HK1202132A1 - Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive - Google Patents
Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesiveInfo
- Publication number
- HK1202132A1 HK1202132A1 HK15102693.9A HK15102693A HK1202132A1 HK 1202132 A1 HK1202132 A1 HK 1202132A1 HK 15102693 A HK15102693 A HK 15102693A HK 1202132 A1 HK1202132 A1 HK 1202132A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electroconductive adhesive
- anisotropic electroconductive
- connected structure
- anisotropic
- manufacturing connected
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/28—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the polymer type
- C08G2650/56—Polyhydroxyethers, e.g. phenoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2409/00—Presence of diene rubber
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Combinations Of Printed Boards (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008254323 | 2008-09-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1202132A1 true HK1202132A1 (en) | 2015-09-18 |
Family
ID=42073514
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11111342.9A HK1156963A1 (en) | 2008-09-30 | 2011-10-20 | Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive |
HK15102693.9A HK1202132A1 (en) | 2008-09-30 | 2015-03-17 | Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11111342.9A HK1156963A1 (en) | 2008-09-30 | 2011-10-20 | Anisotropic electroconductive adhesive and method for manufacturing connected structure using the anisotropic electroconductive adhesive |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP5728803B2 (en) |
KR (1) | KR101683312B1 (en) |
CN (2) | CN104059547B (en) |
HK (2) | HK1156963A1 (en) |
TW (2) | TWI548719B (en) |
WO (1) | WO2010038753A1 (en) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5840418B2 (en) * | 2011-08-23 | 2016-01-06 | デクセリアルズ株式会社 | Conductive adhesive and solar cell module |
AT511655B1 (en) * | 2011-10-20 | 2013-02-15 | Prelonic Technologies Gmbh | METHOD FOR BONDING CIRCUIT ELEMENTS AND ADHESIVES |
KR101355857B1 (en) * | 2011-12-16 | 2014-01-27 | 제일모직주식회사 | Anisotropic conductive film composition, the anisotropic conductive film thereof and semiconductor device |
KR101355854B1 (en) * | 2011-12-16 | 2014-01-29 | 제일모직주식회사 | Anisotropic conductive film |
KR101355856B1 (en) * | 2011-12-26 | 2014-01-27 | 제일모직주식회사 | A composition for use of an anisotropic conductive film and anisotropic conductive film using the same |
JP5934528B2 (en) * | 2012-03-12 | 2016-06-15 | デクセリアルズ株式会社 | CIRCUIT CONNECTION MATERIAL, AND METHOD FOR MANUFACTURING MOUNTING BODY USING THE SAME |
JP6029922B2 (en) * | 2012-10-05 | 2016-11-24 | デクセリアルズ株式会社 | CIRCUIT CONNECTION MATERIAL, ITS MANUFACTURING METHOD, AND MOUNTING BODY MANUFACTURING METHOD USING THE SAME |
JP6330346B2 (en) * | 2014-01-29 | 2018-05-30 | 日立化成株式会社 | Adhesive composition, electronic member using adhesive composition, and method for manufacturing semiconductor device |
JP6337630B2 (en) * | 2014-06-12 | 2018-06-06 | 日立化成株式会社 | Circuit connection material and circuit connection structure |
JP2016178225A (en) * | 2015-03-20 | 2016-10-06 | デクセリアルズ株式会社 | Anisotropic conductive connection structure, anisotropic conductive connection method, and anisotropic conductive adhesive |
JP7386773B2 (en) * | 2015-03-20 | 2023-11-27 | デクセリアルズ株式会社 | Anisotropic conductive adhesive, connected structure, anisotropic conductive connection method, and method for manufacturing connected structure |
JP6750197B2 (en) * | 2015-07-13 | 2020-09-02 | デクセリアルズ株式会社 | Anisotropic conductive film and connection structure |
WO2018055890A1 (en) | 2016-09-20 | 2018-03-29 | 大阪有機化学工業株式会社 | (meth)acrylic conductive material |
CN109389903B (en) * | 2017-08-04 | 2021-01-29 | 京东方科技集团股份有限公司 | Flexible substrate, processing method thereof and processing system thereof |
