HK1219570A1 - 移動圖像傳感器封裝件 - Google Patents

移動圖像傳感器封裝件

Info

Publication number
HK1219570A1
HK1219570A1 HK16107540.2A HK16107540A HK1219570A1 HK 1219570 A1 HK1219570 A1 HK 1219570A1 HK 16107540 A HK16107540 A HK 16107540A HK 1219570 A1 HK1219570 A1 HK 1219570A1
Authority
HK
Hong Kong
Prior art keywords
image sensor
moving image
sensor package
package
moving
Prior art date
Application number
HK16107540.2A
Other languages
English (en)
Inventor
．古鐵雷斯
．王
．劉
Original Assignee
Mems Drive Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mems Drive Inc filed Critical Mems Drive Inc
Publication of HK1219570A1 publication Critical patent/HK1219570A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Studio Devices (AREA)
  • Manufacturing & Machinery (AREA)
HK16107540.2A 2014-05-27 2016-06-28 移動圖像傳感器封裝件 HK1219570A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462003421P 2014-05-27 2014-05-27
US14/692,662 US9578217B2 (en) 2014-05-27 2015-04-21 Moving image sensor package

Publications (1)

Publication Number Publication Date
HK1219570A1 true HK1219570A1 (zh) 2017-04-07

Family

ID=54703259

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16107540.2A HK1219570A1 (zh) 2014-05-27 2016-06-28 移動圖像傳感器封裝件

Country Status (3)

Country Link
US (1) US9578217B2 (zh)
CN (1) CN105428375B (zh)
HK (1) HK1219570A1 (zh)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6316000B2 (ja) * 2014-01-20 2018-04-25 キヤノン株式会社 撮像素子ユニット、及び光学機器
KR102390760B1 (ko) * 2015-02-13 2022-04-26 삼성전자주식회사 카메라 장치 및 이를 구비한 전자 장치
US9591215B1 (en) * 2015-09-11 2017-03-07 Apple Inc. Thermally conductive camera enclosure
US9874742B2 (en) * 2015-09-25 2018-01-23 Intel Corporation MEMS reinforcement
US9813602B2 (en) * 2015-12-22 2017-11-07 Faez Ba-Tis Autofocus camera using MEMS actuation of image sensor
WO2017156462A1 (en) 2016-03-11 2017-09-14 Skattward Research Llc Optical image stabilization with voice coil motor for moving image sensor
US11956544B2 (en) 2016-03-11 2024-04-09 Apple Inc. Optical image stabilization with voice coil motor for moving image sensor
US10437023B2 (en) 2016-03-28 2019-10-08 Apple Inc. Folded lens system with three refractive lenses
CN105789233B (zh) * 2016-04-15 2019-12-17 格科微电子（上海）有限公司 Cmos图像传感器模组的感光元件移动式光学防抖方法
KR102348365B1 (ko) * 2016-05-03 2022-01-10 삼성전자주식회사 카메라 모듈을 포함하는 전자 장치
CN106161979B (zh) 2016-07-29 2017-08-25 广东欧珀移动通信有限公司 高动态范围图像拍摄方法、装置和终端设备
CN107948532B (zh) 2016-07-29 2019-08-20 Oppo广东移动通信有限公司 光学图像稳定***、成像装置及电子装置
CN106254768B (zh) * 2016-07-29 2018-05-22 广东欧珀移动通信有限公司 微距拍摄处理方法、装置和终端设备
US10523135B2 (en) 2016-09-12 2019-12-31 Mems Drive, Inc. MEMS actuation systems and methods
US11407634B2 (en) 2016-09-12 2022-08-09 MEMS Drive (Nanjing) Co., Ltd. MEMS actuation systems and methods
CN115681047A (zh) * 2016-12-16 2023-02-03 哈钦森技术股份有限公司 光学图像稳定悬架中的传感器移位结构
US11199182B2 (en) 2016-12-16 2021-12-14 Hutchinson Technology Incorporated Sensor shift structures in optical image stabilization suspensions
CN108234831B (zh) * 2016-12-22 2023-09-05 宁波舜宇光电信息有限公司 改善平整度的摄像模组和感光组件及其制造方法
CN108234832B (zh) * 2016-12-22 2023-09-05 宁波舜宇光电信息有限公司 改善平整度的摄像模组和感光组件及其制造方法
US10122924B2 (en) * 2017-01-23 2018-11-06 Faez Ba-Tis Camera modules using MEMS micro electrostatic pistontube actuators for autofocus (AF) and optical image stabilization (OIS)
CN106686292B (zh) * 2017-02-14 2018-09-04 维沃移动通信有限公司 一种摄像头模组及移动终端
KR102384532B1 (ko) * 2017-03-15 2022-04-08 삼성전자주식회사 카메라 방열 구조를 가지는 전자 장치
US10890734B1 (en) 2017-03-29 2021-01-12 Apple Inc. Camera actuator for lens and sensor shifting
US11049898B2 (en) * 2017-04-01 2021-06-29 Ningbo Sunny Opotech Co., Ltd. Systems and methods for manufacturing semiconductor modules
WO2018188628A1 (zh) 2017-04-12 2018-10-18 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和制造方法以及电子设备
US10863094B2 (en) 2017-07-17 2020-12-08 Apple Inc. Camera with image sensor shifting
US10893200B2 (en) * 2018-06-01 2021-01-12 Faez Ba-Tis Autofocus and optical image stabilizer system
JP2021532640A (ja) * 2018-07-17 2021-11-25 ベステル エレクトロニク サナイー ベ ティカレト エー．エス． ただ二つのカメラを備える装置およびこの装置を用いて二つの画像を生成する方法
CN110839119A (zh) * 2018-08-15 2020-02-25 宁波舜宇光电信息有限公司 防抖摄像模组和防抖感光组件及其制造方法以及电子设备
WO2020034826A1 (zh) * 2018-08-15 2020-02-20 宁波舜宇光电信息有限公司 防抖摄像模组和防抖感光组件及其制造方法以及电子设备
CN109343293A (zh) * 2018-08-27 2019-02-15 中国科学院苏州纳米技术与纳米仿生研究所 静电驱动装置及光学装置
US11122205B1 (en) 2018-09-14 2021-09-14 Apple Inc. Camera actuator assembly with sensor shift flexure arrangement
CN111225130B (zh) * 2018-11-23 2021-02-26 华为机器有限公司 一种成像装置及终端设备
US10582100B1 (en) 2019-01-04 2020-03-03 Faez Ba-Tis Five degrees of freedom MEMS actuator for autofocus, optical image stabilization, and super resolution imaging in miniature cameras
US11595582B2 (en) 2019-09-25 2023-02-28 Apple Inc. Dynamic flex circuit for camera with moveable image sensor
US11223765B2 (en) * 2019-09-25 2022-01-11 Apple Inc. Dynamic flex circuit for camera with moveable image sensor
US11647287B1 (en) 2019-12-03 2023-05-09 Waymo Llc Autofocus actuator
US11223756B1 (en) 2019-12-03 2022-01-11 Waymo Llc Position sensor and hybrid substrate for camera focus management
US11829001B2 (en) 2020-01-22 2023-11-28 Tdk Taiwan Corp. Optical system
US20220019128A1 (en) * 2020-07-17 2022-01-20 MEMS Drive (Nanjing) Co., Ltd. MEMS Assembly Process Flow
CN114200739A (zh) 2020-09-02 2022-03-18 哈钦森技术股份有限公司 引导式自动对焦组件
US11194115B1 (en) 2020-09-02 2021-12-07 Hutchinson Technology Incorporated Guided autofocus assembly
US11575835B2 (en) 2020-09-24 2023-02-07 Apple Inc. Multi-axis image sensor shifting system
CN114553985B (zh) * 2020-11-25 2023-09-12 华为技术有限公司 摄像模组及应用其的电子装置
US10965848B1 (en) 2020-12-01 2021-03-30 Sheba Microsystems Inc. MEMS electrostatic actuator for super resolution and autofocus in cameras
US11680786B2 (en) 2021-11-05 2023-06-20 Waymo Llc Capacitive position sensing for camera focus management
JP2023089794A (ja) * 2021-12-16 2023-06-28 パナソニックＩｐマネジメント株式会社 撮像装置
CN117355480A (zh) * 2021-12-17 2024-01-05 麦斯卓微电子(南京)有限公司 Mems间隔组件

