HK1069014A1 - Package structure of a led and its package method - Google Patents
Package structure of a led and its package methodInfo
- Publication number
- HK1069014A1 HK1069014A1 HK05101285A HK05101285A HK1069014A1 HK 1069014 A1 HK1069014 A1 HK 1069014A1 HK 05101285 A HK05101285 A HK 05101285A HK 05101285 A HK05101285 A HK 05101285A HK 1069014 A1 HK1069014 A1 HK 1069014A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- package
- led
- package structure
- package method
- Prior art date
Links
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101202727A CN1317775C (zh) | 2003-12-10 | 2003-12-10 | 发光二极管封装结构及其封装方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1069014A1 true HK1069014A1 (en) | 2005-05-06 |
Family
ID=34338291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK05101285A HK1069014A1 (en) | 2003-12-10 | 2005-02-16 | Package structure of a led and its package method |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN1317775C (xx) |
HK (1) | HK1069014A1 (xx) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8999736B2 (en) | 2003-07-04 | 2015-04-07 | Epistar Corporation | Optoelectronic system |
US7915085B2 (en) | 2003-09-18 | 2011-03-29 | Cree, Inc. | Molded chip fabrication method |
US8425271B2 (en) * | 2006-09-01 | 2013-04-23 | Cree, Inc. | Phosphor position in light emitting diodes |
US9159888B2 (en) | 2007-01-22 | 2015-10-13 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US9024349B2 (en) | 2007-01-22 | 2015-05-05 | Cree, Inc. | Wafer level phosphor coating method and devices fabricated utilizing method |
US9041285B2 (en) | 2007-12-14 | 2015-05-26 | Cree, Inc. | Phosphor distribution in LED lamps using centrifugal force |
US8878219B2 (en) | 2008-01-11 | 2014-11-04 | Cree, Inc. | Flip-chip phosphor coating method and devices fabricated utilizing method |
EP2333854B1 (en) | 2009-12-09 | 2018-02-07 | Samsung Electronics Co., Ltd. | Light emitting diode |
CN102237475A (zh) * | 2010-05-04 | 2011-11-09 | 李长会 | 基于有机胶体的led晶片级荧光粉涂层技术 |
US20110309393A1 (en) * | 2010-06-21 | 2011-12-22 | Micron Technology, Inc. | Packaged leds with phosphor films, and associated systems and methods |
US10546846B2 (en) | 2010-07-23 | 2020-01-28 | Cree, Inc. | Light transmission control for masking appearance of solid state light sources |
EP2447595B1 (en) * | 2010-10-27 | 2017-08-02 | LG Innotek Co., Ltd. | Light emitting module |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6642652B2 (en) * | 2001-06-11 | 2003-11-04 | Lumileds Lighting U.S., Llc | Phosphor-converted light emitting device |
TW563261B (en) * | 2002-06-07 | 2003-11-21 | Solidlite Corp | A method and of manufacture for tri-color white LED |
-
2003
- 2003-12-10 CN CNB2003101202727A patent/CN1317775C/zh not_active Expired - Fee Related
-
2005
- 2005-02-16 HK HK05101285A patent/HK1069014A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1547265A (zh) | 2004-11-17 |
CN1317775C (zh) | 2007-05-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20121210 |