HK1113232A1 - Light emitting diode chip design and fabrication - Google Patents
Light emitting diode chip design and fabricationInfo
- Publication number
- HK1113232A1 HK1113232A1 HK08108256.4A HK08108256A HK1113232A1 HK 1113232 A1 HK1113232 A1 HK 1113232A1 HK 08108256 A HK08108256 A HK 08108256A HK 1113232 A1 HK1113232 A1 HK 1113232A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- fabrication
- light emitting
- emitting diode
- diode chip
- chip design
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006101406291A CN101154697B (zh) | 2006-09-30 | 2006-09-30 | 发光二极管芯片及其制造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1113232A1 true HK1113232A1 (en) | 2008-09-26 |
Family
ID=39256222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK08108256.4A HK1113232A1 (en) | 2006-09-30 | 2008-07-25 | Light emitting diode chip design and fabrication |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101154697B (zh) |
| HK (1) | HK1113232A1 (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064164B (zh) * | 2010-10-28 | 2012-03-21 | 山东华光光电子有限公司 | 倒装功率led管芯自由组合灯芯 |
| CN103066181B (zh) * | 2012-12-28 | 2016-03-09 | 北京半导体照明科技促进中心 | Led芯片及制造方法 |
| CN106159057B (zh) * | 2015-04-01 | 2018-08-28 | 映瑞光电科技(上海)有限公司 | Led芯片及其制作方法 |
| CN109860367B (zh) * | 2019-02-03 | 2020-04-21 | 泉州三安半导体科技有限公司 | 发光装置 |
| US11978839B2 (en) | 2019-02-03 | 2024-05-07 | Quanzhou Sanan Semiconductor Technology Co., Ltd. | Light-emitting device |
| CN114613827A (zh) * | 2022-03-14 | 2022-06-10 | 苏州清越光电科技股份有限公司 | 一种显示面板及其显示装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6693352B1 (en) * | 2000-06-05 | 2004-02-17 | Emitronix Inc. | Contact structure for group III-V semiconductor devices and method of producing the same |
| KR100586949B1 (ko) * | 2004-01-19 | 2006-06-07 | 삼성전기주식회사 | 플립칩용 질화물 반도체 발광소자 |
| US7045375B1 (en) * | 2005-01-14 | 2006-05-16 | Au Optronics Corporation | White light emitting device and method of making same |
| CN1731592A (zh) * | 2005-08-26 | 2006-02-08 | 杭州士兰明芯科技有限公司 | 倒装焊结构发光二极管及其制造方法 |
-
2006
- 2006-09-30 CN CN2006101406291A patent/CN101154697B/zh active Active
-
2008
- 2008-07-25 HK HK08108256.4A patent/HK1113232A1/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN101154697B (zh) | 2013-10-23 |
| CN101154697A (zh) | 2008-04-02 |
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