HK22696A - Aqueous photosensitive resin composition preparation thereof and preparation of printed circuit board using the composition - Google Patents
Aqueous photosensitive resin composition preparation thereof and preparation of printed circuit board using the compositionInfo
- Publication number
- HK22696A HK22696A HK22696A HK22696A HK22696A HK 22696 A HK22696 A HK 22696A HK 22696 A HK22696 A HK 22696A HK 22696 A HK22696 A HK 22696A HK 22696 A HK22696 A HK 22696A
- Authority
- HK
- Hong Kong
- Prior art keywords
- preparation
- composition
- circuit board
- printed circuit
- photosensitive resin
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Graft Or Block Polymers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3172247A JP3040202B2 (ja) | 1991-07-12 | 1991-07-12 | 水系感光性樹脂組成物及びそれを用いたプリント回路板の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK22696A true HK22696A (en) | 1996-02-16 |
Family
ID=15938352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK22696A HK22696A (en) | 1991-07-12 | 1996-02-08 | Aqueous photosensitive resin composition preparation thereof and preparation of printed circuit board using the composition |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP3040202B2 (xx) |
CA (1) | CA2072702A1 (xx) |
GB (1) | GB2257711B (xx) |
HK (1) | HK22696A (xx) |
TW (1) | TW236071B (xx) |
ZA (1) | ZA924998B (xx) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06258832A (ja) * | 1992-11-17 | 1994-09-16 | W R Grace & Co | 感光性樹脂組成物 |
US5445919A (en) * | 1993-06-14 | 1995-08-29 | Fuji Photo Film Co., Ltd. | Photopolymerizable composition |
AU661438B1 (en) * | 1994-01-25 | 1995-07-20 | Morton International, Inc. | Waterborne photoresists having polysiloxanes |
US5364737A (en) * | 1994-01-25 | 1994-11-15 | Morton International, Inc. | Waterbone photoresists having associate thickeners |
AU660881B1 (en) * | 1994-01-25 | 1995-07-06 | Morton International, Inc. | Waterborne photoresists having binders neutralized with amino acrylates |
AU660882B1 (en) * | 1994-01-25 | 1995-07-06 | Morton International, Inc. | Waterborne photoresists having non-ionic fluorocarbon surfactants |
JPH08289942A (ja) * | 1995-04-25 | 1996-11-05 | Yukio Tsunoda | ゴルフクラブ |
US5512607A (en) * | 1995-06-06 | 1996-04-30 | W. R. Grace & Co.-Conn. | Unsaturated epoxy ester with quaternary ammonium and phosphate groups |
WO1996041240A1 (en) * | 1995-06-07 | 1996-12-19 | W.R. Grace & Co.-Conn. | Water photoresist emulsions and methods of preparation thereof |
JPH0915857A (ja) * | 1995-06-29 | 1997-01-17 | Hitachi Chem Co Ltd | 着色画像形成材料、これを用いた感光液、感光性エレメント及びカラーフィルタの製造法 |
US20040265730A1 (en) * | 2001-12-03 | 2004-12-30 | Hiroshi Takahashi | Photosensitive composition and production processes for photosensitive film and printed wiring board |
DE60322278D1 (de) | 2002-05-06 | 2008-08-28 | Sun Chemical Corp | Einphasige energiehärtbare Zusammensetzungen auf Wasserbasis |
US7226959B2 (en) | 2003-11-06 | 2007-06-05 | Sun Chemical Corporation | Water soluble energy curable stereo-crosslinkable ionomer compositions |
JP5624288B2 (ja) * | 2009-06-30 | 2014-11-12 | 互応化学工業株式会社 | スルーホール付きプリント配線板の製造方法 |
DE112011101165T5 (de) | 2010-03-29 | 2013-03-28 | Mitsubishi Paper Mills Limited | Fotoempfindliche Zusammensetzung und fotoempfindliches lithographisches Druckplattenmaterial |
JP7181775B2 (ja) * | 2017-12-12 | 2022-12-01 | 三洋化成工業株式会社 | 水性(共)重合体組成物 |
CN115197381B (zh) * | 2022-09-16 | 2022-11-25 | 广州鹿山新材料股份有限公司 | 一种不饱和sma树脂改性聚丙烯及其制备方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD250593A1 (de) * | 1984-04-03 | 1987-10-14 | Wolfen Filmfab Veb | Fotopolymerisierbares material |
PT85756A (pt) * | 1986-09-22 | 1988-10-14 | Napp Systems Inc | Processo para a preparacao de chapas fotossensiveis e revelaveis com agua |
EP0287019A3 (en) * | 1987-04-16 | 1990-07-11 | W.R. Grace & Co.-Conn. | Aqueous developable, radiation curable composition |
EP0295944A3 (en) * | 1987-06-18 | 1989-09-06 | Napp Systems (Usa) Inc. | Photosensitive resin composition and printing plate prepared therefrom |
US5403698A (en) * | 1990-10-16 | 1995-04-04 | Hitachi Chemical Company, Ltd. | Negative type photosensitive electrodepositing resin composition |
-
1991
- 1991-07-12 JP JP3172247A patent/JP3040202B2/ja not_active Expired - Lifetime
-
1992
- 1992-06-29 CA CA002072702A patent/CA2072702A1/en not_active Abandoned
- 1992-07-06 ZA ZA924998A patent/ZA924998B/xx unknown
- 1992-07-13 GB GB9214858A patent/GB2257711B/en not_active Expired - Fee Related
- 1992-07-21 TW TW081105764A patent/TW236071B/zh active
-
1996
- 1996-02-08 HK HK22696A patent/HK22696A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP3040202B2 (ja) | 2000-05-15 |
GB2257711B (en) | 1995-09-20 |
TW236071B (xx) | 1994-12-11 |
CA2072702A1 (en) | 1993-01-13 |
GB2257711A (en) | 1993-01-20 |
GB9214858D0 (en) | 1992-08-26 |
ZA924998B (en) | 1994-09-26 |
JPH0527437A (ja) | 1993-02-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK22696A (en) | Aqueous photosensitive resin composition preparation thereof and preparation of printed circuit board using the composition | |
EP0379686A3 (en) | Printed circuit board | |
EP0419756A3 (en) | Printed circuit transformer | |
GB2229042B (en) | Printed circuit boards | |
GB2233157B (en) | Printed circuit board | |
GB9125173D0 (en) | Printed circuit combination and process | |
IL97812A0 (en) | Printed circuit board edge-locking device | |
GB2263253B (en) | Ceramic-on-metal circuit board | |
GB2254195B (en) | Printed circuit board transformer | |
ZA913626B (en) | The bonding of polymide films,and printed circuit boards | |
GB2251344B (en) | Connection of devices to printed circuit boards | |
GB2243247B (en) | Printed circuit board assemblies | |
EP0442145A3 (en) | Printed circuit board | |
GB2253521B (en) | Printed circuit board | |
GB9216263D0 (en) | Solder mask defined printed circuit board | |
GB8908155D0 (en) | Printed circuit boards | |
GB2254157B (en) | Printed circuit board | |
EP0406829A3 (en) | Printed circuit board | |
KR0112645Y1 (en) | Resistor construction of thick film circuit board | |
EP0467199A3 (en) | Preparation of printed circuit boards by metallization | |
GB9111905D0 (en) | Improvements relating to the manufacture of printed circuit boards | |
AU116272S (en) | Printed circuit board | |
GB2234860B (en) | Printed circuit board | |
GB9114642D0 (en) | Printed circuit board assembly manufacture | |
IL106405A0 (en) | Manufacture of printed circuit boards and the like |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |