HK22696A - Aqueous photosensitive resin composition preparation thereof and preparation of printed circuit board using the composition - Google Patents

Aqueous photosensitive resin composition preparation thereof and preparation of printed circuit board using the composition

Info

Publication number
HK22696A
HK22696A HK22696A HK22696A HK22696A HK 22696 A HK22696 A HK 22696A HK 22696 A HK22696 A HK 22696A HK 22696 A HK22696 A HK 22696A HK 22696 A HK22696 A HK 22696A
Authority
HK
Hong Kong
Prior art keywords
preparation
composition
circuit board
printed circuit
photosensitive resin
Prior art date
Application number
HK22696A
Other languages
English (en)
Inventor
Yoshichi Hagiwara
Hiroshi Samukawa
Katsue Nishikawa
Original Assignee
Pt Sub Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=15938352&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK22696(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Pt Sub Inc filed Critical Pt Sub Inc
Publication of HK22696A publication Critical patent/HK22696A/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Graft Or Block Polymers (AREA)
HK22696A 1991-07-12 1996-02-08 Aqueous photosensitive resin composition preparation thereof and preparation of printed circuit board using the composition HK22696A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3172247A JP3040202B2 (ja) 1991-07-12 1991-07-12 水系感光性樹脂組成物及びそれを用いたプリント回路板の製造方法

Publications (1)

Publication Number Publication Date
HK22696A true HK22696A (en) 1996-02-16

Family

ID=15938352

Family Applications (1)

Application Number Title Priority Date Filing Date
HK22696A HK22696A (en) 1991-07-12 1996-02-08 Aqueous photosensitive resin composition preparation thereof and preparation of printed circuit board using the composition

Country Status (6)

Country Link
JP (1) JP3040202B2 (xx)
CA (1) CA2072702A1 (xx)
GB (1) GB2257711B (xx)
HK (1) HK22696A (xx)
TW (1) TW236071B (xx)
ZA (1) ZA924998B (xx)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06258832A (ja) * 1992-11-17 1994-09-16 W R Grace & Co 感光性樹脂組成物
US5445919A (en) * 1993-06-14 1995-08-29 Fuji Photo Film Co., Ltd. Photopolymerizable composition
AU661438B1 (en) * 1994-01-25 1995-07-20 Morton International, Inc. Waterborne photoresists having polysiloxanes
US5364737A (en) * 1994-01-25 1994-11-15 Morton International, Inc. Waterbone photoresists having associate thickeners
AU660881B1 (en) * 1994-01-25 1995-07-06 Morton International, Inc. Waterborne photoresists having binders neutralized with amino acrylates
AU660882B1 (en) * 1994-01-25 1995-07-06 Morton International, Inc. Waterborne photoresists having non-ionic fluorocarbon surfactants
JPH08289942A (ja) * 1995-04-25 1996-11-05 Yukio Tsunoda ゴルフクラブ
US5512607A (en) * 1995-06-06 1996-04-30 W. R. Grace & Co.-Conn. Unsaturated epoxy ester with quaternary ammonium and phosphate groups
WO1996041240A1 (en) * 1995-06-07 1996-12-19 W.R. Grace & Co.-Conn. Water photoresist emulsions and methods of preparation thereof
JPH0915857A (ja) * 1995-06-29 1997-01-17 Hitachi Chem Co Ltd 着色画像形成材料、これを用いた感光液、感光性エレメント及びカラーフィルタの製造法
US20040265730A1 (en) * 2001-12-03 2004-12-30 Hiroshi Takahashi Photosensitive composition and production processes for photosensitive film and printed wiring board
DE60322278D1 (de) 2002-05-06 2008-08-28 Sun Chemical Corp Einphasige energiehärtbare Zusammensetzungen auf Wasserbasis
US7226959B2 (en) 2003-11-06 2007-06-05 Sun Chemical Corporation Water soluble energy curable stereo-crosslinkable ionomer compositions
JP5624288B2 (ja) * 2009-06-30 2014-11-12 互応化学工業株式会社 スルーホール付きプリント配線板の製造方法
DE112011101165T5 (de) 2010-03-29 2013-03-28 Mitsubishi Paper Mills Limited Fotoempfindliche Zusammensetzung und fotoempfindliches lithographisches Druckplattenmaterial
JP7181775B2 (ja) * 2017-12-12 2022-12-01 三洋化成工業株式会社 水性（共）重合体組成物
CN115197381B (zh) * 2022-09-16 2022-11-25 广州鹿山新材料股份有限公司 一种不饱和sma树脂改性聚丙烯及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD250593A1 (de) * 1984-04-03 1987-10-14 Wolfen Filmfab Veb Fotopolymerisierbares material
PT85756A (pt) * 1986-09-22 1988-10-14 Napp Systems Inc Processo para a preparacao de chapas fotossensiveis e revelaveis com agua
EP0287019A3 (en) * 1987-04-16 1990-07-11 W.R. Grace & Co.-Conn. Aqueous developable, radiation curable composition
EP0295944A3 (en) * 1987-06-18 1989-09-06 Napp Systems (Usa) Inc. Photosensitive resin composition and printing plate prepared therefrom
US5403698A (en) * 1990-10-16 1995-04-04 Hitachi Chemical Company, Ltd. Negative type photosensitive electrodepositing resin composition

Also Published As

Publication number Publication date
JP3040202B2 (ja) 2000-05-15
GB2257711B (en) 1995-09-20
TW236071B (xx) 1994-12-11
CA2072702A1 (en) 1993-01-13
GB2257711A (en) 1993-01-20
GB9214858D0 (en) 1992-08-26
ZA924998B (en) 1994-09-26
JPH0527437A (ja) 1993-02-05

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)