HK1207161A1 - Substrate treatment device and device manufacturing method - Google Patents
Substrate treatment device and device manufacturing methodInfo
- Publication number
- HK1207161A1 HK1207161A1 HK15107656.3A HK15107656A HK1207161A1 HK 1207161 A1 HK1207161 A1 HK 1207161A1 HK 15107656 A HK15107656 A HK 15107656A HK 1207161 A1 HK1207161 A1 HK 1207161A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- substrate treatment
- treatment device
- manufacturing
- device manufacturing
- substrate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/24—Optical objectives specially designed for the purposes specified below for reproducing or copying at short object distances
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70316—Details of optical elements, e.g. of Bragg reflectors, extreme ultraviolet [EUV] multilayer or bilayer mirrors or diffractive optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Public Health (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Lenses (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Microscoopes, Condenser (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012157811 | 2012-07-13 | ||
JP2012157810 | 2012-07-13 | ||
PCT/JP2013/058704 WO2014010274A1 (en) | 2012-07-13 | 2013-03-26 | Substrate treatment device and device manufacturing method |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1207161A1 true HK1207161A1 (en) | 2016-01-22 |
Family
ID=49915752
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15107656.3A HK1207161A1 (en) | 2012-07-13 | 2015-08-08 | Substrate treatment device and device manufacturing method |
HK16109756.7A HK1221778A1 (en) | 2012-07-13 | 2015-08-08 | Exposure device and exposure method |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16109756.7A HK1221778A1 (en) | 2012-07-13 | 2015-08-08 | Exposure device and exposure method |
Country Status (5)
Country | Link |
---|---|
JP (6) | JP6137182B2 (en) |
KR (4) | KR101880792B1 (en) |
CN (4) | CN107229190B (en) |
HK (2) | HK1207161A1 (en) |
WO (1) | WO2014010274A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101880792B1 (en) * | 2012-07-13 | 2018-07-20 | 가부시키가이샤 니콘 | Substrate treatment device and device manufacturing method |
CN103984209B (en) * | 2014-04-04 | 2016-08-17 | 中国科学院上海光学精密机械研究所 | Refraction-reflection lithographic illumination relay lens group |
KR102075755B1 (en) * | 2017-06-19 | 2020-02-10 | 에스케이텔레콤 주식회사 | Illumination optical system for projector and method for constructing same |
JP7145620B2 (en) * | 2018-02-27 | 2022-10-03 | 株式会社オーク製作所 | projection exposure equipment |
KR102439935B1 (en) * | 2018-02-27 | 2022-09-02 | 가부시키가이샤 오크세이사쿠쇼 | Projection exposure apparatus |
CN114070971A (en) * | 2020-07-27 | 2022-02-18 | 奥林巴斯株式会社 | Observation device, light deflection unit, and image forming method |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6018383A (en) * | 1997-08-20 | 2000-01-25 | Anvik Corporation | Very large area patterning system for flexible substrates |
JP2001085314A (en) * | 1999-09-13 | 2001-03-30 | Nikon Corp | Exposure method and aligner for exposure and method for manufacturing device |
JP2004061584A (en) * | 2002-07-25 | 2004-02-26 | Fuji Photo Film Co Ltd | Method for making planographic printing plate |
JP2003295062A (en) * | 2003-03-10 | 2003-10-15 | Nikon Corp | Catadioptic imaging optical system |
CN101576717B (en) * | 2003-07-09 | 2013-03-27 | 株式会社尼康 | Exposure apparatus, and device fabricating method |
KR100550560B1 (en) * | 2003-12-16 | 2006-02-10 | 전자부품연구원 | Pattern manufacturing device and manufacture method for the same |
US7102733B2 (en) * | 2004-08-13 | 2006-09-05 | Asml Holding N.V. | System and method to compensate for static and dynamic misalignments and deformations in a maskless lithography tool |
JP2006098719A (en) * | 2004-09-29 | 2006-04-13 | Fuji Photo Film Co Ltd | Exposure apparatus |
JP4893310B2 (en) * | 2004-10-26 | 2012-03-07 | 株式会社ニコン | Optical apparatus, lens barrel, exposure apparatus, and device manufacturing method |
JP4251158B2 (en) * | 2005-06-24 | 2009-04-08 | パナソニック電工株式会社 | Charger and electric tool set using the same |
