HK1219560A1 - 具有壓印的引線框架的電容器 - Google Patents
具有壓印的引線框架的電容器Info
- Publication number
- HK1219560A1 HK1219560A1 HK16107509.1A HK16107509A HK1219560A1 HK 1219560 A1 HK1219560 A1 HK 1219560A1 HK 16107509 A HK16107509 A HK 16107509A HK 1219560 A1 HK1219560 A1 HK 1219560A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- capacitor
- lead frame
- coined
- coined lead
- frame
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
- H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing & Machinery (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/551,251 US9892860B2 (en) | 2014-11-24 | 2014-11-24 | Capacitor with coined lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1219560A1 true HK1219560A1 (zh) | 2017-04-07 |
Family
ID=55914446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16107509.1A HK1219560A1 (zh) | 2014-11-24 | 2016-06-28 | 具有壓印的引線框架的電容器 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9892860B2 (zh) |
CN (1) | CN105632765B (zh) |
DE (1) | DE102015221047A1 (zh) |
HK (1) | HK1219560A1 (zh) |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2765462B2 (ja) | 1993-07-27 | 1998-06-18 | 日本電気株式会社 | 固体電解コンデンサおよびその製造方法 |
JPH07135126A (ja) | 1993-11-10 | 1995-05-23 | Nec Corp | 固体電解コンデンサ及びその製造方法 |
US5545921A (en) | 1994-11-04 | 1996-08-13 | International Business Machines, Corporation | Personalized area leadframe coining or half etching for reduced mechanical stress at device edge |
JP3068430B2 (ja) | 1995-04-25 | 2000-07-24 | 富山日本電気株式会社 | 固体電解コンデンサ及びその製造方法 |
US5812367A (en) | 1996-04-04 | 1998-09-22 | Matsushita Electric Industrial Co., Ltd. | Solid electrolytic capacitors comprising a conductive layer made of a polymer of pyrrole or its derivative |
GB9700566D0 (en) | 1997-01-13 | 1997-03-05 | Avx Ltd | Binder removal |
US6322912B1 (en) | 1998-09-16 | 2001-11-27 | Cabot Corporation | Electrolytic capacitor anode of valve metal oxide |
US6391275B1 (en) | 1998-09-16 | 2002-05-21 | Cabot Corporation | Methods to partially reduce a niobium metal oxide and oxygen reduced niobium oxides |
US6416730B1 (en) | 1998-09-16 | 2002-07-09 | Cabot Corporation | Methods to partially reduce a niobium metal oxide oxygen reduced niobium oxides |
KR100355794B1 (ko) | 1999-10-15 | 2002-10-19 | 앰코 테크놀로지 코리아 주식회사 | 리드프레임 및 이를 이용한 반도체패키지 |
US6847103B1 (en) | 1999-11-09 | 2005-01-25 | Amkor Technology, Inc. | Semiconductor package with exposed die pad and body-locking leadframe |
US6576099B2 (en) | 2000-03-23 | 2003-06-10 | Cabot Corporation | Oxygen reduced niobium oxides |
EP1334498B1 (en) | 2000-11-06 | 2006-09-13 | Cabot Corporation | Modified oxygen reduced valve metal oxides |
US6674635B1 (en) | 2001-06-11 | 2004-01-06 | Avx Corporation | Protective coating for electrolytic capacitors |
US6870727B2 (en) * | 2002-10-07 | 2005-03-22 | Avx Corporation | Electrolytic capacitor with improved volumetric efficiency |
JP2004228424A (ja) * | 2003-01-24 | 2004-08-12 | Nec Tokin Corp | チップ電解コンデンサおよびその製造方法 |
EP1498391B1 (de) | 2003-07-15 | 2010-05-05 | H.C. Starck GmbH | Niobsuboxidpulver |
DE10333156A1 (de) | 2003-07-22 | 2005-02-24 | H.C. Starck Gmbh | Verfahren zur Herstellung von Niobsuboxid |
DE10347702B4 (de) | 2003-10-14 | 2007-03-29 | H.C. Starck Gmbh | Sinterkörper auf Basis Niobsuboxid |
DE502004009915D1 (de) * | 2003-10-17 | 2009-10-01 | Starck H C Gmbh | Elektrolytkondensatoren mit polymerer Aussenschicht |
CN1737072B (zh) | 2004-08-18 | 2011-06-08 | 播磨化成株式会社 | 导电粘合剂及使用该导电粘合剂制造物件的方法 |
US20060197199A1 (en) | 2005-03-05 | 2006-09-07 | Lange Bernhard P | Leadframe, coining tool, and method |
JP2007096021A (ja) * | 2005-09-29 | 2007-04-12 | Nec Tokin Corp | チップ型固体電解コンデンサおよびそれに用いるリードフレーム |
US7542267B2 (en) | 2006-11-06 | 2009-06-02 | Nec Tokin Corporation | Lead frame, method of manufacturing a face-down terminal solid electrolytic capacitor using the lead frame, and face-down terminal solid electrolytic capacitor manufactured by the method |
US7515396B2 (en) | 2007-03-21 | 2009-04-07 | Avx Corporation | Solid electrolytic capacitor containing a conductive polymer |
US8139344B2 (en) | 2009-09-10 | 2012-03-20 | Avx Corporation | Electrolytic capacitor assembly and method with recessed leadframe channel |
US8125769B2 (en) | 2010-07-22 | 2012-02-28 | Avx Corporation | Solid electrolytic capacitor assembly with multiple cathode terminations |
US8199460B2 (en) | 2010-09-27 | 2012-06-12 | Avx Corporation | Solid electrolytic capacitor with improved anode termination |
US8582278B2 (en) * | 2011-03-11 | 2013-11-12 | Avx Corporation | Solid electrolytic capacitor with improved mechanical stability |
US8514550B2 (en) | 2011-03-11 | 2013-08-20 | Avx Corporation | Solid electrolytic capacitor containing a cathode termination with a slot for an adhesive |
-
2014
- 2014-11-24 US US14/551,251 patent/US9892860B2/en active Active
-
2015
- 2015-10-21 CN CN201510698060.XA patent/CN105632765B/zh active Active
- 2015-10-28 DE DE102015221047.2A patent/DE102015221047A1/de active Pending
-
2016
- 2016-06-28 HK HK16107509.1A patent/HK1219560A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US9892860B2 (en) | 2018-02-13 |
CN105632765A (zh) | 2016-06-01 |
CN105632765B (zh) | 2019-04-09 |
US20160148755A1 (en) | 2016-05-26 |
DE102015221047A1 (de) | 2016-05-25 |
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