HK1174185A1 - 製造包含複數層材料之殼體的方法及裝置 - Google Patents
製造包含複數層材料之殼體的方法及裝置Info
- Publication number
- HK1174185A1 HK1174185A1 HK13101410.5A HK13101410A HK1174185A1 HK 1174185 A1 HK1174185 A1 HK 1174185A1 HK 13101410 A HK13101410 A HK 13101410A HK 1174185 A1 HK1174185 A1 HK 1174185A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- material layers
- including multiple
- multiple material
- cover including
- manufacturing cover
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/03—Covers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
Landscapes
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Laminated Bodies (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110145950.XA CN102791089B (zh) | 2011-05-18 | 2011-05-18 | 制造包含复数层材料之壳体的方法及装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1174185A1 true HK1174185A1 (zh) | 2013-05-31 |
Family
ID=47156359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK13101410.5A HK1174185A1 (zh) | 2011-05-18 | 2013-02-01 | 製造包含複數層材料之殼體的方法及裝置 |
Country Status (4)
Country | Link |
---|---|
KR (1) | KR101343539B1 (zh) |
CN (1) | CN102791089B (zh) |
HK (1) | HK1174185A1 (zh) |
TW (1) | TWI438073B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI565581B (zh) * | 2013-07-17 | 2017-01-11 | Xin Li | Composite material of tin and plastic and its making method |
CN103482014B (zh) * | 2013-09-13 | 2015-10-21 | 中国船舶重工集团公司第七一〇研究所 | 一种复合材料耐压壳体及其成型方法 |
WO2015076479A1 (ko) * | 2013-11-21 | 2015-05-28 | 천진엠앤씨전자유한공사 | 이동통신단말기용 브라켓 및 그 제조방법 |
CN104320931A (zh) * | 2014-11-03 | 2015-01-28 | 联想(北京)有限公司 | 电子设备及其壳体的制备方法 |
CN107031138B (zh) * | 2017-04-01 | 2019-10-11 | 广东新秀新材料股份有限公司 | 抗冲击复合材料外壳及其制备方法 |
CN109803508B (zh) * | 2017-11-16 | 2021-04-20 | 比亚迪股份有限公司 | 一种电子设备的壳体及其制备方法和电子设备 |
CN112291405B (zh) * | 2020-11-03 | 2024-02-23 | 深圳三羊塑胶五金有限公司 | 一种5g信号防衰减手机保护套及其制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100549211B1 (ko) * | 2005-10-12 | 2006-02-03 | 주식회사 아이몰드텍 | 전자제품 케이스 구조체 및 이의 제조방법 |
CN101005738A (zh) * | 2006-01-21 | 2007-07-25 | 鸿富锦精密工业(深圳)有限公司 | 外壳及其制造方法 |
JP2008164799A (ja) * | 2006-12-27 | 2008-07-17 | Sony Corp | 電子機器の筐体及びその筐体を備えた電子機器 |
US7684178B2 (en) * | 2007-07-04 | 2010-03-23 | Shenzhen Futaihong Precision Industry Co., Ltd. | Housing for electronic devices, electronic device using the housing and method for making the housing |
KR100935954B1 (ko) * | 2009-04-23 | 2010-01-12 | 삼성전기주식회사 | 전자장치 케이스, 그 제조방법 및 제조금형, 이동통신 단말기 |
-
2011
- 2011-05-18 CN CN201110145950.XA patent/CN102791089B/zh active Active
- 2011-07-08 TW TW100124340A patent/TWI438073B/zh active
- 2011-10-26 KR KR1020110110060A patent/KR101343539B1/ko active IP Right Grant
-
2013
- 2013-02-01 HK HK13101410.5A patent/HK1174185A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20120129744A (ko) | 2012-11-28 |
KR101343539B1 (ko) | 2013-12-19 |
TW201247390A (en) | 2012-12-01 |
TWI438073B (zh) | 2014-05-21 |
CN102791089B (zh) | 2015-05-13 |
CN102791089A (zh) | 2012-11-21 |
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