HK1213693A1 - 硅太陽能電池的聯合腐蝕與鈍化 - Google Patents

硅太陽能電池的聯合腐蝕與鈍化

Info

Publication number
HK1213693A1
HK1213693A1 HK16101519.2A HK16101519A HK1213693A1 HK 1213693 A1 HK1213693 A1 HK 1213693A1 HK 16101519 A HK16101519 A HK 16101519A HK 1213693 A1 HK1213693 A1 HK 1213693A1
Authority
HK
Hong Kong
Prior art keywords
passivation
solar cells
silicon solar
combined etch
etch
Prior art date
Application number
HK16101519.2A
Other languages
English (en)
Inventor
Laurent Clochard
Original Assignee
Ultra High Vaccum Solutions Ltd T/A Nines Enginee
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultra High Vaccum Solutions Ltd T/A Nines Enginee filed Critical Ultra High Vaccum Solutions Ltd T/A Nines Enginee
Publication of HK1213693A1 publication Critical patent/HK1213693A1/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67069Apparatus for fluid treatment for etching for drying etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0236Special surface textures
    • H01L31/02363Special surface textures of the semiconductor body itself, e.g. textured active layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1804Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/186Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
    • H01L31/1868Passivation
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Photovoltaic Devices (AREA)
HK16101519.2A 2012-10-01 2016-02-11 硅太陽能電池的聯合腐蝕與鈍化 HK1213693A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IES20120434 2012-10-01
PCT/EP2013/070443 WO2014053484A1 (en) 2012-10-01 2013-10-01 Combined etch and passivation of silicon solar cells

Publications (1)

Publication Number Publication Date
HK1213693A1 true HK1213693A1 (zh) 2016-07-08

Family

ID=50434378

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16101519.2A HK1213693A1 (zh) 2012-10-01 2016-02-11 硅太陽能電池的聯合腐蝕與鈍化

Country Status (3)

Country Link
EP (1) EP2904634B1 (zh)
HK (1) HK1213693A1 (zh)
WO (1) WO2014053484A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107968130B (zh) * 2017-11-27 2019-05-10 乐山新天源太阳能科技有限公司 硅片清洗制绒工艺
CN107968062B (zh) * 2017-11-27 2019-09-13 乐山新天源太阳能科技有限公司 硅片清洗制绒装置
DE102019102492A1 (de) * 2019-01-31 2020-08-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Bearbeitung von Wafern

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020111011A1 (en) * 2001-02-15 2002-08-15 King-Lung Wu Method for forming a contact plug without a dimple surface
WO2010105703A1 (en) * 2009-03-17 2010-09-23 Interuniversitair Microelektronica Centrum Vzw (Imec) Method for plasma texturing
JP6012597B2 (ja) 2010-05-11 2016-10-25 ウルトラ ハイ バキューム ソリューションズ リミテッド ティー/エー ナインズ エンジニアリング 光起電力電池素子のためのシリコンウエハの表面テクスチャ修飾を制御する方法および装置
CN101880914B (zh) * 2010-05-25 2012-09-12 中国科学院微电子研究所 利用等离子体浸没离子注入制备黑硅的方法

Also Published As

Publication number Publication date
EP2904634B1 (en) 2020-04-08
EP2904634A1 (en) 2015-08-12
WO2014053484A1 (en) 2014-04-10

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