HK1143023A1 - Compression bonding device, compression bonding method, package and pressurizing plate - Google Patents
Compression bonding device, compression bonding method, package and pressurizing plateInfo
- Publication number
- HK1143023A1 HK1143023A1 HK10109179.2A HK10109179A HK1143023A1 HK 1143023 A1 HK1143023 A1 HK 1143023A1 HK 10109179 A HK10109179 A HK 10109179A HK 1143023 A1 HK1143023 A1 HK 1143023A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- compression bonding
- pressurizing section
- package
- substrate
- pressurizing plate
- Prior art date
Links
Classifications
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- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008206217 | 2008-08-08 | ||
JP2008242946A JP4916494B2 (ja) | 2008-08-08 | 2008-09-22 | 圧着装置、圧着方法、および押圧板 |
PCT/JP2009/001901 WO2010016170A1 (ja) | 2008-08-08 | 2009-04-24 | 圧着装置、圧着方法、実装体および押圧板 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1143023A1 true HK1143023A1 (en) | 2010-12-17 |
Family
ID=41663399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK10109179.2A HK1143023A1 (en) | 2008-08-08 | 2010-09-26 | Compression bonding device, compression bonding method, package and pressurizing plate |
Country Status (8)
Country | Link |
---|---|
US (1) | US8296939B2 (ko) |
EP (1) | EP2309834B1 (ko) |
JP (1) | JP4916494B2 (ko) |
KR (1) | KR20110039510A (ko) |
CN (1) | CN101810067B (ko) |
HK (1) | HK1143023A1 (ko) |
TW (1) | TWI436700B (ko) |
WO (1) | WO2010016170A1 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011109046A (ja) * | 2009-11-20 | 2011-06-02 | Sony Chemical & Information Device Corp | 実装装置および電子モジュールの製造方法 |
JP6041463B2 (ja) * | 2009-12-25 | 2016-12-07 | デクセリアルズ株式会社 | エポキシ樹脂組成物及びそれを用いた接合体の製造方法、並びに接合体 |
DE102010039749A1 (de) * | 2010-08-25 | 2012-03-01 | Robert Bosch Gmbh | Verfahren zur Bestückung einer Leiterplatte mit mehreren Bauteilen und elektrische Schaltung mit einer Leiterplatte und darauf montierten mehreren Bauteilen |
WO2016068165A1 (ja) * | 2014-10-29 | 2016-05-06 | デクセリアルズ株式会社 | 導電材料 |
TWI581942B (zh) | 2015-04-08 | 2017-05-11 | 韋僑科技股份有限公司 | 跨橋裝置與系統及其軟性電路元件跨橋方法 |
TWI681701B (zh) * | 2018-09-03 | 2020-01-01 | 活躍科技股份有限公司 | 節能式壓板機 |
CN109335675B (zh) * | 2018-11-09 | 2024-07-05 | 南京富信节能科技有限公司 | 自动贴球顶机及其工作方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3529117A (en) * | 1969-09-11 | 1970-09-15 | Argus Eng Co | Soldering apparatus |
JPH0690099A (ja) * | 1992-06-09 | 1994-03-29 | Ibiden Co Ltd | 基板支持用治具 |
US5414298A (en) * | 1993-03-26 | 1995-05-09 | Tessera, Inc. | Semiconductor chip assemblies and components with pressure contact |
JPH08146451A (ja) * | 1994-11-16 | 1996-06-07 | Sony Corp | 回路装置の製造装置 |
JPH10150297A (ja) * | 1996-11-18 | 1998-06-02 | Toyo Commun Equip Co Ltd | 電子部品装着用サポート治具 |
JP2002017519A (ja) * | 2000-07-06 | 2002-01-22 | Toyo Tire & Rubber Co Ltd | 均圧マット |
JP2004322490A (ja) * | 2003-04-25 | 2004-11-18 | Konica Minolta Photo Imaging Inc | 積層体の製造方法及び積層体の製造装置 |
JP3921459B2 (ja) * | 2003-07-11 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装方法及び実装装置 |
JP4274126B2 (ja) * | 2005-01-18 | 2009-06-03 | パナソニック株式会社 | 圧着装置および圧着方法 |
JP4841431B2 (ja) * | 2005-02-02 | 2011-12-21 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装装置 |
CN1307699C (zh) * | 2005-03-14 | 2007-03-28 | 西安交通大学 | 基于压接互连技术的电力电子集成模块的制备方法 |
JP4925669B2 (ja) * | 2006-01-13 | 2012-05-09 | ソニーケミカル&インフォメーションデバイス株式会社 | 圧着装置及び実装方法 |
JP4832107B2 (ja) | 2006-02-23 | 2011-12-07 | ソニーケミカル&インフォメーションデバイス株式会社 | 実装方法 |
JP2007294607A (ja) * | 2006-04-24 | 2007-11-08 | Sony Chemical & Information Device Corp | 押圧ヘッド及び押圧装置 |
JP2008206217A (ja) | 2007-02-16 | 2008-09-04 | Yaskawa Electric Corp | 半導体スイッチング素子の寿命監視回路を有する半導体電力変換装置 |
JP2008242946A (ja) | 2007-03-28 | 2008-10-09 | Toshiba Corp | 電子機器およびキー押下判定方法 |
-
2008
- 2008-09-22 JP JP2008242946A patent/JP4916494B2/ja not_active Expired - Fee Related
-
2009
- 2009-04-24 CN CN2009800004033A patent/CN101810067B/zh not_active Expired - Fee Related
- 2009-04-24 WO PCT/JP2009/001901 patent/WO2010016170A1/ja active Application Filing
- 2009-04-24 EP EP09804657.6A patent/EP2309834B1/en not_active Not-in-force
- 2009-04-24 KR KR1020097025760A patent/KR20110039510A/ko not_active Application Discontinuation
- 2009-06-11 TW TW098119562A patent/TWI436700B/zh not_active IP Right Cessation
- 2009-12-10 US US12/635,651 patent/US8296939B2/en not_active Expired - Fee Related
-
2010
- 2010-09-26 HK HK10109179.2A patent/HK1143023A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2309834B1 (en) | 2015-02-25 |
CN101810067A (zh) | 2010-08-18 |
EP2309834A4 (en) | 2011-09-14 |
CN101810067B (zh) | 2013-07-10 |
WO2010016170A1 (ja) | 2010-02-11 |
KR20110039510A (ko) | 2011-04-19 |
TWI436700B (zh) | 2014-05-01 |
US20100085723A1 (en) | 2010-04-08 |
US8296939B2 (en) | 2012-10-30 |
JP2010062504A (ja) | 2010-03-18 |
EP2309834A1 (en) | 2011-04-13 |
TW201018329A (en) | 2010-05-01 |
JP4916494B2 (ja) | 2012-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20170424 |