HK1206682A1 - 激光加工機 - Google Patents

激光加工機

Info

Publication number
HK1206682A1
HK1206682A1 HK15107414.6A HK15107414A HK1206682A1 HK 1206682 A1 HK1206682 A1 HK 1206682A1 HK 15107414 A HK15107414 A HK 15107414A HK 1206682 A1 HK1206682 A1 HK 1206682A1
Authority
HK
Hong Kong
Prior art keywords
laser processing
processing machine
laser
machine
processing
Prior art date
Application number
HK15107414.6A
Other languages
English (en)
Inventor
Junichi Matsumoto
Original Assignee
Kataoka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kataoka Corp filed Critical Kataoka Corp
Publication of HK1206682A1 publication Critical patent/HK1206682A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
HK15107414.6A 2013-11-12 2015-08-03 激光加工機 HK1206682A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013234379A JP5728065B2 (ja) 2013-11-12 2013-11-12 レーザ加工機

Publications (1)

Publication Number Publication Date
HK1206682A1 true HK1206682A1 (zh) 2016-01-15

Family

ID=53196075

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15107414.6A HK1206682A1 (zh) 2013-11-12 2015-08-03 激光加工機

Country Status (5)

Country Link
JP (1) JP5728065B2 (zh)
KR (1) KR101622473B1 (zh)
CN (1) CN104625396B (zh)
HK (1) HK1206682A1 (zh)
TW (1) TWI556895B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017113788A (ja) * 2015-12-24 2017-06-29 株式会社リコー 光加工装置
JP2018013342A (ja) * 2016-07-19 2018-01-25 株式会社ディスコ 検査方法
KR20180031964A (ko) * 2016-09-21 2018-03-29 레이저발 차이나 코., 엘티디 레이저 가공 장치 및 이를 이용한 레이저 가공 방법
KR102330173B1 (ko) 2019-03-29 2021-11-26 엘케이제작소 주식회사 Cnc 레이저 절단기용 얼라이먼트 조절기
CN110406268B (zh) * 2019-07-15 2021-04-02 中国船舶重工集团公司第七一六研究所 一种基于视觉识别的全自动法兰打标机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005081392A (ja) * 2003-09-09 2005-03-31 Fuji Electric Holdings Co Ltd レーザ加工方法およびレーザ加工装置
JP4755839B2 (ja) * 2005-03-23 2011-08-24 株式会社ディスコ レーザー加工装置
JP2008229716A (ja) * 2007-03-23 2008-10-02 Toray Eng Co Ltd レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板
JP2009099939A (ja) * 2007-09-25 2009-05-07 Dainippon Screen Mfg Co Ltd アライメントマーク形成装置
JP2009241095A (ja) * 2008-03-31 2009-10-22 Laser Solutions Co Ltd エネルギービーム加工装置及びエネルギービーム加工物製造方法
JP4958020B2 (ja) * 2009-03-31 2012-06-20 大日本印刷株式会社 タッチパネルセンサ、タッチパネルセンサを作製するための積層体、および、タッチパネルセンサの製造方法
JP5377086B2 (ja) * 2009-06-04 2013-12-25 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
KR101261266B1 (ko) * 2010-11-03 2013-05-09 유병소 레이저 가공 장치 및 이를 이용한 레이저 가공 방법

Also Published As

Publication number Publication date
CN104625396B (zh) 2016-09-21
CN104625396A (zh) 2015-05-20
JP2015093300A (ja) 2015-05-18
TW201519982A (zh) 2015-06-01
TWI556895B (zh) 2016-11-11
KR20150054642A (ko) 2015-05-20
KR101622473B1 (ko) 2016-05-18
JP5728065B2 (ja) 2015-06-03

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