HK1198152A1 - 接合構件製造方法 - Google Patents
接合構件製造方法Info
- Publication number
- HK1198152A1 HK1198152A1 HK14111677.1A HK14111677A HK1198152A1 HK 1198152 A1 HK1198152 A1 HK 1198152A1 HK 14111677 A HK14111677 A HK 14111677A HK 1198152 A1 HK1198152 A1 HK 1198152A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- bonded member
- manufacturing bonded
- manufacturing
- bonded
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Optical Record Carriers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012268246A JP5393869B1 (ja) | 2012-12-07 | 2012-12-07 | 接合部材製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1198152A1 true HK1198152A1 (zh) | 2015-03-13 |
Family
ID=50112277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK14111677.1A HK1198152A1 (zh) | 2012-12-07 | 2014-11-19 | 接合構件製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140158291A1 (zh) |
JP (1) | JP5393869B1 (zh) |
CN (1) | CN103862816B (zh) |
HK (1) | HK1198152A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101591797B1 (ko) * | 2014-06-16 | 2016-02-04 | 안성룡 | 전기장을 이용한 패널 합착장치 |
JP6602703B2 (ja) * | 2016-03-16 | 2019-11-06 | 株式会社ディスコ | 保護部材形成装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5759332A (en) * | 1995-05-22 | 1998-06-02 | Pioneer Electronic Corporation | Process of reproducing optical discs and optical discs produced by the same |
JP3684775B2 (ja) * | 1997-07-23 | 2005-08-17 | ソニー株式会社 | 光学記録媒体の製造方法及びその製造装置 |
TW459225B (en) * | 1999-02-01 | 2001-10-11 | Origin Electric | Bonding system and method |
US20080216952A1 (en) * | 2007-03-06 | 2008-09-11 | Cheng Uei Precision Industry Co., Ltd. | Adhesive Method Of Optical Components |
CN101816026A (zh) * | 2007-10-22 | 2010-08-25 | 夏普株式会社 | 显示装置及其制造方法 |
JP5460418B2 (ja) * | 2010-03-29 | 2014-04-02 | オリジン電気株式会社 | 接合部材の製造方法及び接合部材製造装置 |
JP5558993B2 (ja) * | 2010-09-29 | 2014-07-23 | 芝浦メカトロニクス株式会社 | 接着剤供給装置及び接着剤供給方法 |
US8608896B2 (en) * | 2011-09-13 | 2013-12-17 | Apple Inc. | Liquid adhesive lamination for precision adhesive control |
-
2012
- 2012-12-07 JP JP2012268246A patent/JP5393869B1/ja active Active
-
2013
- 2013-11-15 US US14/081,698 patent/US20140158291A1/en not_active Abandoned
- 2013-12-04 CN CN201310646376.5A patent/CN103862816B/zh active Active
-
2014
- 2014-11-19 HK HK14111677.1A patent/HK1198152A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN103862816B (zh) | 2016-03-16 |
CN103862816A (zh) | 2014-06-18 |
JP2014114348A (ja) | 2014-06-26 |
US20140158291A1 (en) | 2014-06-12 |
JP5393869B1 (ja) | 2014-01-22 |
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