HK1155805A1 - Method for inspecting defects, and defect inspecting apparatus - Google Patents
Method for inspecting defects, and defect inspecting apparatusInfo
- Publication number
- HK1155805A1 HK1155805A1 HK11109907.0A HK11109907A HK1155805A1 HK 1155805 A1 HK1155805 A1 HK 1155805A1 HK 11109907 A HK11109907 A HK 11109907A HK 1155805 A1 HK1155805 A1 HK 1155805A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- inspecting
- defect
- defects
- inspecting apparatus
- inspecting defects
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N2021/4792—Polarisation of scatter light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8848—Polarisation of light
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
- G01N2021/8896—Circuits specially adapted for system specific signal conditioning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Optics & Photonics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008133809A JP5007979B2 (en) | 2008-05-22 | 2008-05-22 | Defect inspection method and defect inspection apparatus |
PCT/JP2009/059460 WO2009142305A1 (en) | 2008-05-22 | 2009-05-22 | Method for inspecting defects, and defect inspecting apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1155805A1 true HK1155805A1 (en) | 2012-05-25 |
Family
ID=41340231
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11109907.0A HK1155805A1 (en) | 2008-05-22 | 2011-09-20 | Method for inspecting defects, and defect inspecting apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US8599379B2 (en) |
EP (1) | EP2287594A4 (en) |
JP (1) | JP5007979B2 (en) |
KR (1) | KR101240860B1 (en) |
CN (1) | CN102037348B (en) |
HK (1) | HK1155805A1 (en) |
WO (1) | WO2009142305A1 (en) |
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Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62177447A (en) | 1986-01-31 | 1987-08-04 | Nippon Kokan Kk <Nkk> | Noncontact ultrasonic flaw detection method |
ZA891937B (en) | 1988-04-04 | 1990-11-28 | Ppg Industries Inc | Pigment grinding vehicles containing quaternary ammonium and ternary sulfonium groups |
JPH04118540A (en) * | 1990-09-10 | 1992-04-20 | Nippon Telegr & Teleph Corp <Ntt> | Defect detection method for optical parts and device therefor |
JPH04128664A (en) * | 1990-09-19 | 1992-04-30 | Nec Yamagata Ltd | Heating test device |
JPH0518889A (en) * | 1991-07-15 | 1993-01-26 | Mitsubishi Electric Corp | Method and device for inspecting foreign matter |
CN1087424A (en) * | 1992-09-29 | 1994-06-01 | 昆士兰大学 | Defective in the glass that detects |
JP2847458B2 (en) * | 1993-03-26 | 1999-01-20 | 三井金属鉱業株式会社 | Defect evaluation device |
JPH07318500A (en) * | 1994-05-23 | 1995-12-08 | Hitachi Ltd | Inspection device for vicinity of object surface |
WO1996028721A1 (en) * | 1995-03-10 | 1996-09-19 | Hitachi, Ltd. | Inspection method, inspection apparatus and method of production of semiconductor device using them |
JPH10293103A (en) | 1997-02-24 | 1998-11-04 | Toray Ind Inc | Method and equipment for optical measurement and optical measuring equipment for patterned substrate |
JP4332656B2 (en) | 1998-01-26 | 2009-09-16 | ラトックシステムエンジニアリング株式会社 | Defect inspection method and defect inspection apparatus |
JP3186695B2 (en) | 1998-05-11 | 2001-07-11 | 三井金属鉱業株式会社 | Device for detecting defects in semiconductors, etc. |
JP3267551B2 (en) | 1998-05-11 | 2002-03-18 | 三井金属鉱業株式会社 | Method for detecting defects in multilayer semiconductors etc. |
JP2000216208A (en) | 1999-01-20 | 2000-08-04 | Hitachi Ltd | Method and system for visual inspection and manufacture of semiconductor device |
US6285449B1 (en) * | 1999-06-11 | 2001-09-04 | University Of Chicago | Optical method and apparatus for detection of defects and microstructural changes in ceramics and ceramic coatings |
KR100301067B1 (en) * | 1999-08-23 | 2001-11-01 | 윤종용 | Method for detecting micro scratch and device adopting the same |
DE10083372B4 (en) | 1999-10-14 | 2010-02-04 | Sumitomo Mitsubishi Silicon Corp. | Method for examining the surface of semiconductor wafers |
JP2001208729A (en) | 2000-01-24 | 2001-08-03 | Toshiba Corp | Defect detector |
US6731384B2 (en) | 2000-10-10 | 2004-05-04 | Hitachi, Ltd. | Apparatus for detecting foreign particle and defect and the same method |
JP2002188999A (en) | 2000-12-21 | 2002-07-05 | Hitachi Ltd | Detector and method for detecting foreign matter and defect |
US7109724B2 (en) * | 2002-05-01 | 2006-09-19 | Lehighton Electronics, Inc. | Method and apparatus for nondestructive measurement and mapping of sheet materials |
WO2004031791A2 (en) * | 2002-10-03 | 2004-04-15 | Applied Materials Israel, Ltd. | System and method for defect localization on electrical test structures |
JP2005093968A (en) * | 2003-09-19 | 2005-04-07 | Kazumasa Onishi | Vacuum chuck |
JP4386709B2 (en) | 2003-11-14 | 2009-12-16 | 関西電力株式会社 | Material nondestructive inspection method and apparatus by laser ultrasonic wave |
JP4761427B2 (en) * | 2004-07-02 | 2011-08-31 | 東京エレクトロン株式会社 | Object surface inspection device |
US7684032B1 (en) * | 2005-01-06 | 2010-03-23 | Kla-Tencor Corporation | Multi-wavelength system and method for detecting epitaxial layer defects |
JP4631002B2 (en) * | 2006-06-29 | 2011-02-16 | 独立行政法人産業技術総合研究所 | Method for detecting defects and apparatus therefor |
JP5713264B2 (en) * | 2009-11-20 | 2015-05-07 | 独立行政法人産業技術総合研究所 | Defect inspection method, wafer or semiconductor element quality control method, and defect inspection apparatus |
DE102010026351B4 (en) * | 2010-07-07 | 2012-04-26 | Siltronic Ag | Method and apparatus for inspecting a semiconductor wafer |
-
2008
- 2008-05-22 JP JP2008133809A patent/JP5007979B2/en active Active
-
2009
- 2009-05-22 EP EP09750667.9A patent/EP2287594A4/en not_active Withdrawn
- 2009-05-22 WO PCT/JP2009/059460 patent/WO2009142305A1/en active Application Filing
- 2009-05-22 US US12/993,389 patent/US8599379B2/en not_active Expired - Fee Related
- 2009-05-22 CN CN2009801180032A patent/CN102037348B/en not_active Expired - Fee Related
- 2009-05-22 KR KR1020107025883A patent/KR101240860B1/en not_active IP Right Cessation
-
2011
- 2011-09-20 HK HK11109907.0A patent/HK1155805A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR101240860B1 (en) | 2013-03-07 |
US20110069313A1 (en) | 2011-03-24 |
KR20110000583A (en) | 2011-01-03 |
EP2287594A4 (en) | 2016-01-20 |
EP2287594A1 (en) | 2011-02-23 |
WO2009142305A1 (en) | 2009-11-26 |
CN102037348A (en) | 2011-04-27 |
US8599379B2 (en) | 2013-12-03 |
CN102037348B (en) | 2013-11-06 |
JP2009281846A (en) | 2009-12-03 |
JP5007979B2 (en) | 2012-08-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20170522 |