HK1219570A1 - 移動圖像傳感器封裝件 - Google Patents
移動圖像傳感器封裝件Info
- Publication number
- HK1219570A1 HK1219570A1 HK16107540.2A HK16107540A HK1219570A1 HK 1219570 A1 HK1219570 A1 HK 1219570A1 HK 16107540 A HK16107540 A HK 16107540A HK 1219570 A1 HK1219570 A1 HK 1219570A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- image sensor
- moving image
- sensor package
- package
- moving
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201462003421P | 2014-05-27 | 2014-05-27 | |
US14/692,662 US9578217B2 (en) | 2014-05-27 | 2015-04-21 | Moving image sensor package |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1219570A1 true HK1219570A1 (zh) | 2017-04-07 |
Family
ID=54703259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16107540.2A HK1219570A1 (zh) | 2014-05-27 | 2016-06-28 | 移動圖像傳感器封裝件 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9578217B2 (zh) |
CN (1) | CN105428375B (zh) |
HK (1) | HK1219570A1 (zh) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6316000B2 (ja) * | 2014-01-20 | 2018-04-25 | キヤノン株式会社 | 撮像素子ユニット、及び光学機器 |
KR102390760B1 (ko) * | 2015-02-13 | 2022-04-26 | 삼성전자주식회사 | 카메라 장치 및 이를 구비한 전자 장치 |
US9591215B1 (en) * | 2015-09-11 | 2017-03-07 | Apple Inc. | Thermally conductive camera enclosure |
US9874742B2 (en) * | 2015-09-25 | 2018-01-23 | Intel Corporation | MEMS reinforcement |
US9813602B2 (en) * | 2015-12-22 | 2017-11-07 | Faez Ba-Tis | Autofocus camera using MEMS actuation of image sensor |
WO2017156462A1 (en) | 2016-03-11 | 2017-09-14 | Skattward Research Llc | Optical image stabilization with voice coil motor for moving image sensor |
US11956544B2 (en) | 2016-03-11 | 2024-04-09 | Apple Inc. | Optical image stabilization with voice coil motor for moving image sensor |
US10437023B2 (en) | 2016-03-28 | 2019-10-08 | Apple Inc. | Folded lens system with three refractive lenses |
CN105789233B (zh) * | 2016-04-15 | 2019-12-17 | 格科微电子(上海)有限公司 | Cmos图像传感器模组的感光元件移动式光学防抖方法 |
KR102348365B1 (ko) * | 2016-05-03 | 2022-01-10 | 삼성전자주식회사 | 카메라 모듈을 포함하는 전자 장치 |
CN106161979B (zh) | 2016-07-29 | 2017-08-25 | 广东欧珀移动通信有限公司 | 高动态范围图像拍摄方法、装置和终端设备 |
CN107948532B (zh) | 2016-07-29 | 2019-08-20 | Oppo广东移动通信有限公司 | 光学图像稳定***、成像装置及电子装置 |
CN106254768B (zh) * | 2016-07-29 | 2018-05-22 | 广东欧珀移动通信有限公司 | 微距拍摄处理方法、装置和终端设备 |
US10523135B2 (en) | 2016-09-12 | 2019-12-31 | Mems Drive, Inc. | MEMS actuation systems and methods |
US11407634B2 (en) | 2016-09-12 | 2022-08-09 | MEMS Drive (Nanjing) Co., Ltd. | MEMS actuation systems and methods |
CN115681047A (zh) * | 2016-12-16 | 2023-02-03 | 哈钦森技术股份有限公司 | 光学图像稳定悬架中的传感器移位结构 |
US11199182B2 (en) | 2016-12-16 | 2021-12-14 | Hutchinson Technology Incorporated | Sensor shift structures in optical image stabilization suspensions |
CN108234831B (zh) * | 2016-12-22 | 2023-09-05 | 宁波舜宇光电信息有限公司 | 改善平整度的摄像模组和感光组件及其制造方法 |
CN108234832B (zh) * | 2016-12-22 | 2023-09-05 | 宁波舜宇光电信息有限公司 | 改善平整度的摄像模组和感光组件及其制造方法 |
US10122924B2 (en) * | 2017-01-23 | 2018-11-06 | Faez Ba-Tis | Camera modules using MEMS micro electrostatic pistontube actuators for autofocus (AF) and optical image stabilization (OIS) |
CN106686292B (zh) * | 2017-02-14 | 2018-09-04 | 维沃移动通信有限公司 | 一种摄像头模组及移动终端 |
KR102384532B1 (ko) * | 2017-03-15 | 2022-04-08 | 삼성전자주식회사 | 카메라 방열 구조를 가지는 전자 장치 |
US10890734B1 (en) | 2017-03-29 | 2021-01-12 | Apple Inc. | Camera actuator for lens and sensor shifting |
US11049898B2 (en) * | 2017-04-01 | 2021-06-29 | Ningbo Sunny Opotech Co., Ltd. | Systems and methods for manufacturing semiconductor modules |