TWI786193B (en) * | 2017-12-19 | 2022-12-11 | 日商琳得科股份有限公司 | Adhesive for repetitive bending device, adhesive sheet, repetitive bending laminated member, and repetitive bending device |
JP7032367B2 (en) * | 2019-10-25 | 2022-03-08 | デクセリアルズ株式会社 | Manufacturing method of connecting body, anisotropic conductive bonding material, and connecting body |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07169792A (en) * | 1993-12-14 | 1995-07-04 | Asahi Chem Ind Co Ltd | Film carrier for semiconductor integrated circuit |
JP3248149B2 (en) * | 1995-11-21 | 2002-01-21 | シャープ株式会社 | Resin-sealed semiconductor device and method of manufacturing the same |
JP3477367B2 (en) * | 1998-05-12 | 2003-12-10 | ソニーケミカル株式会社 | Anisotropic conductive adhesive film |
JP3507705B2 (en) * | 1998-07-28 | 2004-03-15 | ソニーケミカル株式会社 | Insulating adhesive film |
JP3714147B2 (en) * | 1999-10-22 | 2005-11-09 | ソニーケミカル株式会社 | Low temperature curing anisotropic conductive connecting material |
KR100925361B1 (en) * | 1999-10-22 | 2009-11-09 | 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 | Low temperature-curable connecting material for anisotropically electroconductive connection |
JP2002184487A (en) * | 2000-12-15 | 2002-06-28 | Sony Chem Corp | Anisotropic conductive adhesive |
TW200718769A (en) * | 2002-11-29 | 2007-05-16 | Hitachi Chemical Co Ltd | Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device |
JP4720073B2 (en) * | 2003-08-07 | 2011-07-13 | 日立化成工業株式会社 | Adhesive composition, adhesive composition for circuit connection, connector and semiconductor device |
JP2005264109A (en) * | 2004-03-22 | 2005-09-29 | Hitachi Chem Co Ltd | Film-shaped adhesive and manufacturing method of semiconductor device using the same |
JP5191627B2 (en) * | 2004-03-22 | 2013-05-08 | 日立化成株式会社 | Film adhesive and method for manufacturing semiconductor device using the same |
JP2005320455A (en) * | 2004-05-10 | 2005-11-17 | Hitachi Chem Co Ltd | Adhesive composition, material for connecting circuit, connecting structure of circuit member and semiconductor device |
CN101831247B (en) * | 2004-06-09 | 2012-06-06 | 日立化成工业株式会社 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
JP4732894B2 (en) * | 2004-12-28 | 2011-07-27 | セイコーインスツル株式会社 | Bonding method and bonding apparatus |
WO2008065997A1 (en) * | 2006-12-01 | 2008-06-05 | Hitachi Chemical Company, Ltd. | Adhesive and connection structure using the same |
JP5013067B2 (en) * | 2007-01-22 | 2012-08-29 | ソニーケミカル&インフォメーションデバイス株式会社 | Anisotropic conductive film |
JP2009074020A (en) * | 2007-03-06 | 2009-04-09 | Tokai Rubber Ind Ltd | Anisotropic conductive film |
-
2009
- 2009-09-29 CN CN201410328402.4A patent/CN104059547B/en active Active
- 2009-09-29 KR KR1020117007216A patent/KR101683312B1/en active IP Right Grant
- 2009-09-29 JP JP2009224181A patent/JP5728803B2/en active Active
- 2009-09-29 CN CN200980139585.2A patent/CN102171306B/en active Active
- 2009-09-29 WO PCT/JP2009/066987 patent/WO2010038753A1/en active Application Filing
- 2009-09-30 TW TW102137474A patent/TWI548719B/en not_active IP Right Cessation
- 2009-09-30 TW TW098133142A patent/TWI541318B/en not_active IP Right Cessation
-
2011
- 2011-10-20 HK HK11111342.9A patent/HK1156963A1/en unknown
-
2014
- 2014-11-12 JP JP2014229893A patent/JP5975088B2/en active Active
-
2015
- 2015-03-17 HK HK15102693.9A patent/HK1202132A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2010038753A1 (en) | 2010-04-08 |
CN104059547B (en) | 2016-08-24 |
CN102171306B (en) | 2014-08-13 |
HK1156963A1 (en) | 2012-06-22 |
TW201012894A (en) | 2010-04-01 |
JP2015083681A (en) | 2015-04-30 |
KR20110063500A (en) | 2011-06-10 |
TWI548719B (en) | 2016-09-11 |
JP5975088B2 (en) | 2016-08-23 |
CN102171306A (en) | 2011-08-31 |
TW201406921A (en) | 2014-02-16 |
JP2010106261A (en) | 2010-05-13 |
CN104059547A (en) | 2014-09-24 |
TWI541318B (en) | 2016-07-11 |
KR101683312B1 (en) | 2016-12-06 |
JP5728803B2 (en) | 2015-06-03 |
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