HK1169744A1 - 種集成電路封裝及其組裝方法 - Google Patents
種集成電路封裝及其組裝方法Info
- Publication number
- HK1169744A1 HK1169744A1 HK12110351.8A HK12110351A HK1169744A1 HK 1169744 A1 HK1169744 A1 HK 1169744A1 HK 12110351 A HK12110351 A HK 12110351A HK 1169744 A1 HK1169744 A1 HK 1169744A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- assembly
- integrated circuit
- assembly method
- circuit assembly
- integrated
- Prior art date
Links
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- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/071,799 US8367475B2 (en) | 2011-03-25 | 2011-03-25 | Chip scale package assembly in reconstitution panel process format |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1169744A1 true HK1169744A1 (zh) | 2013-02-01 |
Family
ID=46876665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12110351.8A HK1169744A1 (zh) | 2011-03-25 | 2012-10-18 | 種集成電路封裝及其組裝方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8367475B2 (zh) |
KR (1) | KR101402868B1 (zh) |
CN (1) | CN102709202B (zh) |
HK (1) | HK1169744A1 (zh) |
TW (1) | TWI541918B (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9620413B2 (en) | 2012-10-02 | 2017-04-11 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of using a standardized carrier in semiconductor packaging |
US9496195B2 (en) * | 2012-10-02 | 2016-11-15 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of depositing encapsulant along sides and surface edge of semiconductor die in embedded WLCSP |
US9704780B2 (en) | 2012-12-11 | 2017-07-11 | STATS ChipPAC, Pte. Ltd. | Semiconductor device and method of forming low profile fan-out package with vertical interconnection units |
US9245770B2 (en) | 2012-12-20 | 2016-01-26 | Stats Chippac, Ltd. | Semiconductor device and method of simultaneous molding and thermalcompression bonding |
US9287204B2 (en) | 2012-12-20 | 2016-03-15 | Stats Chippac, Ltd. | Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
US9240331B2 (en) | 2012-12-20 | 2016-01-19 | Stats Chippac, Ltd. | Semiconductor device and method of making bumpless flipchip interconnect structures |
US9721862B2 (en) | 2013-01-03 | 2017-08-01 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages |
US9704824B2 (en) | 2013-01-03 | 2017-07-11 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming embedded wafer level chip scale packages |
KR20150023202A (ko) * | 2013-08-23 | 2015-03-05 | 강경순 | 프로세스 모듈 및 그 제조 방법과, 프로세스 모듈을 이용한 기판 처리 방법 |
TWI658543B (zh) * | 2013-12-05 | 2019-05-01 | 新加坡商史達晶片有限公司 | 在半導體封裝中使用標準化載體的半導體裝置及方法 |
US9524942B2 (en) * | 2013-12-18 | 2016-12-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chip-on-substrate packaging on carrier |
US9704769B2 (en) | 2014-02-27 | 2017-07-11 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming encapsulated wafer level chip scale package (EWLCSP) |
US20150303170A1 (en) * | 2014-04-17 | 2015-10-22 | Amkor Technology, Inc. | Singulated unit substrate for a semicondcutor device |
KR101563909B1 (ko) | 2014-08-19 | 2015-10-28 | 앰코 테크놀로지 코리아 주식회사 | 패키지 온 패키지 제조 방법 |
US9972593B2 (en) | 2014-11-07 | 2018-05-15 | Mediatek Inc. | Semiconductor package |
US9443785B2 (en) * | 2014-12-19 | 2016-09-13 | Advanced Semiconductor Engineering, Inc. | Semiconductor package |
KR102335106B1 (ko) | 2015-06-19 | 2021-12-03 | 삼성전자 주식회사 | 발광 소자 패키지 및 그 제조 방법 |
JP2017054888A (ja) * | 2015-09-08 | 2017-03-16 | 株式会社ディスコ | ウエーハの加工方法 |
CN105329850B (zh) * | 2015-10-21 | 2017-03-08 | 美新半导体(无锡)有限公司 | 圆片级芯片尺寸封装的测试方法 |
KR101685849B1 (ko) * | 2015-11-04 | 2016-12-13 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 모듈 제조 방법 및 이를 이용한 반도체 패키지 모듈 |
US10535611B2 (en) | 2015-11-20 | 2020-01-14 | Apple Inc. | Substrate-less integrated components |
KR20170085833A (ko) * | 2016-01-15 | 2017-07-25 | 삼성전기주식회사 | 전자 부품 패키지 및 그 제조방법 |
JP7084702B2 (ja) * | 2016-09-02 | 2022-06-15 | アイデックス バイオメトリクス エーエスエー | 指紋センサに適したカバー部材を製造する方法 |
WO2018072183A1 (en) * | 2016-10-20 | 2018-04-26 | Texas Instruments Incorporated | Method and apparatus for detecting and removing defective integrated circuit packages |
US10304716B1 (en) * | 2017-12-20 | 2019-05-28 | Powertech Technology Inc. | Package structure and manufacturing method thereof |
CN110197793A (zh) * | 2018-02-24 | 2019-09-03 | 华为技术有限公司 | 一种芯片及封装方法 |
JP7189672B2 (ja) * | 2018-04-18 | 2022-12-14 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
US10593630B2 (en) * | 2018-05-11 | 2020-03-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor package and method for manufacturing the same |
WO2019222330A2 (en) * | 2018-05-17 | 2019-11-21 | Corning Incorporated | Singulated electronic substrates on a flexible or rigid carrier and related methods |
US10643957B2 (en) * | 2018-08-27 | 2020-05-05 | Nxp B.V. | Conformal dummy die |
US10755994B2 (en) | 2018-10-29 | 2020-08-25 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and semiconductor substrate |
CN109545694B (zh) * | 2018-11-13 | 2020-11-17 | 无锡中微高科电子有限公司 | 一种破损基板的模封方法 |