WO2018188628A1 (zh) | 2017-04-12 | 2018-10-18 | 宁波舜宇光电信息有限公司 | 摄像模组及其模塑感光组件和制造方法以及电子设备 |
US10863094B2 (en) | 2017-07-17 | 2020-12-08 | Apple Inc. | Camera with image sensor shifting |
US10893200B2 (en) * | 2018-06-01 | 2021-01-12 | Faez Ba-Tis | Autofocus and optical image stabilizer system |
JP2021532640A (ja) * | 2018-07-17 | 2021-11-25 | ベステル エレクトロニク サナイー ベ ティカレト エー.エス. | ただ二つのカメラを備える装置およびこの装置を用いて二つの画像を生成する方法 |
CN110839119A (zh) * | 2018-08-15 | 2020-02-25 | 宁波舜宇光电信息有限公司 | 防抖摄像模组和防抖感光组件及其制造方法以及电子设备 |
WO2020034826A1 (zh) * | 2018-08-15 | 2020-02-20 | 宁波舜宇光电信息有限公司 | 防抖摄像模组和防抖感光组件及其制造方法以及电子设备 |
CN109343293A (zh) * | 2018-08-27 | 2019-02-15 | 中国科学院苏州纳米技术与纳米仿生研究所 | 静电驱动装置及光学装置 |
US11122205B1 (en) | 2018-09-14 | 2021-09-14 | Apple Inc. | Camera actuator assembly with sensor shift flexure arrangement |
CN111225130B (zh) * | 2018-11-23 | 2021-02-26 | 华为机器有限公司 | 一种成像装置及终端设备 |
US10582100B1 (en) | 2019-01-04 | 2020-03-03 | Faez Ba-Tis | Five degrees of freedom MEMS actuator for autofocus, optical image stabilization, and super resolution imaging in miniature cameras |
US11595582B2 (en) | 2019-09-25 | 2023-02-28 | Apple Inc. | Dynamic flex circuit for camera with moveable image sensor |
US11223765B2 (en) * | 2019-09-25 | 2022-01-11 | Apple Inc. | Dynamic flex circuit for camera with moveable image sensor |
US11647287B1 (en) | 2019-12-03 | 2023-05-09 | Waymo Llc | Autofocus actuator |
US11223756B1 (en) | 2019-12-03 | 2022-01-11 | Waymo Llc | Position sensor and hybrid substrate for camera focus management |
US11829001B2 (en) | 2020-01-22 | 2023-11-28 | Tdk Taiwan Corp. | Optical system |
US20220019128A1 (en) * | 2020-07-17 | 2022-01-20 | MEMS Drive (Nanjing) Co., Ltd. | MEMS Assembly Process Flow |
CN114200739A (zh) | 2020-09-02 | 2022-03-18 | 哈钦森技术股份有限公司 | 引导式自动对焦组件 |
US11194115B1 (en) | 2020-09-02 | 2021-12-07 | Hutchinson Technology Incorporated | Guided autofocus assembly |
US11575835B2 (en) | 2020-09-24 | 2023-02-07 | Apple Inc. | Multi-axis image sensor shifting system |
CN114553985B (zh) * | 2020-11-25 | 2023-09-12 | 华为技术有限公司 | 摄像模组及应用其的电子装置 |
US10965848B1 (en) | 2020-12-01 | 2021-03-30 | Sheba Microsystems Inc. | MEMS electrostatic actuator for super resolution and autofocus in cameras |
US11680786B2 (en) | 2021-11-05 | 2023-06-20 | Waymo Llc | Capacitive position sensing for camera focus management |
JP2023089794A (ja) * | 2021-12-16 | 2023-06-28 | パナソニックIpマネジメント株式会社 | 撮像装置 |
CN117355480A (zh) * | 2021-12-17 | 2024-01-05 | 麦斯卓微电子(南京)有限公司 | Mems间隔组件 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008533441A (ja) * | 2005-02-08 | 2008-08-21 | ナノネクサス インク | Icパッケージおよび相互接続アゼンブリのための高密度の相互接続システム |
US8768157B2 (en) * | 2011-09-28 | 2014-07-01 | DigitalOptics Corporation MEMS | Multiple degree of freedom actuator |
US7812418B2 (en) * | 2008-07-29 | 2010-10-12 | Fortemedia, Inc | Chip-scaled MEMS microphone package |
KR101940227B1 (ko) * | 2011-12-19 | 2019-01-21 | 엘지이노텍 주식회사 | 멤스 소자 및 흔들림 보정 장치 |
JP6029283B2 (ja) * | 2012-02-08 | 2016-11-24 | 株式会社アドバンテスト | 波長変換装置、光源装置、および波長変換方法 |
TWI557439B (zh) * | 2012-05-28 | 2016-11-11 | 鴻海精密工業股份有限公司 | 紅外截止濾光片及鏡頭模組 |
-
2015
- 2015-04-21 US US14/692,662 patent/US9578217B2/en active Active - Reinstated
- 2015-05-27 CN CN201510276359.6A patent/CN105428375B/zh active Active
-
2016
- 2016-06-28 HK HK16107540.2A patent/HK1219570A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US9578217B2 (en) | 2017-02-21 |
CN105428375A (zh) | 2016-03-23 |
CN105428375B (zh) | 2019-03-01 |
US20150350500A1 (en) | 2015-12-03 |
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