HK1079036A1 - Method for manufacturing plate stacks, particularly cooler or cooler elements consisting of plate stacks - Google Patents

Method for manufacturing plate stacks, particularly cooler or cooler elements consisting of plate stacks

Info

Publication number
HK1079036A1
HK1079036A1 HK05110339A HK05110339A HK1079036A1 HK 1079036 A1 HK1079036 A1 HK 1079036A1 HK 05110339 A HK05110339 A HK 05110339A HK 05110339 A HK05110339 A HK 05110339A HK 1079036 A1 HK1079036 A1 HK 1079036A1
Authority
HK
Hong Kong
Prior art keywords
cooler
plate stacks
elements consisting
manufacturing
stacks
Prior art date
Application number
HK05110339A
Inventor
Juergen Schulz-Harder
Original Assignee
Electrovac Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electrovac Ag filed Critical Electrovac Ag
Publication of HK1079036A1 publication Critical patent/HK1079036A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0012—Brazing heat exchangers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
HK05110339A 2004-01-12 2005-11-18 Method for manufacturing plate stacks, particularly cooler or cooler elements consisting of plate stacks HK1079036A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004001772 2004-01-12
DE102004002494 2004-01-17
DE102004002841A DE102004002841B3 (en) 2004-01-12 2004-01-19 Process for production of plate-like stack elements, especially of coolers, cooler elements or heat sinks made from such elements useful for cooling high power electrical components or modules

Publications (1)

Publication Number Publication Date
HK1079036A1 true HK1079036A1 (en) 2006-03-24

Family

ID=34424592

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05110339A HK1079036A1 (en) 2004-01-12 2005-11-18 Method for manufacturing plate stacks, particularly cooler or cooler elements consisting of plate stacks

Country Status (3)

Country Link
JP (1) JP2009065206A (en)
DE (2) DE102004002841B3 (en)
HK (1) HK1079036A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8439252B2 (en) 2006-11-07 2013-05-14 Excelitas Technologies Gmbh & Co Kg Method for bonding metal surfaces, method for producing an object having cavities, object having cavities, structure of a light emitting diode
KR20100017260A (en) 2007-04-24 2010-02-16 세람텍 아게 Method for producing a composite including at least one non-flat component
JP5307702B2 (en) * 2009-12-21 2013-10-02 浜松ホトニクス株式会社 heatsink
DE102020104493B4 (en) 2020-02-20 2022-08-04 Rogers Germany Gmbh Method for manufacturing a cooling element and cooling element manufactured with such a method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3630323C1 (en) * 1986-09-05 1987-09-03 Kernforschungsanlage Juelich Gmbh, 5170 Juelich, De
JPH11325763A (en) * 1998-05-18 1999-11-26 Matsushita Electric Ind Co Ltd Lamination type heat-exchanger and manufacture thereof
JP2003100970A (en) * 2001-09-20 2003-04-04 Ntt Advanced Technology Corp Composite heat radiation member

Also Published As

Publication number Publication date
DE502004007661D1 (en) 2008-09-04
DE102004002841B3 (en) 2005-05-04
JP2009065206A (en) 2009-03-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180111