HUP9901571A1 - Eljárás alkatrészek elektromágneses sugárzást leárnyékoló fémréteggel való bevonására - Google Patents
Eljárás alkatrészek elektromágneses sugárzást leárnyékoló fémréteggel való bevonásáraInfo
- Publication number
- HUP9901571A1 HUP9901571A1 HU9901571A HUP9901571A HUP9901571A1 HU P9901571 A1 HUP9901571 A1 HU P9901571A1 HU 9901571 A HU9901571 A HU 9901571A HU P9901571 A HUP9901571 A HU P9901571A HU P9901571 A1 HUP9901571 A1 HU P9901571A1
- Authority
- HU
- Hungary
- Prior art keywords
- electromagnetic radiation
- producing
- detail
- against electromagnetic
- metallic layer
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 3
- 230000005670 electromagnetic radiation Effects 0.000 title abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0092—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive pigments, e.g. paint, ink, tampon printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Printing Methods (AREA)
- Decoration By Transfer Pictures (AREA)
Abstract
A találmány eljárás alkatrészek bevőnására, ami véd az elektrőmágnesessűgárzástól. A bevőnat (3) egy meghatárőzőtt terjedelemben van felviveközvetlenül vagy közvetve az alkatrészre egy ismert nyőmtatási eljárássegítségével. ŕ
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9600967A SE9600967D0 (sv) | 1995-12-07 | 1996-03-13 | Sätt att åstadkomma ett metalliskt skikt på en detaljs yta för avskärmning mot elektromagnetisk strålning |
Publications (2)
Publication Number | Publication Date |
---|---|
HUP9901571A1 true HUP9901571A1 (hu) | 1999-08-30 |
HUP9901571A3 HUP9901571A3 (en) | 1999-11-29 |
Family
ID=20401776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HU9901571A HUP9901571A3 (en) | 1996-03-13 | 1997-03-04 | Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
Country Status (13)
Country | Link |
---|---|
US (1) | US6200630B1 (hu) |
EP (1) | EP0886996B1 (hu) |
JP (1) | JP4166828B2 (hu) |
CN (1) | CN1108736C (hu) |
AU (1) | AU710484B2 (hu) |
CA (1) | CA2248127A1 (hu) |
DE (1) | DE69733342D1 (hu) |
HU (1) | HUP9901571A3 (hu) |
NO (1) | NO984135D0 (hu) |
NZ (1) | NZ331662A (hu) |
PL (1) | PL182631B1 (hu) |
RU (1) | RU2194376C2 (hu) |
WO (1) | WO1997034459A2 (hu) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU710484B2 (en) | 1996-03-13 | 1999-09-23 | Telefonaktiebolaget Lm Ericsson (Publ) | Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
EP0887834A3 (en) * | 1997-06-24 | 1999-03-24 | Bridgestone Corporation | Electromagnetic wave shielding and light transmitting plate |
SE9703410D0 (sv) * | 1997-09-22 | 1997-09-22 | Ericsson Telefon Ab L M | Sätt att överföra en bild på oregelbundna ytor |
SE518428C2 (sv) | 1998-04-27 | 2002-10-08 | Ericsson Telefon Ab L M | Anpassat ledande skikt |
SE518429C2 (sv) | 1998-12-21 | 2002-10-08 | Ericsson Telefon Ab L M | Tampodyna samt förfarande vid tampotryckning |
SE521347C2 (sv) * | 1999-01-22 | 2003-10-21 | Ericsson Telefon Ab L M | Förfarande vid påläggning av en bild på en kliché samt en kliché |
WO2001065903A2 (en) * | 2000-02-28 | 2001-09-07 | Amesbury Group, Inc. | Methods and apparatus for emi shielding |
US6652777B2 (en) | 2000-02-28 | 2003-11-25 | Amesbury Group, Inc. | Method and apparatus for EMI shielding |
SE517303C2 (sv) * | 2000-03-14 | 2002-05-21 | Ericsson Telefon Ab L M | Förfarande för att trycka en elektriskt ledande beläggning på en elektronisk enhet |
SE0001025D0 (sv) * | 2000-03-21 | 2000-03-21 | Lars Eriksson | Metod att tampongtrycka på en detalj |
