HK1174185A1 - 製造包含複數層材料之殼體的方法及裝置 - Google Patents

製造包含複數層材料之殼體的方法及裝置

Info

Publication number
HK1174185A1
HK1174185A1 HK13101410.5A HK13101410A HK1174185A1 HK 1174185 A1 HK1174185 A1 HK 1174185A1 HK 13101410 A HK13101410 A HK 13101410A HK 1174185 A1 HK1174185 A1 HK 1174185A1
Authority
HK
Hong Kong
Prior art keywords
material layers
including multiple
multiple material
cover including
manufacturing cover
Prior art date
Application number
HK13101410.5A
Other languages
English (en)
Inventor
廖志雄
Original Assignee
昶聯金屬材料應用製品 廣州 有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昶聯金屬材料應用製品 廣州 有限公司 filed Critical 昶聯金屬材料應用製品 廣州 有限公司
Publication of HK1174185A1 publication Critical patent/HK1174185A1/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
HK13101410.5A 2011-05-18 2013-02-01 製造包含複數層材料之殼體的方法及裝置 HK1174185A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201110145950.XA CN102791089B (zh) 2011-05-18 2011-05-18 制造包含复数层材料之壳体的方法及装置

Publications (1)

Publication Number Publication Date
HK1174185A1 true HK1174185A1 (zh) 2013-05-31

Family

ID=47156359

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13101410.5A HK1174185A1 (zh) 2011-05-18 2013-02-01 製造包含複數層材料之殼體的方法及裝置

Country Status (4)

Country Link
KR (1) KR101343539B1 (zh)
CN (1) CN102791089B (zh)
HK (1) HK1174185A1 (zh)
TW (1) TWI438073B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI565581B (zh) * 2013-07-17 2017-01-11 Xin Li Composite material of tin and plastic and its making method
CN103482014B (zh) * 2013-09-13 2015-10-21 中国船舶重工集团公司第七一〇研究所 一种复合材料耐压壳体及其成型方法
WO2015076479A1 (ko) * 2013-11-21 2015-05-28 천진엠앤씨전자유한공사 이동통신단말기용 브라켓 및 그 제조방법
CN104320931A (zh) * 2014-11-03 2015-01-28 联想(北京)有限公司 电子设备及其壳体的制备方法
CN107031138B (zh) * 2017-04-01 2019-10-11 广东新秀新材料股份有限公司 抗冲击复合材料外壳及其制备方法
CN109803508B (zh) * 2017-11-16 2021-04-20 比亚迪股份有限公司 一种电子设备的壳体及其制备方法和电子设备
CN112291405B (zh) * 2020-11-03 2024-02-23 深圳三羊塑胶五金有限公司 一种5g信号防衰减手机保护套及其制造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100549211B1 (ko) * 2005-10-12 2006-02-03 주식회사 아이몰드텍 전자제품 케이스 구조체 및 이의 제조방법
CN101005738A (zh) * 2006-01-21 2007-07-25 鸿富锦精密工业（深圳）有限公司 外壳及其制造方法
JP2008164799A (ja) * 2006-12-27 2008-07-17 Sony Corp 電子機器の筐体及びその筐体を備えた電子機器
US7684178B2 (en) * 2007-07-04 2010-03-23 Shenzhen Futaihong Precision Industry Co., Ltd. Housing for electronic devices, electronic device using the housing and method for making the housing
KR100935954B1 (ko) * 2009-04-23 2010-01-12 삼성전기주식회사 전자장치 케이스, 그 제조방법 및 제조금형, 이동통신 단말기

Also Published As

Publication number Publication date
KR20120129744A (ko) 2012-11-28
KR101343539B1 (ko) 2013-12-19
TW201247390A (en) 2012-12-01
TWI438073B (zh) 2014-05-21
CN102791089B (zh) 2015-05-13
CN102791089A (zh) 2012-11-21

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