HK1219560A1 - 具有壓印的引線框架的電容器 - Google Patents

具有壓印的引線框架的電容器

Info

Publication number
HK1219560A1
HK1219560A1 HK16107509.1A HK16107509A HK1219560A1 HK 1219560 A1 HK1219560 A1 HK 1219560A1 HK 16107509 A HK16107509 A HK 16107509A HK 1219560 A1 HK1219560 A1 HK 1219560A1
Authority
HK
Hong Kong
Prior art keywords
capacitor
lead frame
coined
coined lead
frame
Prior art date
Application number
HK16107509.1A
Other languages
English (en)
Inventor
.維勞巴爾
Original Assignee
Avx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avx Corp filed Critical Avx Corp
Publication of HK1219560A1 publication Critical patent/HK1219560A1/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/008Terminals
    • H01G9/012Terminals specially adapted for solid capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/022Electrolytes; Absorbents
    • H01G9/025Solid electrolytes
    • H01G9/028Organic semiconducting electrolytes, e.g. TCNQ
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/15Solid electrolytic capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004Details
    • H01G9/04Electrodes or formation of dielectric layers thereon
    • H01G9/048Electrodes or formation of dielectric layers thereon characterised by their structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Manufacturing & Machinery (AREA)
HK16107509.1A 2014-11-24 2016-06-28 具有壓印的引線框架的電容器 HK1219560A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14/551,251 US9892860B2 (en) 2014-11-24 2014-11-24 Capacitor with coined lead frame

Publications (1)

Publication Number Publication Date
HK1219560A1 true HK1219560A1 (zh) 2017-04-07

Family

ID=55914446

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16107509.1A HK1219560A1 (zh) 2014-11-24 2016-06-28 具有壓印的引線框架的電容器

Country Status (4)

Country Link
US (1) US9892860B2 (zh)
CN (1) CN105632765B (zh)
DE (1) DE102015221047A1 (zh)
HK (1) HK1219560A1 (zh)

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2765462B2 (ja) 1993-07-27 1998-06-18 日本電気株式会社 固体電解コンデンサおよびその製造方法
JPH07135126A (ja) 1993-11-10 1995-05-23 Nec Corp 固体電解コンデンサ及びその製造方法
US5545921A (en) 1994-11-04 1996-08-13 International Business Machines, Corporation Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
JP3068430B2 (ja) 1995-04-25 2000-07-24 富山日本電気株式会社 固体電解コンデンサ及びその製造方法
US5812367A (en) 1996-04-04 1998-09-22 Matsushita Electric Industrial Co., Ltd. Solid electrolytic capacitors comprising a conductive layer made of a polymer of pyrrole or its derivative
GB9700566D0 (en) 1997-01-13 1997-03-05 Avx Ltd Binder removal
US6322912B1 (en) 1998-09-16 2001-11-27 Cabot Corporation Electrolytic capacitor anode of valve metal oxide
US6391275B1 (en) 1998-09-16 2002-05-21 Cabot Corporation Methods to partially reduce a niobium metal oxide and oxygen reduced niobium oxides
US6416730B1 (en) 1998-09-16 2002-07-09 Cabot Corporation Methods to partially reduce a niobium metal oxide oxygen reduced niobium oxides
KR100355794B1 (ko) 1999-10-15 2002-10-19 앰코 테크놀로지 코리아 주식회사 리드프레임 및 이를 이용한 반도체패키지
US6847103B1 (en) 1999-11-09 2005-01-25 Amkor Technology, Inc. Semiconductor package with exposed die pad and body-locking leadframe
US6576099B2 (en) 2000-03-23 2003-06-10 Cabot Corporation Oxygen reduced niobium oxides
EP1334498B1 (en) 2000-11-06 2006-09-13 Cabot Corporation Modified oxygen reduced valve metal oxides
US6674635B1 (en) 2001-06-11 2004-01-06 Avx Corporation Protective coating for electrolytic capacitors
US6870727B2 (en) * 2002-10-07 2005-03-22 Avx Corporation Electrolytic capacitor with improved volumetric efficiency
JP2004228424A (ja) * 2003-01-24 2004-08-12 Nec Tokin Corp チップ電解コンデンサおよびその製造方法
EP1498391B1 (de) 2003-07-15 2010-05-05 H.C. Starck GmbH Niobsuboxidpulver
DE10333156A1 (de) 2003-07-22 2005-02-24 H.C. Starck Gmbh Verfahren zur Herstellung von Niobsuboxid
DE10347702B4 (de) 2003-10-14 2007-03-29 H.C. Starck Gmbh Sinterkörper auf Basis Niobsuboxid
DE502004009915D1 (de) * 2003-10-17 2009-10-01 Starck H C Gmbh Elektrolytkondensatoren mit polymerer Aussenschicht
CN1737072B (zh) 2004-08-18 2011-06-08 播磨化成株式会社 导电粘合剂及使用该导电粘合剂制造物件的方法
US20060197199A1 (en) 2005-03-05 2006-09-07 Lange Bernhard P Leadframe, coining tool, and method
JP2007096021A (ja) * 2005-09-29 2007-04-12 Nec Tokin Corp チップ型固体電解コンデンサおよびそれに用いるリードフレーム
US7542267B2 (en) 2006-11-06 2009-06-02 Nec Tokin Corporation Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method
US7515396B2 (en) 2007-03-21 2009-04-07 Avx Corporation Solid electrolytic capacitor containing a conductive polymer
US8139344B2 (en) 2009-09-10 2012-03-20 Avx Corporation Electrolytic capacitor assembly and method with recessed leadframe channel
US8125769B2 (en) 2010-07-22 2012-02-28 Avx Corporation Solid electrolytic capacitor assembly with multiple cathode terminations
US8199460B2 (en) 2010-09-27 2012-06-12 Avx Corporation Solid electrolytic capacitor with improved anode termination
US8582278B2 (en) * 2011-03-11 2013-11-12 Avx Corporation Solid electrolytic capacitor with improved mechanical stability
US8514550B2 (en) 2011-03-11 2013-08-20 Avx Corporation Solid electrolytic capacitor containing a cathode termination with a slot for an adhesive

Also Published As

Publication number Publication date
US9892860B2 (en) 2018-02-13
CN105632765A (zh) 2016-06-01
CN105632765B (zh) 2019-04-09
US20160148755A1 (en) 2016-05-26
DE102015221047A1 (de) 2016-05-25

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