NO20014376L (no) * | 2001-09-07 | 2003-03-10 | Pe Dev As | Fremgangsmåte og anordning for skjerming mot elektromagnetiske felter |
CA2614335A1 (en) * | 2005-07-06 | 2007-01-11 | First Data Corporation | Secure rfid packaging |
DE102005034166A1 (de) * | 2005-07-21 | 2007-02-01 | Osram Opto Semiconductors Gmbh | Gehäuse für ein elektromagnetische Strahlung emittierendes optoelektronisches Bauelement, elektromagnetische Strahlung emittierendes Bauelement und Verfahren zum Herstellen eines Gehäuses oder eines Bauelements |
US7743702B2 (en) * | 2006-07-18 | 2010-06-29 | Max Levy Autograph, Inc. | Method for applying electronic circuits to curved surfaces |
CN101547576A (zh) * | 2008-03-25 | 2009-09-30 | 深圳富泰宏精密工业有限公司 | 壳体的制造方法 |
TWI406715B (zh) * | 2008-04-18 | 2013-09-01 | Fih Hong Kong Ltd | 殼體之製造方法 |
EP4037758A1 (en) | 2019-10-01 | 2022-08-10 | Uab "Technano" | Method for protecting biological objects from the negative influence of technogenic electromagnetic radiation |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3594490A (en) | 1970-07-17 | 1971-07-20 | Ibm | Electronic grounding system |
US4670347A (en) * | 1986-03-12 | 1987-06-02 | Topflight Corp. | RFI/EMI shielding apparatus |
US5047260A (en) * | 1987-02-06 | 1991-09-10 | Key-Tech, Inc. | Method for producing a shielded plastic enclosure to house electronic equipment |
US4890199A (en) | 1988-11-04 | 1989-12-26 | Motorola, Inc. | Miniature shield with opposing cantilever spring fingers |
US5198154A (en) | 1990-03-19 | 1993-03-30 | Asahi Kasei Kogyo Kabushiki Kaisha | High temperature baking paste |
US5543333A (en) * | 1993-09-30 | 1996-08-06 | Siemens Solar Gmbh | Method for manufacturing a solar cell having combined metallization |
AU710484B2 (en) | 1996-03-13 | 1999-09-23 | Telefonaktiebolaget Lm Ericsson (Publ) | Method of producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
-
1997
- 1997-03-04 AU AU20492/97A patent/AU710484B2/en not_active Ceased
- 1997-03-04 CA CA002248127A patent/CA2248127A1/en not_active Abandoned
- 1997-03-04 HU HU9901571A patent/HUP9901571A3/hu unknown
- 1997-03-04 EP EP97908623A patent/EP0886996B1/en not_active Expired - Lifetime
- 1997-03-04 CN CN97194487.3A patent/CN1108736C/zh not_active Expired - Fee Related
- 1997-03-04 WO PCT/SE1997/000372 patent/WO1997034459A2/en active IP Right Grant
- 1997-03-04 US US09/142,798 patent/US6200630B1/en not_active Expired - Lifetime
- 1997-03-04 RU RU98118570/09A patent/RU2194376C2/ru not_active IP Right Cessation
- 1997-03-04 DE DE69733342T patent/DE69733342D1/de not_active Expired - Lifetime
- 1997-03-04 NZ NZ331662A patent/NZ331662A/xx not_active IP Right Cessation
- 1997-03-04 JP JP53250997A patent/JP4166828B2/ja not_active Expired - Lifetime
- 1997-03-04 PL PL97328805A patent/PL182631B1/pl unknown
-
1998
- 1998-09-08 NO NO984135A patent/NO984135D0/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
RU2194376C2 (ru) | 2002-12-10 |
CN1108736C (zh) | 2003-05-14 |
NO984135L (no) | 1998-09-08 |
US6200630B1 (en) | 2001-03-13 |
PL182631B1 (pl) | 2002-02-28 |
CA2248127A1 (en) | 1997-09-18 |
JP2000510650A (ja) | 2000-08-15 |
NZ331662A (en) | 2000-04-28 |
EP0886996B1 (en) | 2005-05-25 |
JP4166828B2 (ja) | 2008-10-15 |
NO984135D0 (no) | 1998-09-08 |
PL328805A1 (en) | 1999-02-15 |
WO1997034459A3 (en) | 1997-12-04 |
CN1218605A (zh) | 1999-06-02 |
AU710484B2 (en) | 1999-09-23 |
HUP9901571A3 (en) | 1999-11-29 |
DE69733342D1 (de) | 2005-06-30 |
WO1997034459A2 (en) | 1997-09-18 |
EP0886996A2 (en) | 1998-12-30 |
AU2049297A (en) | 1997-10-01 |
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