HK1177332A1 - Anisotropic conductive film and method of production the same, connection method between electronic components, and connection structure - Google Patents

Anisotropic conductive film and method of production the same, connection method between electronic components, and connection structure

Info

Publication number
HK1177332A1
HK1177332A1 HK13104860.4A HK13104860A HK1177332A1 HK 1177332 A1 HK1177332 A1 HK 1177332A1 HK 13104860 A HK13104860 A HK 13104860A HK 1177332 A1 HK1177332 A1 HK 1177332A1
Authority
HK
Hong Kong
Prior art keywords
connection
production
conductive film
electronic components
same
Prior art date
Application number
HK13104860.4A
Other languages
Chinese (zh)
Inventor
小西美佐夫
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of HK1177332A1 publication Critical patent/HK1177332A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24—Electrically-conducting paints
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
HK13104860.4A 2010-11-08 2013-04-22 Anisotropic conductive film and method of production the same, connection method between electronic components, and connection structure HK1177332A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010250143A JP5318840B2 (en) 2010-11-08 2010-11-08 Anisotropic conductive film, method for manufacturing anisotropic conductive film, connection method between electronic members, and connection structure
PCT/JP2011/075688 WO2012063804A1 (en) 2010-11-08 2011-11-08 Anisotropic conductive film, production method for anisotropic conductive film, connection method between electronic components, and connection structure

Publications (1)

Publication Number Publication Date
HK1177332A1 true HK1177332A1 (en) 2013-08-16

Family

ID=43635692

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13104860.4A HK1177332A1 (en) 2010-11-08 2013-04-22 Anisotropic conductive film and method of production the same, connection method between electronic components, and connection structure

Country Status (6)

Country Link
JP (1) JP5318840B2 (en)
KR (1) KR20130124155A (en)
CN (1) CN102906941B (en)
HK (1) HK1177332A1 (en)
TW (1) TWI494956B (en)
WO (1) WO2012063804A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6119718B2 (en) * 2013-11-19 2017-04-26 デクセリアルズ株式会社 Anisotropic conductive film and connection structure
JP2015135878A (en) * 2014-01-16 2015-07-27 デクセリアルズ株式会社 Connection body, method for manufacturing connection body, connection method and anisotropic conductive adhesive
EP3306621B1 (en) * 2015-08-20 2020-01-29 Murata Manufacturing Co., Ltd. Elastic conductor

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128206A (en) * 1979-03-27 1980-10-03 Toray Industries Method of fabricating anisotropic conductive rubber sheet
JPH0334282U (en) * 1989-08-11 1991-04-04
JP3034282U (en) * 1996-08-01 1997-02-14 信越ポリマー株式会社 Heat seal connector
WO1998007216A1 (en) * 1996-08-08 1998-02-19 Nitto Denko Corporation Anisotropic conductive film and method for manufacturing the same
JP3208658B2 (en) * 1997-03-27 2001-09-17 株式会社アドバンスト・ディスプレイ Manufacturing method of electro-optical element
JP2003200279A (en) * 2001-10-24 2003-07-15 Seiko Epson Corp Method and apparatus for cutting electrical wiring on substrate, and method and apparatus for manufacturing electronic device
KR100953011B1 (en) * 2002-07-30 2010-04-14 히다치 가세고교 가부시끼가이샤 Method of producing adhesive material tape
JP4333140B2 (en) * 2003-01-08 2009-09-16 日立化成工業株式会社 Method for producing adhesive tape
CN101512840A (en) * 2006-08-29 2009-08-19 日立化成工业株式会社 Anisotropic conductive tape and method of manufacturing it, connected structure and method of connecting circuit member by use of the tape

Also Published As

Publication number Publication date
CN102906941B (en) 2015-11-25
CN102906941A (en) 2013-01-30
WO2012063804A1 (en) 2012-05-18
KR20130124155A (en) 2013-11-13
TW201236029A (en) 2012-09-01
JP5318840B2 (en) 2013-10-16
TWI494956B (en) 2015-08-01
JP2011026619A (en) 2011-02-10

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