HUE055378T2 - Folyasztószer - Google Patents
FolyasztószerInfo
- Publication number
- HUE055378T2 HUE055378T2 HUE18173816A HUE18173816A HUE055378T2 HU E055378 T2 HUE055378 T2 HU E055378T2 HU E18173816 A HUE18173816 A HU E18173816A HU E18173816 A HUE18173816 A HU E18173816A HU E055378 T2 HUE055378 T2 HU E055378T2
- Authority
- HU
- Hungary
- Prior art keywords
- flux
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3616—Halogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017103254A JP6274344B1 (ja) | 2017-05-25 | 2017-05-25 | フラックス |
Publications (1)
Publication Number | Publication Date |
---|---|
HUE055378T2 true HUE055378T2 (hu) | 2021-11-29 |
Family
ID=61158342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HUE18173816A HUE055378T2 (hu) | 2017-05-25 | 2018-05-23 | Folyasztószer |
Country Status (8)
Country | Link |
---|---|
US (1) | US10610979B2 (hu) |
EP (1) | EP3406394B1 (hu) |
JP (1) | JP6274344B1 (hu) |
KR (1) | KR101905365B1 (hu) |
CN (1) | CN108941978B (hu) |
HU (1) | HUE055378T2 (hu) |
PT (1) | PT3406394T (hu) |
TW (1) | TWI644752B (hu) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6617793B2 (ja) * | 2018-06-01 | 2019-12-11 | 千住金属工業株式会社 | ソルダペースト用フラックス及びソルダペースト |
CN111586990B (zh) * | 2020-05-07 | 2023-03-31 | 中国航空无线电电子研究所 | 印制电路板陶瓷柱栅阵列器件防护处理方法 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS518579A (en) | 1974-07-10 | 1976-01-23 | Matsushita Electric Works Ltd | Kairoshadankino hikihazushisochi |
US4448847A (en) * | 1982-05-28 | 1984-05-15 | Shell Oil Company | Process for improving steel-epoxy adhesion |
US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
US4980086A (en) * | 1985-10-16 | 1990-12-25 | Toagosei Chemical Industry, Co., Ltd. | Curable composition |
US4855001A (en) * | 1987-02-10 | 1989-08-08 | Lord Corporation | Structural adhesive formulations and bonding method employing same |
US5128746A (en) * | 1990-09-27 | 1992-07-07 | Motorola, Inc. | Adhesive and encapsulant material with fluxing properties |
JP3369196B2 (ja) | 1991-08-14 | 2003-01-20 | 株式会社ニホンゲンマ | フラックス組成物 |
JPH06269980A (ja) * | 1993-03-23 | 1994-09-27 | Tdk Corp | 接合用導電ペースト |
JPH07169646A (ja) * | 1993-12-13 | 1995-07-04 | Murata Mfg Co Ltd | 電子部品の製造方法 |
JPH0890283A (ja) * | 1994-09-21 | 1996-04-09 | Murata Mfg Co Ltd | はんだ付け用フラックス |
US6159304A (en) * | 1997-07-03 | 2000-12-12 | Matsushita Electric Industrial Co., Ltd. | Solder paste |
US6059894A (en) * | 1998-04-08 | 2000-05-09 | Hewlett-Packard Company | High temperature flip chip joining flux that obviates the cleaning process |
US6752309B1 (en) * | 1999-07-22 | 2004-06-22 | Oatey Co. | Water soluble fluxes and methods of using the same |
AU2403601A (en) | 1999-12-27 | 2001-07-09 | Sumitomo Bakelite Company Limited | Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
US6524398B2 (en) | 2000-04-13 | 2003-02-25 | Fry's Metals, Inc. | Low-residue, low-solder-ball flux |
KR101163427B1 (ko) * | 2006-12-12 | 2012-07-13 | 센주긴조쿠고교 가부시키가이샤 | 납프리 땜납용 플럭스와 납땜 방법 |
US20080156852A1 (en) * | 2006-12-29 | 2008-07-03 | Prakash Anna M | Solder flux composition and process of using same |
CN101073862A (zh) * | 2007-06-08 | 2007-11-21 | 北京工业大学 | 无铅焊膏用低松香型无卤素免清洗助焊剂 |
CN101204762B (zh) * | 2007-12-25 | 2011-02-16 | 昆山成利焊锡制造有限公司 | 铝及铝合金用软钎焊金属置换型无铅焊助焊剂 |
CN103286477B (zh) * | 2013-05-22 | 2015-09-30 | 中南大学 | 一种无铅焊料用助焊剂及其制备方法 |
CN104416299B (zh) * | 2013-09-06 | 2017-01-04 | 苏州优诺电子材料科技有限公司 | 一种水清洗型焊锡膏助焊剂 |
CN104858571B (zh) * | 2015-06-10 | 2017-03-01 | 深圳市同方电子新材料有限公司 | 一种锡铋系无铅锡膏用无卤素助焊剂及其制备方法 |
WO2017141404A1 (ja) | 2016-02-18 | 2017-08-24 | 千住金属工業株式会社 | フラックス |
-
2017
- 2017-05-25 JP JP2017103254A patent/JP6274344B1/ja active Active
-
2018
- 2018-05-18 CN CN201810480926.3A patent/CN108941978B/zh active Active
- 2018-05-21 TW TW107117199A patent/TWI644752B/zh active
- 2018-05-21 KR KR1020180057612A patent/KR101905365B1/ko active IP Right Grant
- 2018-05-23 PT PT181738162T patent/PT3406394T/pt unknown
- 2018-05-23 EP EP18173816.2A patent/EP3406394B1/en active Active
- 2018-05-23 HU HUE18173816A patent/HUE055378T2/hu unknown
- 2018-05-24 US US15/988,257 patent/US10610979B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
PT3406394T (pt) | 2021-08-16 |
CN108941978A (zh) | 2018-12-07 |
KR101905365B1 (ko) | 2018-10-05 |
US10610979B2 (en) | 2020-04-07 |
CN108941978B (zh) | 2019-12-27 |
JP2018196899A (ja) | 2018-12-13 |
JP6274344B1 (ja) | 2018-02-07 |
EP3406394A1 (en) | 2018-11-28 |
TWI644752B (zh) | 2018-12-21 |
EP3406394B1 (en) | 2021-06-30 |
US20180339375A1 (en) | 2018-11-29 |
TW201900320A (zh) | 2019-01-01 |
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