
KR100398177B1 (ko) 2003-10-10
MY133478A (en) 2007-11-30
EP1060145A1 (en) 2000-12-20
DE69901602D1 (de) 2002-07-04
HUP0101142A2 (hu) 2001-08-28
AU2789099A (en) 1999-09-20
CA2321722A1 (en) 1999-09-10
NO20004333D0 (no) 2000-08-31
JP2002505389A (ja) 2002-02-19
PL342752A1 (en) 2001-07-02
IL137975A0 (en) 2001-10-31
ATE218121T1 (de) 2002-06-15
NO20004333L (no) 2000-11-01
JP2003268672A (ja) 2003-09-25
HK1032384A1 (en) 2001-07-20

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