HK1069014A1 - Package structure of a led and its package method - Google Patents

Package structure of a led and its package method

Info

Publication number
HK1069014A1
HK1069014A1 HK05101285A HK05101285A HK1069014A1 HK 1069014 A1 HK1069014 A1 HK 1069014A1 HK 05101285 A HK05101285 A HK 05101285A HK 05101285 A HK05101285 A HK 05101285A HK 1069014 A1 HK1069014 A1 HK 1069014A1
Authority
HK
Hong Kong
Prior art keywords
package
led
package structure
package method
Prior art date
Application number
HK05101285A
Other languages
English (en)
Inventor
Jung-Kan Lin
Original Assignee
Topson Optoelectronics Semi Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Topson Optoelectronics Semi Co filed Critical Topson Optoelectronics Semi Co
Publication of HK1069014A1 publication Critical patent/HK1069014A1/xx

Links

HK05101285A 2003-12-10 2005-02-16 Package structure of a led and its package method HK1069014A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2003101202727A CN1317775C (zh) 2003-12-10 2003-12-10 发光二极管封装结构及其封装方法

Publications (1)

Publication Number Publication Date
HK1069014A1 true HK1069014A1 (en) 2005-05-06

Family

ID=34338291

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05101285A HK1069014A1 (en) 2003-12-10 2005-02-16 Package structure of a led and its package method

Country Status (2)

Country Link
CN (1) CN1317775C (xx)
HK (1) HK1069014A1 (xx)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8999736B2 (en) 2003-07-04 2015-04-07 Epistar Corporation Optoelectronic system
US7915085B2 (en) 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
US8425271B2 (en) * 2006-09-01 2013-04-23 Cree, Inc. Phosphor position in light emitting diodes
US9159888B2 (en) 2007-01-22 2015-10-13 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9041285B2 (en) 2007-12-14 2015-05-26 Cree, Inc. Phosphor distribution in LED lamps using centrifugal force
US8878219B2 (en) 2008-01-11 2014-11-04 Cree, Inc. Flip-chip phosphor coating method and devices fabricated utilizing method
EP2333854B1 (en) 2009-12-09 2018-02-07 Samsung Electronics Co., Ltd. Light emitting diode
CN102237475A (zh) * 2010-05-04 2011-11-09 李长会 基于有机胶体的led晶片级荧光粉涂层技术
US20110309393A1 (en) * 2010-06-21 2011-12-22 Micron Technology, Inc. Packaged leds with phosphor films, and associated systems and methods
US10546846B2 (en) 2010-07-23 2020-01-28 Cree, Inc. Light transmission control for masking appearance of solid state light sources
EP2447595B1 (en) * 2010-10-27 2017-08-02 LG Innotek Co., Ltd. Light emitting module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6642652B2 (en) * 2001-06-11 2003-11-04 Lumileds Lighting U.S., Llc Phosphor-converted light emitting device
TW563261B (en) * 2002-06-07 2003-11-21 Solidlite Corp A method and of manufacture for tri-color white LED

Also Published As

Publication number Publication date
CN1547265A (zh) 2004-11-17
CN1317775C (zh) 2007-05-23

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20121210