HK1062926A1 - Regeneration method for a plating solution. - Google Patents
Regeneration method for a plating solution.Info
- Publication number
- HK1062926A1 HK1062926A1 HK04105703A HK04105703A HK1062926A1 HK 1062926 A1 HK1062926 A1 HK 1062926A1 HK 04105703 A HK04105703 A HK 04105703A HK 04105703 A HK04105703 A HK 04105703A HK 1062926 A1 HK1062926 A1 HK 1062926A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- tin
- ions
- solution
- regeneration
- plating solution
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10132478A DE10132478C1 (de) | 2001-07-03 | 2001-07-03 | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
PCT/EP2002/006654 WO2003004725A2 (fr) | 2001-07-03 | 2002-06-17 | Procede de regeneration pour solution de placage |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1062926A1 true HK1062926A1 (en) | 2004-12-03 |
Family
ID=7690626
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04105703A HK1062926A1 (en) | 2001-07-03 | 2004-08-03 | Regeneration method for a plating solution. |
Country Status (16)
Country | Link |
---|---|
US (1) | US20040245108A1 (fr) |
EP (1) | EP1427869B1 (fr) |
JP (1) | JP4157838B2 (fr) |
KR (1) | KR100827259B1 (fr) |
CN (1) | CN1232677C (fr) |
AT (1) | ATE289633T1 (fr) |
AU (1) | AU2002321069A1 (fr) |
BR (1) | BR0210829B1 (fr) |
CA (1) | CA2450258A1 (fr) |
DE (2) | DE10132478C1 (fr) |
ES (1) | ES2236552T3 (fr) |
HK (1) | HK1062926A1 (fr) |
MX (1) | MXPA03011772A (fr) |
MY (1) | MY130423A (fr) |
TW (1) | TWI279456B (fr) |
WO (1) | WO2003004725A2 (fr) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005011312A2 (fr) | 2003-07-16 | 2005-02-03 | Interdigital Technology Corporation | Procede et systeme de transfert d'informations entre des entites de gestion de reseau d'un systeme de communication sans fil |
EP1630252A1 (fr) * | 2004-08-27 | 2006-03-01 | ATOTECH Deutschland GmbH | Procédé de dépot d'etain ou d'alliages d'etain sur des substrats contenant de l'antimoine |
JP4998704B2 (ja) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | 置換錫合金めっき皮膜の形成方法、置換錫合金めっき浴及びめっき性能の維持方法 |
EP2298960A1 (fr) | 2009-08-24 | 2011-03-23 | ATOTECH Deutschland GmbH | Procédé de placage anélectrolytique pour l'étain et les alliages d'étain |
DE102009060676B4 (de) | 2009-12-28 | 2015-07-23 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum nasschemischen Behandeln von Behandlungsgut |
CN102586851B (zh) * | 2011-01-06 | 2015-03-04 | 宝山钢铁股份有限公司 | 一种缓解并减少镀锡溶液产生锡泥的电解方法 |
EP2671968B1 (fr) * | 2012-06-05 | 2014-11-26 | ATOTECH Deutschland GmbH | Procédé et appareil de régénération pour régénérer un composition de placage |
CN106811773B (zh) * | 2015-05-12 | 2018-06-08 | 江苏理工学院 | 一种超临界复合电铸体系回收利用装置 |
CN106011810B (zh) * | 2016-06-02 | 2019-01-11 | 东莞市智源电子科技有限公司 | 铜基材的化学锡镀液中四价锡的去除工艺 |
MY192687A (en) * | 2016-10-24 | 2022-09-01 | Atotech Deutschland Gmbh | A method of depositing a tin layer on a metal substrate and a use of a structure comprising a nickel/phosphorous alloy underlayer and said tin layer with said method |
CN110387540A (zh) * | 2019-08-30 | 2019-10-29 | 江苏上达电子有限公司 | 一种化锡槽内二价锡的补充***及方法 |