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008533441A (ja) * 2005-02-08 2008-08-21 ナノネクサス インク Ｉｃパッケージおよび相互接続アゼンブリのための高密度の相互接続システム
US8768157B2 (en) * 2011-09-28 2014-07-01 DigitalOptics Corporation MEMS Multiple degree of freedom actuator
US7812418B2 (en) * 2008-07-29 2010-10-12 Fortemedia, Inc Chip-scaled MEMS microphone package
KR101940227B1 (ko) * 2011-12-19 2019-01-21 엘지이노텍 주식회사 멤스 소자 및 흔들림 보정 장치
JP6029283B2 (ja) * 2012-02-08 2016-11-24 株式会社アドバンテスト 波長変換装置、光源装置、および波長変換方法
TWI557439B (zh) * 2012-05-28 2016-11-11 鴻海精密工業股份有限公司 紅外截止濾光片及鏡頭模組

Also Published As

Publication number Publication date
US9578217B2 (en) 2017-02-21
CN105428375A (zh) 2016-03-23
CN105428375B (zh) 2019-03-01
US20150350500A1 (en) 2015-12-03

Similar Documents

Publication Publication Date Title
HK1219570A1 (zh) 移動圖像傳感器封裝件
HK1247272A1 (zh) 距離傳感器
GB2526440B (en) Sensor arrangements
SG11201704183WA (en) Sensor apparatus
GB201403389D0 (en) Sensor
TWI563254B (en) Sensor
EP2940504C0 (en) OPTICAL SENSOR
GB201521282D0 (en) Sensor
GB2524044B (en) CMOS Image sensor
GB2541589B (en) Image modification
EP3141927A4 (en) Distance image sensor
GB201607956D0 (en) Image sensor
SG11201701909PA (en) Sensor device
GB201621696D0 (en) Image forming device
TWI562342B (en) Image sensing device
GB201407477D0 (en) Infrared sensor package
IL236127A0 (en) Earthquake detection detector
GB201412136D0 (en) Sensor
GB201404101D0 (en) Image modification
GB201417887D0 (en) Optical sensor
IL262377A (en) image sensor
GB2528159B (en) Sensor
SG11201702718VA (en) Sensor device
GB201520988D0 (en) Sensor
GB201513373D0 (en) Position sensor