CN110444480A (zh) * | 2019-07-24 | 2019-11-12 | 浙江荷清柔性电子技术有限公司 | 制作柔性芯片的方法、柔性芯片 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5829128A (en) | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
US5983493A (en) | 1993-11-16 | 1999-11-16 | Formfactor, Inc. | Method of temporarily, then permanently, connecting to a semiconductor device |
US5832601A (en) | 1993-11-16 | 1998-11-10 | Form Factor, Inc. | Method of making temporary connections between electronic components |
US5897326A (en) | 1993-11-16 | 1999-04-27 | Eldridge; Benjamin N. | Method of exercising semiconductor devices |
US5878486A (en) | 1993-11-16 | 1999-03-09 | Formfactor, Inc. | Method of burning-in semiconductor devices |
US5806181A (en) | 1993-11-16 | 1998-09-15 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US6741085B1 (en) | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US5852870A (en) | 1996-04-24 | 1998-12-29 | Amkor Technology, Inc. | Method of making grid array assembly |
US5859475A (en) | 1996-04-24 | 1999-01-12 | Amkor Technology, Inc. | Carrier strip and molded flex circuit ball grid array |
US6492203B1 (en) | 1997-04-30 | 2002-12-10 | Hitachi Chemical Company, Ltd. | Semiconductor device and method of fabrication thereof |
US6111324A (en) | 1998-02-05 | 2000-08-29 | Asat, Limited | Integrated carrier ring/stiffener and method for manufacturing a flexible integrated circuit package |
US6214640B1 (en) | 1999-02-10 | 2001-04-10 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages |
US6388335B1 (en) * | 1999-12-14 | 2002-05-14 | Atmel Corporation | Integrated circuit package formed at a wafer level |
US6593644B2 (en) * | 2001-04-19 | 2003-07-15 | International Business Machines Corporation | System of a package fabricated on a semiconductor or dielectric wafer with wiring on one face, vias extending through the wafer, and external connections on the opposing face |
US6903278B2 (en) * | 2001-06-29 | 2005-06-07 | Intel Corporation | Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate |
TW560018B (en) | 2001-10-30 | 2003-11-01 | Asia Pacific Microsystems Inc | A wafer level packaged structure and method for manufacturing the same |
US7023347B2 (en) | 2002-08-02 | 2006-04-04 | Symbol Technologies, Inc. | Method and system for forming a die frame and for transferring dies therewith |
US6903456B2 (en) * | 2003-10-08 | 2005-06-07 | Tong Hsing Electric Industries, Ltd. | Package carrier having multiple individual ceramic substrates |
US7358119B2 (en) | 2005-01-12 | 2008-04-15 | Asat Ltd. | Thin array plastic package without die attach pad and process for fabricating the same |
US7538438B2 (en) * | 2005-06-30 | 2009-05-26 | Sandisk Corporation | Substrate warpage control and continuous electrical enhancement |
US7807505B2 (en) * | 2005-08-30 | 2010-10-05 | Micron Technology, Inc. | Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods |
US7378733B1 (en) | 2006-08-29 | 2008-05-27 | Xilinx, Inc. | Composite flip-chip package with encased components and method of fabricating same |
US7985621B2 (en) * | 2006-08-31 | 2011-07-26 | Ati Technologies Ulc | Method and apparatus for making semiconductor packages |
US8193034B2 (en) * | 2006-11-10 | 2012-06-05 | Stats Chippac, Ltd. | Semiconductor device and method of forming vertical interconnect structure using stud bumps |
US7683380B2 (en) | 2007-06-25 | 2010-03-23 | Dicon Fiberoptics, Inc. | High light efficiency solid-state light emitting structure and methods to manufacturing the same |
US7923298B2 (en) * | 2007-09-07 | 2011-04-12 | Micron Technology, Inc. | Imager die package and methods of packaging an imager die on a temporary carrier |
US20090091025A1 (en) | 2007-10-04 | 2009-04-09 | Agency For Science, Technology And Research | Method for forming and releasing interconnects |
US8124447B2 (en) | 2009-04-10 | 2012-02-28 | Advanced Semiconductor Engineering, Inc. | Manufacturing method of advanced quad flat non-leaded package |
US8143097B2 (en) * | 2009-09-23 | 2012-03-27 | Stats Chippac, Ltd. | Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP |
US8569894B2 (en) | 2010-01-13 | 2013-10-29 | Advanced Semiconductor Engineering, Inc. | Semiconductor package with single sided substrate design and manufacturing methods thereof |
-
2011
- 2011-03-25 US US13/071,799 patent/US8367475B2/en active Active
-
2012
- 2012-03-23 KR KR1020120030128A patent/KR101402868B1/ko not_active IP Right Cessation
- 2012-03-26 TW TW101110350A patent/TWI541918B/zh not_active IP Right Cessation
- 2012-03-26 CN CN201210082855.4A patent/CN102709202B/zh active Active
- 2012-10-18 HK HK12110351.8A patent/HK1169744A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20120109410A (ko) | 2012-10-08 |
US8367475B2 (en) | 2013-02-05 |
TW201301415A (zh) | 2013-01-01 |
KR101402868B1 (ko) | 2014-06-03 |
CN102709202A (zh) | 2012-10-03 |
US20120241955A1 (en) | 2012-09-27 |
TWI541918B (zh) | 2016-07-11 |
CN102709202B (zh) | 2015-07-01 |
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