CN111676470A (zh) * | 2020-05-29 | 2020-09-18 | 广东天承科技有限公司 | 一种简易可溶性的高价锡的还原方法 |
CN114232030B (zh) * | 2021-12-23 | 2023-04-18 | 广东鑫菱环境科技有限公司 | 一种pcb甲基磺酸退锡废液循环再生方法 |
WO2024116456A1 (fr) * | 2022-11-28 | 2024-06-06 | 株式会社村田製作所 | Procédé et dispositif de régénération de composition de placage |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1527576A (en) * | 1923-02-19 | 1925-02-24 | Wheeling Steel & Iron Company | Process of coating conducting materials with tin |
US3784455A (en) * | 1971-12-28 | 1974-01-08 | Western Electric Co | Methods of electrolytic regenerative etching and metal recovery |
DE2401719B2 (de) * | 1974-01-15 | 1978-01-19 | Vereinigte Aluminium Werke Ag, 5300 Bonn | Verfahren zur regenerierung und standzeiterhoehung von zinnhaltigen metallsalzloesungen, die zur elektrolytischen faerbung von anodisiertem aluminium unter einwirkung von wechselstrom eingesetzt werden |
JPS5226315A (en) * | 1975-08-25 | 1977-02-26 | Fuji Photo Film Co Ltd | Process for the recovery of silver from fixer |
DE2742718C2 (de) * | 1977-09-22 | 1984-04-19 | ESTEL HOOGOVENS B.V., 1970 Ijmuiden | Verfahren und Vorrichtung zur Regenerierung eines Verzinnungselektrolyten |
US4432844A (en) * | 1982-01-28 | 1984-02-21 | Fujisash Company | Process for regeneration of electrolyte containing tin salts by reducing the same |
US4715894A (en) * | 1985-08-29 | 1987-12-29 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
DE3634710A1 (de) * | 1986-10-11 | 1988-04-21 | Ver Glaswerke Gmbh | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
CA2083196C (fr) * | 1991-11-27 | 1998-02-17 | Randal D. King | Procede pour prolonger la duree de vie d'un bain de galvanoplastie par jet mobile |
JPH06256999A (ja) * | 1993-03-05 | 1994-09-13 | Kawasaki Steel Corp | 錫めっき液を回収再生する方法 |
US6280596B1 (en) * | 1995-05-23 | 2001-08-28 | Weirton Steel Corporation | Electrolytic tinplating of steel substrate and apparatus |
US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
DE19719020A1 (de) * | 1997-05-07 | 1998-11-12 | Km Europa Metal Ag | Verfahren und Vorrichtung zum Regenerieren von Verzinnungslösungen |
US6251255B1 (en) * | 1998-12-22 | 2001-06-26 | Precision Process Equipment, Inc. | Apparatus and method for electroplating tin with insoluble anodes |
JP3455709B2 (ja) * | 1999-04-06 | 2003-10-14 | 株式会社大和化成研究所 | めっき方法とそれに用いるめっき液前駆体 |
-
2001
- 2001-07-03 DE DE10132478A patent/DE10132478C1/de not_active Expired - Fee Related
-
2002
- 2002-06-17 MX MXPA03011772A patent/MXPA03011772A/es active IP Right Grant
- 2002-06-17 US US10/494,217 patent/US20040245108A1/en not_active Abandoned
- 2002-06-17 CN CNB028135822A patent/CN1232677C/zh not_active Expired - Lifetime
- 2002-06-17 EP EP02754692A patent/EP1427869B1/fr not_active Expired - Lifetime
- 2002-06-17 ES ES02754692T patent/ES2236552T3/es not_active Expired - Lifetime
- 2002-06-17 DE DE60203050T patent/DE60203050T2/de not_active Expired - Lifetime
- 2002-06-17 BR BRPI0210829-1A patent/BR0210829B1/pt not_active IP Right Cessation
- 2002-06-17 KR KR1020037017284A patent/KR100827259B1/ko active IP Right Grant
