HK1212301A1 - Multilayer film and shielded printed wiring board - Google Patents

Multilayer film and shielded printed wiring board

Info

Publication number
HK1212301A1
HK1212301A1 HK16100297.2A HK16100297A HK1212301A1 HK 1212301 A1 HK1212301 A1 HK 1212301A1 HK 16100297 A HK16100297 A HK 16100297A HK 1212301 A1 HK1212301 A1 HK 1212301A1
Authority
HK
Hong Kong
Prior art keywords
wiring board
printed wiring
multilayer film
shielded printed
shielded
Prior art date
Application number
HK16100297.2A
Other languages
Chinese (zh)
Inventor
启彰 篠原
真次 芳野
Original Assignee
Tatsuta Densen Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Densen Kk filed Critical Tatsuta Densen Kk
Publication of HK1212301A1 publication Critical patent/HK1212301A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
HK16100297.2A 2012-11-19 2016-01-12 Multilayer film and shielded printed wiring board HK1212301A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012253166 2012-11-19
PCT/JP2013/081143 WO2014077406A1 (en) 2012-11-19 2013-11-19 Multilayer film and shielded printed wiring board

Publications (1)

Publication Number Publication Date
HK1212301A1 true HK1212301A1 (en) 2016-06-10

Family

ID=50731313

Family Applications (1)

Application Number Title Priority Date Filing Date
HK16100297.2A HK1212301A1 (en) 2012-11-19 2016-01-12 Multilayer film and shielded printed wiring board

Country Status (6)

Country Link
JP (1) JP6014680B2 (en)
KR (1) KR101949302B1 (en)
CN (1) CN104797420B (en)
HK (1) HK1212301A1 (en)
TW (1) TWI613956B (en)
WO (1) WO2014077406A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018056329A (en) * 2016-09-29 2018-04-05 信越ポリマー株式会社 Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film
KR102024608B1 (en) * 2017-01-11 2019-09-24 엘지전자 주식회사 Sensor
JP6345855B1 (en) * 2017-01-17 2018-06-20 太陽インキ製造株式会社 Photosensitive film laminate and cured product formed using the same
JP6863908B2 (en) * 2018-01-12 2021-04-21 タツタ電線株式会社 Electromagnetic wave shield film
JP6978994B2 (en) * 2018-02-20 2021-12-08 タツタ電線株式会社 Transfer film
JP6426865B1 (en) * 2018-02-20 2018-11-21 タツタ電線株式会社 Electromagnetic shielding film
US12032292B2 (en) * 2018-05-16 2024-07-09 Resonac Corporation Photosensitive film and method for forming permanent mask resist
CN110769667B (en) * 2018-07-27 2023-12-05 广州方邦电子股份有限公司 Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film
JP7256618B2 (en) * 2018-08-29 2023-04-12 タツタ電線株式会社 Electromagnetic wave shielding film with transfer film, method for producing electromagnetic wave shielding film with transfer film, and method for producing shield printed wiring board
TWI768213B (en) * 2018-11-08 2022-06-21 日商拓自達電線股份有限公司 Electromagnetic wave shielding film, method for producing electromagnetic wave shielding film, and method for producing shielded printed wiring board
JP7268446B2 (en) * 2019-03-29 2023-05-08 東洋インキＳｃホールディングス株式会社 Electromagnetic wave shielding sheet, electromagnetic wave shielding printed circuit board and electronic equipment

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11208193A (en) * 1998-01-26 1999-08-03 Dainippon Printing Co Ltd Transfer sheet
JP4524024B2 (en) 2000-06-26 2010-08-11 藤森工業株式会社 Release film
JP4099355B2 (en) * 2001-06-29 2008-06-11 積水化学工業株式会社 Sheet
JP2003211602A (en) * 2002-01-24 2003-07-29 Sumitomo Bakelite Co Ltd Release multilayered film and cover-lay molding method
JP4201548B2 (en) * 2002-07-08 2008-12-24 タツタ電線株式会社 SHIELD FILM, SHIELD FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR PRODUCING THEM
JP5223196B2 (en) * 2005-11-08 2013-06-26 東レ株式会社 Polyester laminated film and transfer foil
JP2007175885A (en) * 2005-12-27 2007-07-12 Asahi Kasei Chemicals Corp Mold release film
KR100803619B1 (en) * 2006-10-30 2008-02-19 도레이새한 주식회사 Polyester film for window embossing and manufacturing method thereof
JP5023765B2 (en) 2007-03-30 2012-09-12 住友ベークライト株式会社 Release film and circuit board manufacturing method
JP5139156B2 (en) * 2008-05-30 2013-02-06 タツタ電線株式会社 Electromagnetic shielding material and printed wiring board
JP2011088352A (en) * 2009-10-22 2011-05-06 Unitika Ltd Release film
KR101873071B1 (en) * 2010-03-12 2018-06-29 세키스이가가쿠 고교가부시키가이샤 Mold release film and method for manufacturing mold release film
JP5308465B2 (en) * 2011-01-28 2013-10-09 タツタ電線株式会社 Shield printed wiring board

Also Published As

Publication number Publication date
JPWO2014077406A1 (en) 2017-01-05
JP6014680B2 (en) 2016-10-25
TW201429379A (en) 2014-07-16
KR101949302B1 (en) 2019-02-18
CN104797420B (en) 2018-01-12
TWI613956B (en) 2018-02-01
CN104797420A (en) 2015-07-22
WO2014077406A1 (en) 2014-05-22
KR20150087353A (en) 2015-07-29

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