JP2007227438A (en) * | 2006-02-21 | 2007-09-06 | Nikon Corp | Exposure apparatus and exposure method, and mask for light exposure |
US7936445B2 (en) * | 2006-06-19 | 2011-05-03 | Asml Netherlands B.V. | Altering pattern data based on measured optical element characteristics |
TWI457723B (en) * | 2006-09-08 | 2014-10-21 | 尼康股份有限公司 | A mask, an exposure device, and an element manufacturing method |
JP5181451B2 (en) | 2006-09-20 | 2013-04-10 | 株式会社ニコン | Mask, exposure apparatus, exposure method, and device manufacturing method |
KR101506357B1 (en) | 2007-04-13 | 2015-03-26 | 가부시키가이샤 니콘 | Display element manufacturing method, display element manufacturing apparatus, sheet substrate for manufacturing display element, and application unit |
JP5272348B2 (en) * | 2007-08-14 | 2013-08-28 | 株式会社ニコン | Wafer bonding equipment |
NL1036558A1 (en) * | 2008-03-25 | 2009-09-28 | Asml Netherlands Bv | Method and lithographic apparatus for acquiring height data related to a substrate surface. |
JP5282895B2 (en) * | 2009-03-06 | 2013-09-04 | 株式会社ニコン | Exposure apparatus, exposure method, and device manufacturing method |
US8264666B2 (en) * | 2009-03-13 | 2012-09-11 | Nikon Corporation | Exposure apparatus, exposure method, and method of manufacturing device |
JP2011221536A (en) * | 2010-04-13 | 2011-11-04 | Nikon Corp | Mask moving device, exposure device, substrate processor and device manufacturing method |
JP5724564B2 (en) * | 2010-04-13 | 2015-05-27 | 株式会社ニコン | Mask case, mask unit, exposure apparatus, substrate processing apparatus, and device manufacturing method |
KR101961605B1 (en) * | 2011-12-20 | 2019-03-22 | 가부시키가이샤 니콘 | Substrate processing device, device manufacturing system and device manufacturing method |
KR101880792B1 (en) * | 2012-07-13 | 2018-07-20 | 가부시키가이샤 니콘 | Substrate treatment device and device manufacturing method |
-
2013
- 2013-03-26 KR KR1020157000057A patent/KR101880792B1/en active IP Right Grant
- 2013-03-26 CN CN201710459660.XA patent/CN107229190B/en active Active
- 2013-03-26 KR KR1020197022337A patent/KR102096891B1/en active IP Right Grant
- 2013-03-26 CN CN201710459661.4A patent/CN107272348B/en active Active
- 2013-03-26 CN CN201610149660.5A patent/CN105652609B/en active Active
- 2013-03-26 CN CN201380036561.0A patent/CN104428715B/en active Active
- 2013-03-26 JP JP2014524665A patent/JP6137182B2/en active Active
- 2013-03-26 KR KR1020187031201A patent/KR102007616B1/en active IP Right Grant
- 2013-03-26 KR KR1020177033406A patent/KR101914895B1/en active IP Right Grant
- 2013-03-26 WO PCT/JP2013/058704 patent/WO2014010274A1/en active Application Filing
-
2015
- 2015-08-08 HK HK15107656.3A patent/HK1207161A1/en not_active IP Right Cessation
- 2015-08-08 HK HK16109756.7A patent/HK1221778A1/en not_active IP Right Cessation
-
2016
- 2016-02-02 JP JP2016018115A patent/JP6128240B2/en active Active
- 2016-02-04 JP JP2016019845A patent/JP6137356B2/en active Active
- 2016-11-21 JP JP2016225886A patent/JP6245342B2/en active Active
-
2017
- 2017-01-24 JP JP2017010191A patent/JP6350687B2/en active Active
-
2018
- 2018-05-29 JP JP2018102172A patent/JP6519694B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20150035991A (en) | 2015-04-07 |
CN104428715B (en) | 2017-06-30 |
JP2016085475A (en) | 2016-05-19 |
JP2018136577A (en) | 2018-08-30 |
KR102096891B1 (en) | 2020-04-03 |
CN107272348A (en) | 2017-10-20 |
WO2014010274A1 (en) | 2014-01-16 |
HK1221778A1 (en) | 2017-06-09 |
JP6245342B2 (en) | 2017-12-13 |
JP2016122202A (en) | 2016-07-07 |
JPWO2014010274A1 (en) | 2016-06-20 |
KR102007616B1 (en) | 2019-08-05 |
CN107272348B (en) | 2020-04-07 |
JP6137182B2 (en) | 2017-05-31 |
KR20190091574A (en) | 2019-08-06 |
KR101880792B1 (en) | 2018-07-20 |
CN107229190A (en) | 2017-10-03 |
JP6519694B2 (en) | 2019-05-29 |
CN105652609A (en) | 2016-06-08 |
JP6128240B2 (en) | 2017-05-17 |
KR101914895B1 (en) | 2018-11-02 |
JP6137356B2 (en) | 2017-05-31 |
JP6350687B2 (en) | 2018-07-04 |
KR20180120800A (en) | 2018-11-06 |
CN107229190B (en) | 2020-03-20 |
JP2017037347A (en) | 2017-02-16 |
CN104428715A (en) | 2015-03-18 |
CN105652609B (en) | 2018-12-04 |
KR20170130628A (en) | 2017-11-28 |
JP2017068289A (en) | 2017-04-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20220328 |