- 2002-06-17 AU AU2002321069A patent/AU2002321069A1/en not_active Abandoned
- 2002-06-17 AT AT02754692T patent/ATE289633T1/de active
- 2002-06-17 JP JP2003510478A patent/JP4157838B2/ja not_active Expired - Lifetime
- 2002-06-17 CA CA002450258A patent/CA2450258A1/fr not_active Abandoned
- 2002-06-17 WO PCT/EP2002/006654 patent/WO2003004725A2/fr active IP Right Grant
- 2002-06-21 TW TW091113655A patent/TWI279456B/zh not_active IP Right Cessation
- 2002-06-26 MY MYPI20022395A patent/MY130423A/en unknown
-
2004
- 2004-08-03 HK HK04105703A patent/HK1062926A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
MXPA03011772A (es) | 2004-04-02 |
BR0210829A (pt) | 2005-05-03 |
EP1427869A2 (fr) | 2004-06-16 |
CN1232677C (zh) | 2005-12-21 |
AU2002321069A1 (en) | 2003-01-21 |
CA2450258A1 (fr) | 2003-01-16 |
WO2003004725A3 (fr) | 2004-04-15 |
TWI279456B (en) | 2007-04-21 |
DE60203050D1 (de) | 2005-03-31 |
KR20040030725A (ko) | 2004-04-09 |
US20040245108A1 (en) | 2004-12-09 |
DE10132478C1 (de) | 2003-04-30 |
JP4157838B2 (ja) | 2008-10-01 |
EP1427869B1 (fr) | 2005-02-23 |
JP2004534151A (ja) | 2004-11-11 |
DE60203050T2 (de) | 2006-02-23 |
MY130423A (en) | 2007-06-29 |
BR0210829B1 (pt) | 2011-07-26 |
ES2236552T3 (es) | 2005-07-16 |
KR100827259B1 (ko) | 2008-05-07 |
WO2003004725A2 (fr) | 2003-01-16 |
CN1524132A (zh) | 2004-08-25 |
ATE289633T1 (de) | 2005-03-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1062926A1 (en) | Regeneration method for a plating solution. | |
JP3455709B2 (ja) | めっき方法とそれに用いるめっき液前駆体 | |
AU724854B2 (en) | A process and device for regenerating tinning solutions | |
JP2003503598A5 (fr) | ||
HK1039683B (zh) | 在集成電路的製造中電化學形成高純度銅導體的方法 | |
Ohkawa et al. | Electrochemical reduction of carbon dioxide on hydrogen-storing materials: Part 3. The effect of the absorption of hydrogen on the palladium electrodes modified with copper | |
CN100413999C (zh) | 再生用于蚀刻或酸蚀铜或铜合金的含铁蚀刻溶液的方法和进行所述方法的装置 | |
WO1999015714A3 (fr) | Procede d'electrodeposition | |
TWI264481B (en) | Copper electroplating method using insoluble anode | |
DE69942669D1 (de) | Submikrone metallisierung unter verwendung elektrochemischer beschichtung | |
KR100516484B1 (ko) | 다수의 전원장치를 구비하는 도금장치 및 그를 이용한도금방법 | |
JPH05320926A (ja) | 無電解めっき液の再生方法 | |
CN109280908B (zh) | 一种化学置换含有杂质镍、铜的镀金溶液的连续纯化*** | |
NL8401542A (nl) | Inrichting voor de elektrolytische behandeling van een metalen strook. | |
JPH0699178A (ja) | 化学メッキ廃液の電解処理方法 | |
FR2680523A1 (fr) | Procede d'electrodeposition. | |
CN112251753A (zh) | 一种印刷线路板酸性蚀刻废液电解再生方法 | |
JP2529557B2 (ja) | 鉛合金製不溶性陽極 | |
JPH0419310B2 (fr) | ||
MX2009000488A (es) | Mejoras en la produccion de capacitor electrolitico. | |
Kakareka et al. | Peculiarities of electroless deposition of Ni-WP alloy on aluminum | |
JP2003183858A (ja) | エッチング廃液の再生方法及び装置 | |
TH21846B (th) | วิธีการรีเจนเนอเรชันสำหรับสารละลายชุบ | |
TH61686A (th) | วิธีการรีเจนเนอเรชันสำหรับสารละลายชุบ | |
EP4219801A1 (fr) | Système d'anode à membrane pour dépôt électrolytique d'alliage zinc-nickel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20150617 |