HK1071804A1 - Electronic component and method for forming external electrodes thereof - Google Patents

Electronic component and method for forming external electrodes thereof

Info

Publication number
HK1071804A1
HK1071804A1 HK05104408.3A HK05104408A HK1071804A1 HK 1071804 A1 HK1071804 A1 HK 1071804A1 HK 05104408 A HK05104408 A HK 05104408A HK 1071804 A1 HK1071804 A1 HK 1071804A1
Authority
HK
Hong Kong
Prior art keywords
electronic component
external electrodes
forming external
forming
electrodes
Prior art date
Application number
HK05104408.3A
Inventor
Shoji Ishihara
Kiyoshi Tsuzuki
Yasuyuki Ishii
Original Assignee
Taiyo Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Chemical Industry Co Ltd filed Critical Taiyo Chemical Industry Co Ltd
Publication of HK1071804A1 publication Critical patent/HK1071804A1/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/08—Devices for reducing the polluted area with or without additional devices for removing the material
    • E02B15/0814—Devices for reducing the polluted area with or without additional devices for removing the material with underwater curtains
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/06—Barriers therefor construed for applying processing agents or for collecting pollutants, e.g. absorbent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
    • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
    • B63B22/00—Buoys
    • B63B22/18—Buoys having means to control attitude or position, e.g. reaction surfaces or tether
    • B63B22/20—Ballast means
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02B—HYDRAULIC ENGINEERING
    • E02B15/00—Cleaning or keeping clear the surface of open water; Apparatus therefor
    • E02B15/04—Devices for cleaning or keeping clear the surface of open water from oil or like floating materials by separating or removing these materials
    • E02B15/08—Devices for reducing the polluted area with or without additional devices for removing the material
    • E02B15/085—Details of connectors
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/20—Miscellaneous comprising details of connection between elements
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D2600/00—Miscellaneous
    • E02D2600/30—Miscellaneous comprising anchoring details
    • E—FIXED CONSTRUCTIONS
    • E02—HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
    • E02D—FOUNDATIONS; EXCAVATIONS; EMBANKMENTS; UNDERGROUND OR UNDERWATER STRUCTURES
    • E02D5/00—Bulkheads, piles, or other structural elements specially adapted to foundation engineering
    • E02D5/74—Means for anchoring structural elements or bulkheads
    • E02D5/80—Ground anchors

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
HK05104408.3A 2003-03-11 2005-05-26 Electronic component and method for forming external electrodes thereof HK1071804A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003065062A JP4544825B2 (en) 2003-03-11 2003-03-11 Method for forming external electrode of electronic component

Publications (1)

Publication Number Publication Date
HK1071804A1 true HK1071804A1 (en) 2005-07-29

Family

ID=33126184

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05104408.3A HK1071804A1 (en) 2003-03-11 2005-05-26 Electronic component and method for forming external electrodes thereof

Country Status (5)

Country Link
JP (1) JP4544825B2 (en)
KR (1) KR100937298B1 (en)
CN (1) CN100477031C (en)
HK (1) HK1071804A1 (en)
MY (1) MY139649A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006269829A (en) * 2005-03-24 2006-10-05 Kyocera Corp Ceramic electronic component
JP5899609B2 (en) * 2010-08-06 2016-04-06 株式会社村田製作所 Multilayer ceramic capacitor and manufacturing method thereof
KR20130037485A (en) * 2011-10-06 2013-04-16 삼성전기주식회사 Multilayered ceramic capacitor, and method for manufacturing the same
US10933679B2 (en) * 2017-03-27 2021-03-02 Taiyo Yuden Co., Ltd. Screen printing plate and manufacturing method of electronic component
CN112342584A (en) * 2020-09-29 2021-02-09 扬州市景杨表面工程有限公司 Nonmagnetic copper-tin electroplating process for capacitor device of cardiac pacemaker

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5805409A (en) * 1995-08-18 1998-09-08 Tdk Corporation Multi-layer electronic part having external electrodes that have a thermosetting resin and metal particles
JP3407839B2 (en) * 1995-12-27 2003-05-19 富士通株式会社 Method of forming solder bump for semiconductor device
KR20000003052A (en) 1998-06-25 2000-01-15 이형도 External electrode forming of chip component

Also Published As

Publication number Publication date
KR20040081063A (en) 2004-09-20
JP2004273919A (en) 2004-09-30
JP4544825B2 (en) 2010-09-15
MY139649A (en) 2009-10-30
CN100477031C (en) 2009-04-08
CN1551259A (en) 2004-12-01
KR100937298B1 (en) 2010-01-18

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20130311